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Page 2579
Low cost solar cell based on graphene and perovskite delivers an efficiency of 15.6 percent
Low cost solar cell based on graphene and perovskite delivers an efficiency of 15.6 percent
Technology News |
The Group of Photovoltaic and Optoelectronic Devices (DFO) at the Universitat Jaume I in Castelló, Spain together with researchers from…
LED street light installations to grow by 400% in next five years forecasts Strategies Unlimited
LED street light installations to grow by 400% in next five years forecasts Strategies Unlimited
Market news |
Strategies Unlimited forecasts the global outdoor LED lighting market will reach $1.9 billion by 2017.
4G LTE modules with UMTS/HSPA+ and GSM/EDGE, GPRS fallback
4G LTE modules with UMTS/HSPA+ and GSM/EDGE, GPRS fallback
New Products |
The TOBY-L2 and MPCI-L2 modem series from u-blox are ultra-compact LTE modules with UMTS/HSPA+ and GSM/EDGE, GPRS fallback. Supporting LTE…
Low-power 14-bit A/D converters for multi-channel data acquisition
Low-power 14-bit A/D converters for multi-channel data acquisition
New Products |
8- and 16-channel A/D converters address space constraints in industrial, medical and communications designs.

LED chips production value of Chinese companies forecast to reach USD1182m in 2014
LED chips production value of Chinese companies forecast to reach USD1182m in 2014
Market news |
Total LED chip revenues of mainland Chinese companies reached $992 million in 2103, with a year-on-year growth of 17% according to market research anlayst TrendForce's Green Energy Division LEDinside. The…
Project IMAGE yields printable transparent and flexible electrodes for OLEDs and solar cells
Project IMAGE yields printable transparent and flexible electrodes for OLEDs and solar cells
Technology News |
Reaching completion after 3 years of research, the project IMAGE (innovation printable electrode materials for high performance lighting devices and organic solar cells “IMAGE”) has yielded novel transparent electrodes, arranged…
Exar enters power module market with industry’s lowest profile high density power modules
Exar enters power module market with industry’s lowest profile high density power modules
New Products |
Exar Corporation has introduced the XRP9710 and XRP9711 multi-output, synchronous step-down, programmable power modules that offer the industry’s highest power density and lowest profile at 2.75 mm with 5 V-22…
Panoramic throwball camera largely outperforms initial crowd funding goal
Panoramic throwball camera largely outperforms initial crowd funding goal
Technology News |
Showcased at CES 2014 in Las Vegas, the panoramic ball camera concept, Panono received great public feedback and the Berlin startup successfully completed its crowd funding campaign, collecting more than…
LUXeXceL Group raises several million Euros to fund 3D printing of lenses and optical devices
LUXeXceL Group raises several million Euros to fund 3D printing of lenses and optical devices
Business news |
LUXeXceL Group, the inventor of the Printoptical Technology - a 3D printing process to prototype and manufacture lenses and optical products - closed a growth financing round with investment from…
UK IC design house helps Chinese MEMS startup
UK IC design house helps Chinese MEMS startup
Business news |
IC design services company Sondrel Ltd. (Theale, England) has helped MEMS sensor startup QST Corp. Ltd. (Shanghai, China), by developing a mixed-signal signal conditioning ASIC.
Exar acquires configurable processor pioneer to move into digital security
Exar acquires configurable processor pioneer to move into digital security
Business news |
Analog and mixed signal chip designer Exar has acquired fabless chip designer Stretch, one of the pioneers of configurable processors that has made its niche in the video surveillance market.
Spectrum analyser offers record bandwidth
Spectrum analyser offers record bandwidth
New Products |
Rohde & Schwarz offers a new hardware option for its FSW signal and spectrum analyser product family. The FSW-B500 hardware widens the bandwidth of the instruments to 500 MHz, up…
Revolutionary low cost micro thermal imaging core at heart of iPhone case
Revolutionary low cost micro thermal imaging core at heart of iPhone case
Technology News |
FLIR Systems has developed a thermal imaging camera core using wafer level lenses and sensors that is small enough to be integrated into the case of an iPhone.
New AMD CPUs aim for UltraHD screens
New AMD CPUs aim for UltraHD screens
New Products |
The latest A-Series Accelerated Processing Units (APUs) from AMD are adding new graphic cores to support UltraHD 4K resolution screens.
