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Feature articles Page 78

Feature articles Page 78
Encapsulated 50A Digital power module
Encapsulated 50A Digital power module
Feature articles |
Intersil’s ISL8272M provides PMBus-enabled power management point-of-load solution for FPGAs, processors and memory…
Revisions announced to PMBus standard
Revisions announced to PMBus standard
Feature articles |
Revision 1.3.1 of the open standard for power control and monitoring aims to enhance simple and efficient communication between various…
Is 2015 the year of wireless charging?
Is 2015 the year of wireless charging?
Feature articles |
Fady Mishriki, co-founder and chief technology officer at wireless charging pioneer PowerByProxi Ltd., looks for an end to uncertainty born…
Demonstrating ASIC IP performance and quality demands an FPGA-neutral design flow
Demonstrating ASIC IP performance and quality demands an FPGA-neutral design flow
Feature articles |
“Companies designing complex SoCs [are moving] increasingly toward licensing IP cores for a majority of the building blocks of their…

Fastest comparators drive 1.8V logic beyond 280 MHz
Fastest comparators drive 1.8V logic beyond 280 MHz
Feature articles |
The LTC6752 family of comparators has fast rise and fall times of 1.2 nsec and a toggle frequency of 280 MHz, making them the fastest CMOS output comparators available.
Digital power controller with “Tru-sample Technology” runs 35A to FPGAs
Digital power controller with “Tru-sample Technology” runs 35A to FPGAs
Feature articles |
Aimed at next-generation power system designs in telecommunication, data communication and networking equipment, ZMDI), (Dresden) has introduced the ZSPM1503 single-phase, true-digital power solution that has been optimised to power field…
80-V half-bridge GaN FET module from TI offers drop-in GaN evaluation
80-V half-bridge GaN FET module from TI offers drop-in GaN evaluation
Feature articles |
From Texas Instruments, the first 80-V, 10-A fully-integrated gallium nitride (GaN) field-effect transistor (FET) power-stage prototype consists of a high-frequency driver and two GaN FETs in a half-bridge configuration –…
Thin accelerometer packages suit wearable, health/medical applications
Thin accelerometer packages suit wearable, health/medical applications
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MEMS manufacturer Kionix, part of the Rohm group, has announced ultra-thin full-functional tri-axis accelerometers, the KX112 (2 x 2 x 0.6 mm) and KXCJB (3x 3 x 0.45 mm).
Silabs/ARM co-operation adds power management API to mbed
Silabs/ARM co-operation adds power management API to mbed
Feature articles |
A collaboration between Silicon Labs and ARM aims to “drive the future of low-power arm mbed IoT device platforms” - running mbed on Siliocn Labs EFM32 devices will accelerate deployment…
Design win; LED light-engine-maker endorses Nanotherm thermal substrate
Design win; LED light-engine-maker endorses Nanotherm thermal substrate
Feature articles |
Lumichip, developer of LED packaging solutions and light engines, has designed-in Cambridge Nanotherm’s thermal management technology for LEDs. Using the material has contributed to the performance of Lumichip’s newly-released range…
Dual-axis motor control kit uses mixed-signal programmable IC
Dual-axis motor control kit uses mixed-signal programmable IC
Feature articles |
Microsemi has used its SmartFusion2 SoC FPGA as the hardware basis of a dual-axis motor control development package, that includes an IP suite and reference design to simplify motor control…
JTAG/Boundary-scan – the development of standards
JTAG/Boundary-scan – the development of standards
Feature articles |
Prompted by a change in device packaging almost 30 years ago (from through hole to surface mount) a group of like-minded test engineers met to consider the impact that these…
USB Type-C controller in chip-scale package for active USB 3.1 cables/adapters
USB Type-C controller in chip-scale package for active USB 3.1 cables/adapters
Feature articles |
Cypress Semiconductor has applied the combination of configurable logic, I/O driving capability and mixed-signal circuitry it uses in its programmable PsoC devices, to produce an ASSP for the rapidly-developing USB…
ST’s Vigna wins IEEE award
ST’s Vigna wins IEEE award
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Benedetto Vigna, executive vice president for the analog, MEMS, and sensors group at STMicroelectronics NV has been given a top IEEE award for his role in the development and commercialization…
Top five problems with PLCs
Top five problems with PLCs
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The Programmable Logic Controller, or using the less tongue-tieable acronym, PLC, has become a stalwart of the automation industry and can be found in countless automated manufacturing processes across the…
