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Page 2576
Thermocompression bonding: an approach for narrow-pitch die-to-die and die-to-wafer 3D stacking
Thermocompression bonding: an approach for narrow-pitch die-to-die and die-to-wafer 3D stacking
Technology News |
imec and Besi announced their cooperation on the development of a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding…
Dialog collaborates with Qualcomm to achieve higher efficiency rapid smartphone charging
Dialog collaborates with Qualcomm to achieve higher efficiency rapid smartphone charging
Technology News |
Dialog Semiconductor plc has unveiled the company's high efficiency AC/DC adapter interface IC for Qualcomm Quick Charge 2.0 power supplies.
High power filter open frame modules rated up to 400kW at 50Hz
High power filter open frame modules rated up to 400kW at 50Hz
New Products |
Schaffner’s passive harmonic filters ECOsine are now also available as open frame modules with extended power rating up to 400kW/50Hz…
Google developing smart contact lens for diabetics
Google developing smart contact lens for diabetics
Technology News |
Google is testing a contact lens that can help sufferers of diabetes manage their blood sugar levels. The lens has…

TCP becomes licensee for Philips LED luminaire and retrofit bulb licensing program
TCP becomes licensee for Philips LED luminaire and retrofit bulb licensing program
Business news |
Philips has entered into a patent license agreement with TCP International Holdings LTD which will provide TCP and its affiliates with full, worldwide access to the Philips’ LED-related patented technologies.
UCL joins research consortium to promote adoption of solid-state lighting in European cities
UCL joins research consortium to promote adoption of solid-state lighting in European cities
Technology News |
London-based UCL's has won a share of a £4.6m grant funded by the European Commission to promote adoption of solid-state lighting (SSL) in European cities.
Continental sees new challenges for automotive HMIs
Continental sees new challenges for automotive HMIs
Technology News |
In the design of future-proof HMI concepts, automotive supplier Continental aspires to a holistic, integrated approach. "Car drivers should be able to intuitively comprehend what they need to know. It…
How much power from MEMS windmills?
How much power from MEMS windmills?
Technology News |
A University of Texas Arlington research team has enjoyed considerable publicity for its development of a MEMS windmill that the developers have said could, when produced in array, provide energy…
Tektronix strengthens high-speed data analysis capabilities with Picosecond Pulse Labs acquisition
Tektronix strengthens high-speed data analysis capabilities with Picosecond Pulse Labs acquisition
Business news |
With the acquisition of Picosecond Pulse Labs, Tektronix round off its technology portfolio in the segment of high-bandwidth, high-speed data analysis. Typical customers of such instruments are manufacturers and users…
Tektronix strengthens high-speed data analysis capabilities with takeover
Tektronix strengthens high-speed data analysis capabilities with takeover
Business news |
With the acquisition of Picosecond Pulse Labs, Tektronix round off its technology portfolio in the segment of high-bandwidth, high-speed data analysis. Typical customers of such instruments are manufacturers and users…
JTAG/Boundary Scan – a Method to Eliminate Access Problems in Electronic Assembly Development
JTAG/Boundary Scan – a Method to Eliminate Access Problems in Electronic Assembly Development
Technology News |
JTAG/Boundary Scan has become an increasingly valuable application, in particular in the development departments of small and large companies. On the one hand this is due to the enormous potential…
Improved Autosar code development path from Simulink to C
Improved Autosar code development path from Simulink to C
Feature articles |
Release 3.5 of dSpace's TargetLink software tool increases transparency in model development through modelling with enum data types. The series software generator supports Simulink enumeration data types ("enums") for better…
Further gains in MOSFET resistance with asymmetric dual TrenchFET structures
Further gains in MOSFET resistance with asymmetric dual TrenchFET structures
Feature articles |
Vishay Intertechnology has introduced a 30 V asymmetric dual TrenchFET power MOSFET in the PowerPAIR 3 x 3 mm package usingTrenchFET Gen IV technology.
Distributor offers starter kit for TI AM335x-based nanoRISC (ARM) modules
Distributor offers starter kit for TI AM335x-based nanoRISC (ARM) modules
New Products |
The MSC NANORISC-SK-MB2 starter kit from MSC Vertriebs GmbH consists of the MSC nanoRISC-MB2 baseboard with a power supply, a 7-in. WVGA TFT display and a 7-in. PCT touch panel.
