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Page 1788
ToF 3D sensing solution targets challenging environments
ToF 3D sensing solution targets challenging environments
New Products |
Melexis (Tessenderlo, Belgium) has added a chipset and its evaluation kit for time‐of‐flight (ToF) 3D vision solutions for the most…
High resolution stainless steel encoders up to 30 bits
High resolution stainless steel encoders up to 30 bits
New Products |
With a high resolution of 18 bits (AFS60 Inox) or 30 bits (AFM60 Inox) and a large selection of programmable…
Wireless charging design contest
Wireless charging design contest
Technology News |
The "Off The Clock Design Challenge” organized by Wurth Electronics Midcom entices participants to design a wireless charging end product…
Automotive power semiconductor market continues soaring
Automotive power semiconductor market continues soaring
Market news |
The global market for power semiconductors used in cars and light passenger vehicles will grow by more in $3 billion…

Memory compressor IP can save time, energy
Memory compressor IP can save time, energy
Technology News |
ZeroPoint Technologies AB (Goteborg, Sweden) is developing a hardware-based approach to data compression called MaxiMem that could be useful for both servers and leaf node equipment.
Danish startup ramps up thermoelectrics
Danish startup ramps up thermoelectrics
Technology News |
After years of product development in stealth mode, Danish startup TEGnology ApS is hoping to change ThermoElectric Generators (TEG) market dynamics, ramping up the production of energy harvesting modules by…
Reseachers suggest 4G infrastructure to cut vehicle accidents
Reseachers suggest 4G infrastructure to cut vehicle accidents
Technology News |
Recent research suggests that a pre-existing 4G network infrastructure could help drivers make safe decisions in or near accidents.
150W test power supplies with under 50μs transient response
150W test power supplies with under 50μs transient response
New Products |
Rigol Technologies has expanded its range of power supplies with the DP700 series specifically developed for use in research, development and all laboratory applications.
eGaN FET-based high current pulsed laser diode driver targets LiDAR
eGaN FET-based high current pulsed laser diode driver targets LiDAR
New Products |
Ultra fast transition eGaN FETs used on the EPC9126 can drive laser diodes with high current pulses and total pulse widths as low as 5ns, thus enhancing the quality of…
Altair, KDDI demonstrate cellular LPWA for IoT
Altair, KDDI demonstrate cellular LPWA for IoT
Technology News |
Altair Semiconductor has teamed up with Japan’s KDDI to demonstrate CAT-M (a.k.a. CAT-M1 or LTE-M), the new Release 13 in conjunction with ultra-low-power consumption, using LTE extended discontinuous reception (eDRX)…
DoD expands Qorvo® Microelectronics Trusted Source status
DoD expands Qorvo® Microelectronics Trusted Source status
Business news |
Qorvo® has earned continued Trusted Source Category 1A accreditation through 2018 from the U.S. Department of Defense (DoD). The company is one of only five accredited suppliers for both gallium…
High performance, low cost RF switches for communications
High performance, low cost RF switches for communications
New Products |
Compact, highly reliable RF switches that are ideal for optimizing transceiver performance for a wide range of IoT, industrial, smart home, medical, automotive and RF test applications, a variety of…
Power amplifiers deliver high output from 18 Ghz to 110 GHz
Power amplifiers deliver high output from 18 Ghz to 110 GHz
New Products |
Millitech, a microwave brand of Smiths Interconnect, has released a series of power amplifiers leveraging advanced PHEMT MMICs and transistors which yield millimeter-wave saturated power as high as 38 dBm…
Compact 25-W Ku-band transceiver with GaN SSPA
Compact 25-W Ku-band transceiver with GaN SSPA
New Products |
TRAK Microwave, a Microwave brand of Smiths Interconnect, has announced the addition of the Ku-band high power transceiver (HPT), which functions as a complete airborne Satcom system, integrating the necessary…
Flexenable’s conformable plastic LCDs enter concept cars
Flexenable’s conformable plastic LCDs enter concept cars
Business news |
Flexible organic electronics solution provider FlexEnable announced it is collaborating with automotive interiors creator Yanfeng Automotive Interiors (YFAI) to create an Invisible A-pillar concept for an autonomous demonstrator.