35-A DC-DC converter module powers FPGA and embedded applications
35-A DC-DC converter module powers FPGA and embedded applications
New Products |
Murata has introduced the OKLP-X/35-W12-C, a 35 A Power Block DC-DC converter module solution for FPGA and embedded applications.
Vicor unveils Converter housed in Package power modules for high voltage DC distribution
Vicor unveils Converter housed in Package power modules for high voltage DC distribution
New Products |
Vicor Corporation has unveiled the first module utilizing the company's Converter housed in Package (ChiP) power component platform which claims to deliver 4x the density of competing solutions.
PoL micromodule regulatordelivers 16A to FPGAs and ASICs
PoL micromodule regulatordelivers 16A to FPGAs and ASICs
Feature articles |
Linear Technology has released a quad output step-down micromodule regulator configurable as a single (16A), dual (12A, 4A or 8A, 8A), triple (8A, 4A, 4A) or quad (4A each) output…
Rugged USB data displays are water resistant
Rugged USB data displays are water resistant
New Products |
Equipment located in public spaces needs to be hardened against rough use, abuse and vandalism. To survive, control panels and exposed components must be engineered to resist damage from the…
NXP and Digi-Key co-operate on production-volume supplies
NXP and Digi-Key co-operate on production-volume supplies
New Products |
Joining Digi-Key's Hybrid Distribution Model, NXP is using the channel to support supply of production quantities of its semiconductor devices, in addition to development levels. Digi-Key has previously announced its…
Half-mm-thick diplexers for mobile designs
Half-mm-thick diplexers for mobile designs
New Products |
AVX says it has the lowest-profile 0603 and 0805 MLO diplexers available: at under 0.55mm in height and exhibiting low insertion losses, low parasitics, and efficient heat dissipation, these diplexers…
Design house speeds Chinese start-up’s implementation of mixed signal chip
Design house speeds Chinese start-up’s implementation of mixed signal chip
Feature articles |
Sondrel, system-to-silicon IC design consultancy, has worked with QST Corporation, a start-up semiconductor company in China focusing on MEMS and other sensor products. Founded in early 2012, QST engaged Sondrel…
Serialised memory interface gains momentum
Serialised memory interface gains momentum
Feature articles |
In the race to provide tomorrow’s high-speed network infrastructure to support exploding demand for the Internet, there is one critical area that requires an innovative approach to the architecture –…
ARM and UMC expand scope of IP offerings for advanced SoC designs
ARM and UMC expand scope of IP offerings for advanced SoC designs
Feature articles |
ARM and UMC are now to jointly offer the ARM Artisan physical IP platform along with POP IP for UMC’s 28nm high-performance low-power (HLP) process technology, for customers in a…
Fully-integrated, programmable DC regulators in under-3-mm profile
Fully-integrated, programmable DC regulators in under-3-mm profile
Feature articles |
Exar's XRP9710 and XRP9711 are multi-output, synchronous step-down, programmable power modules that claim highest power density and lowest profile at 2.75mm with 5V-22V inputs. Both devices provide two fully integrated…
Active integration panel reduces cost of base station connections to DAS
Active integration panel reduces cost of base station connections to DAS
New Products |
TE Connectivity’s FlexWave Active Integration Panel (AIP) has been designed to provide multi-carrier, multi-protocol connectivity between mobile operator base stations (BTS) and distributed antenna systems (DAS).
Low PIM distributed antenna system targets indoor applications
Low PIM distributed antenna system targets indoor applications
New Products |
Pulse Electronics has released three new low passive inter-modulation (PIM) distributed antenna system (DAS) in-building, ceiling mount omni-antennas.
Continental, HERE push connected car towards the ‘electronic horizon’
Continental, HERE push connected car towards the ‘electronic horizon’
Technology News |
Automotive supplier Continental and map services provider HERE will collaborate to make the connected car a reality. The developments will focus on the 'electronic horizon', future functionality for automated driving…
650V, dual silicon carbide diodes reduce EMI
650V, dual silicon carbide diodes reduce EMI
New Products |
Dual-configuration Schottky silicon-carbide (SiC) diodes are, makers ST say, the first such devices with a voltage rating of 650V per diode in a choice of common-cathode or series configurations allowing…


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