802.11ac, Bluetooth 4.0 LE and NFC features combined in one module
802.11ac, Bluetooth 4.0 LE and NFC features combined in one module
New Products |
Lesswire's WiBear 11ac embedded wireless module hosts WLAN according to IEEE 802.11 ac, Bluetooth 4.0 Low Energy, and 2.1 + EDR, as well as Near-Field-Communication (NFC), in a single module.
Industrial automation Gigabit cabling for PROFINET
Industrial automation Gigabit cabling for PROFINET
New Products |
Harting has introduced a range of Gigabit cabling components designed to extend the scope of industrial PROFINET applications into the Gigabit Ethernet range.
Lower-power series of basic logic functions
Lower-power series of basic logic functions
New Products |
Diodes Inc. has a family of dual gate, advanced, ultra-low power CMOS logic devices for low voltage, low energy operation; the 74AUP2G family can help extend battery cell lifetime.
Software tool sets up scopes for DDR debugging
Software tool sets up scopes for DDR debugging
New Products |
Agilent has a debugging tool that helps DDR memory designers perform precompliance tests, discover the root cause of compliance failures, and maximise design margins. The DDR3 and LPDDR3 debug tool…
Arduino-compatible module links to Bluetooth LE devices
Arduino-compatible module links to Bluetooth LE devices
Feature articles |
Available from distributor Rutronik, the RFduino is the smallest stand-alone computer with integrated Bluetooth Low Energy, AD-converter and GPIOs: it is based on the nRF51822 Bluetooth system-chip from Nordic Semiconductor.
Serial link aggregators support data rates up to 10 Gbps
Serial link aggregators support data rates up to 10 Gbps
Feature articles |
Texas Instruments has introduced a pair of 10-Gbps serial link aggregator ICs that it says will reduce cable interconnect costs, power consumption and development time for serial link-based systems.
R-Pi NFC expansion board supports industrial and commercial product development
R-Pi NFC expansion board supports industrial and commercial product development
Feature articles |
From distributor Farnell element14, the EXPLORE-NFC expansion board implements external user interfaces for industrial and consumer devices that meets NFC compliance with Reader mode, P2P mode and Card Emulation standards.
Added CAN/USB connections mark out ARM Cortex-M0 MCUs from STMicro
Added CAN/USB connections mark out ARM Cortex-M0 MCUs from STMicro
Feature articles |
For energy-constrained, connectivity-oriented applications, ST's STM32F072 and STM32F042 MCUs introduce a unique combination of CAN and USB support, low-voltage I/Os and wide analogue voltage range for high efficiency and precision…
Controller handles currents up to 300A by adding regulation phases
Controller handles currents up to 300A by adding regulation phases
Feature articles |
LTC3874 is a dual phase synchronous step-down slave controller that generates currents up to 300A, when paired with a companion master controller, by extending the phase count in multiphase applications.
Tektronix acquires high-speed analogue measurement specialist Picosecond Pulse Labs
Tektronix acquires high-speed analogue measurement specialist Picosecond Pulse Labs
Feature articles |
Tektronix has announced that it has bought Picosecond Pulse Labs, a move that Tek says will strengthen its portfolio in the growing market for test equipment to support 100G/400G optical…
Plessey orders laser dicing system from ALSI to produce GaN-on-Silicon LEDs
Plessey orders laser dicing system from ALSI to produce GaN-on-Silicon LEDs
Technology News |
Advanced Laser Separation International (ALSI) NV has received an order for a laser dicing system from Plessey Semiconductors Ltd to equip the company's UK based LED manufacturing facility.
Faster from Simulink to C code
Faster from Simulink to C code
New Products |
More transparency in model development through modelling with enum data types - this is how users can benefit from dSpace's latest TargetLink release 3.5. The series software generator supports Simulink…
FIPS-certified security comes to enterprise applications in smartphones
FIPS-certified security comes to enterprise applications in smartphones
Technology News |
INSIDE Secure has announced that it has upgraded its SafeZone FIPS software cryptographic module to improve security for a broad array of smart connected devices.
Open LED protector prevents damage from reverse polarity voltages
Open LED protector prevents damage from reverse polarity voltages
New Products |
Littlefuse, Inc., has introduced the PLEDxUx Unidirectional Series Open LED Protector, the latest addition to the company’s broad portfolio of PLED Open LED protection devices.


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