Cavium and China Unicom collaborate on virtualized RAN
Cavium and China Unicom collaborate on virtualized RAN
Business news |
Cavium, Inc., has announced an agreement with China Unicom to accelerate the design and development of Virtualized BBU and provide a path for 5G adoption.
Automotive-grade, multiphase DC-DC buck converter outputs 12A
Automotive-grade, multiphase DC-DC buck converter outputs 12A
New Products |
Dialog Semiconductor’s DA9210-A power management IC (PMIC) is a multiphase, automotive grade, 12A DC-DC buck converter that supplies the high current core rails of microprocessor devices, including those used in…
Battery charging IC configured for automotive eCall systems
Battery charging IC configured for automotive eCall systems
New Products |
Intersil’s ISL78693 claims lowest leakage current of any comparable device, to increase eCall backup battery run-time when vehicle is off.
Over-the-air updates join suite of software security services
Over-the-air updates join suite of software security services
New Products |
Integrity Security Services (ISS), a Green Hills Software company, has announced its Device Lifecycle Management (DLM) service for secure over-the-air (OTA) software updates to network-connected IoT devices in all industries.
French academic opens machine vision to makers
French academic opens machine vision to makers
Technology News |
With his JeVois Kickstarter campaign, French academic Prof. Laurent Itti aims to support all those with an interest in machine vision, computational neuroscience, and machine learning.
1.8µm pitch overlay accuracy promises automated wafer-level 3D stacking
1.8µm pitch overlay accuracy promises automated wafer-level 3D stacking
Technology News |
Research centre imec and wafer-bonding equipment provider EV Group have joined forces on wafer-to-wafer stacking for wafer-level 3D IC integration. Both companies are to announce excellent wafer-to-wafer overlay accuracy results…
Industrial wireless sensing IoT market to hit 35 billion USD by 2021
Industrial wireless sensing IoT market to hit 35 billion USD by 2021
Business news |
A recently published report by global IoT market research firm ON World contends that adoption of wireless sensor network (WSN) technologies is driving growth for the industrial IoT, and that…
Velodyne to produce one million LiDAR sensors a year by 2018
Velodyne to produce one million LiDAR sensors a year by 2018
Business news |
Announcing the opening a megafactory in San Jose, CA, Velodyne LiDAR aims to significantly ramp up production of its latest 3D LiDAR sensors, securing enough space for high-volume manufacturing, but…
Velodyne to produce one million LiDAR sensors a year by 2018
Velodyne to produce one million LiDAR sensors a year by 2018
Business news |
Announcing the opening a megafactory in San Jose, CA, Velodyne LiDAR aims to significantly ramp up production of its latest 3D LiDAR sensors, securing enough space for high-volume manufacturing, but…
UltraCMOS 60 GHz 
RF SOI switches in volume production
UltraCMOS 60 GHz 
RF SOI switches in volume production
New Products |
Peregrine Semiconductor has announced immediate availability of volume production parts for their UltraCMOS® 60 GHz RF SOI switches. The PE42525 and PE426525 extend the company's high frequency portfolio into frequencies…
MTI provides high performance antennas to Mimosa for multipoint access
MTI provides high performance antennas to Mimosa for multipoint access
Business news |
Mimosa Networks and MTI Wireless Edge have partnered to provide Massive MIMO antennas designed for the next generation Mimosa A5c gigabit access system.
GaAs MMIC low phase noise amplifier
GaAs MMIC low phase noise amplifier
New Products |
Custom MMIC has added a new GaAs MMIC Low Phase Noise Amplifier family including five products all achieving phase noise performance as low as -165dBc/Hz at 10 kHz offset.
Glass substrates to match semiconductor packaging requirements
Glass substrates to match semiconductor packaging requirements
New Products |
Glass and chemicals provider AGC Asahi Glass has developed a new line of glass substrates specifically designed for semiconductor packaging applications and semiconductor manufacturing process support.


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