Optimizing data memory utilization
Optimizing data memory utilization
Feature articles |
Optimization is important to embedded software developers because they are always facing limited resources. So, being able to control the size and speed trade-off with code is critical. It is…
IC design & fab platform offers low-power, SOI on multi-product wafers
IC design & fab platform offers low-power, SOI on multi-product wafers
Feature articles |
Silicon Impulse, a design platform at Grenoble-based Leti offers a ‘one-stop-shop’ IC resource for ultra-low-power Technologies; the end-to-end Design Accelerator Platform targets energy-efficient Internet of Things applications and new devices…
Two-way ranging, real-time location evaluation kit
Two-way ranging, real-time location evaluation kit
Feature articles |
Fabless semiconductor company DecaWave (Dublin, Eire) has created an evaluation kit, TREK1000, based on its precise indoor location and communication CMOS chip, the DW1000. TREK1000 enables users to evaluate the…
Infineon/Panasonic deal promises true-second-source GaN power devices
Infineon/Panasonic deal promises true-second-source GaN power devices
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Setting up dual sourcing for normally-off 600V GaN power devices, Infineon Technologies and Panasonic have announced an agreement under which both companies will jointly develop products based on Panasonic’s normally-off…
Cadence aims to recapture share of digital chip P&R with Innovus Implementation System
Cadence aims to recapture share of digital chip P&R with Innovus Implementation System
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Cadence has introduced a major revision of its implementation – essentially, place-and-route – tools for large-chip design and for the finFET (16/14/10-nm) era. Among its claims for the software are…
Miniature signal generator outputs 25 to 6000 MHz in 1KHz steps
Miniature signal generator outputs 25 to 6000 MHz in 1KHz steps
Feature articles |
AtlanTecRF's ASG series of Miniature Signal Generators cover a frequency range of 25 to 6000 MHz, tuneable in 1 kHz steps, with a very good spectral purity.
Win one of 5 RIoTboards for your connected applications
Win one of 5 RIoTboards for your connected applications
Feature articles |
Following up on its previous reader offer, Freescale is now giving away five RIoTboards, worth 74 dollars each, for EETimes Europe's readers to win.
IP for mixed-signal SoCs enables voice activation with “WhisperTrigger”
IP for mixed-signal SoCs enables voice activation with “WhisperTrigger”
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Voice activity detection is considered as a must-have for a growing range of applications such as wearable devices or smart home appliances, according to Dolphin Integration, which has introduced the…
3V 16/32/64-Mbit SQI, SuperFlash memories save production time & cost
3V 16/32/64-Mbit SQI, SuperFlash memories save production time & cost
Feature articles |
Microchip positions its latest NOR flash memory devices as enabling XIP capability with the world’s lowest power consumption and fastest-available read/write times…
An “ASSP-like” S/W-driven programming environment for Zynq chips, Xilinx promises
An “ASSP-like” S/W-driven programming environment for Zynq chips, Xilinx promises
Feature articles |
Xilinx has announced its SDSoC development environment for its All-Programmable SoCs and MPSoCs, aiming to make use of the devices easier and more accessible while maximising their performance and capabilities.
Bosch Sensortec’s MEMS sensors have integrated MCU, for Android smart phones
Bosch Sensortec’s MEMS sensors have integrated MCU, for Android smart phones
Feature articles |
BHI160 and BHA250 integrate lowest power sensor hub and sensors, using less power for always-on sensor applications such as fitness tracking, indoor navigation and gesture recognition.
2 GHz signal analyser bandwidth is ‘unique’ says Rohde & Schwarz
2 GHz signal analyser bandwidth is ‘unique’ says Rohde & Schwarz
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Developers need large bandwidths to analyse wideband signals like those of the new IEEE 802.11ad WLAN standard, 5G next generation mobile communications signals, and radar chirp signals. The R&S FSW…
Wrap a security film around your hardware, with PUF embedded
Wrap a security film around your hardware, with PUF embedded
Feature articles |
The Fraunhofer Institute for Applied and Integrated Security (AISEC) is developing a very versatile and flexible form of Physically Unclonable Function (PUF), one that can wrap an entire circuit board…


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