MENU

Feature articles Page 77

Feature articles Page 77
Toshiba claims first for 48-layer BiCS: a 3D stacked structure flash memory at 16 GB
Toshiba claims first for 48-layer BiCS: a 3D stacked structure flash memory at 16 GB
Feature articles |
Toshiba has announced the development of the world’s first 48-layer three dimensional stacked cell structure flash memory called BiCS, a…
Richard Feynman and homomorphic filtering
Richard Feynman and homomorphic filtering
Feature articles |
Dennis Feucht discusses his role in preserving the sound of the bongo-playing physicist's voice in audio files that are available…
TI takes low-power MCU line to 32-bit with an ARM core
TI takes low-power MCU line to 32-bit with an ARM core
Feature articles |
Texas Instruments has introduced the 32-bit MSP432 microcontrollers. The numbering scheme links to the company’s low-power MSP430 16-bit series: however,…
FTDI Chip adds graphic toolchain to its packaged-HMI offering
FTDI Chip adds graphic toolchain to its packaged-HMI offering
Feature articles |
A widget-based development tool assists user-interface designer professionals to create their own on-scrren interfaces without any need for detailed knowledge…

$10k-value in components offered in Digi-Key/Silicon Labs IoT contest
$10k-value in components offered in Digi-Key/Silicon Labs IoT contest
Feature articles |
Winners in an Internet-of-Things-themed design contest will receive $10,000 in semiconductor components to help bring their IoT ideas to product reality…
Top 5 ways to select the right battery for your device
Top 5 ways to select the right battery for your device
Feature articles |
Better known for his role in the Fast and Furious movie franchise, the late Paul Walker delivered arguably his most touching performance in 'Hours' one of the last films he…
Upconverter with 40 GHz option yields smallest microwave vector signal generator
Upconverter with 40 GHz option yields smallest microwave vector signal generator
Feature articles |
Rohde & Schwarz has a 40 GHz version of its R&S SGU100A RF upconverter. This version expands the frequency range of the R&S SGS100A vector signal generator from 12.75 GHz…
Enhanced e·MMC Version 5.1 compliant embedded NAND flash
Enhanced e·MMC Version 5.1 compliant embedded NAND flash
Feature articles |
Toshiba Electronics Europe has JEDEC e•MMC Version 5.1 compliant embedded NAND flash memory products supporting “command queuing” and “secure write protection”.
20µA op-amp provides 30 µV precision
20µA op-amp provides 30 µV precision
Feature articles |
LT6023 is a dual 3V to 30V low power operational amplifier, featuring 30 µV maximum input offset voltage and 60 µsec settling to 0.01%. Linear’s slew enhancement circuitry results in…
High dynamic-range, quad, 16-bit D/A converter for wireless and mobile comms
High dynamic-range, quad, 16-bit D/A converter for wireless and mobile comms
Feature articles |
The highly integrated AD9154 quad, 16-bit D/A converter delivers 2.4-Gsample/sec bandwidth, enabling superior performance and multi-carrier generation to the Nyquist frequency in baseband mode.
Imagination gives away MIPS-based reference tablets
Imagination gives away MIPS-based reference tablets
Feature articles |
On Imagination's news blog, Alexandru Voica is highlighting a MIPS-based reference tablet from Ingenic, a sub-USD100 device from China that can run either Android 4.4 KitKat from Google or an…
Development framework from ST to add IoT sensing features
Development framework from ST to add IoT sensing features
Feature articles |
STMicroelectronics’ BlueMicrosystem1 Open.Framework accelerates completion of Bluetooth Low Energy wireless-sensing projects targeting Android or iOS platforms.
Smoothing the design process across chip/package/PCB handovers
Smoothing the design process across chip/package/PCB handovers
Feature articles |
Mentor Graphics’ Xpedition Package Integrator Flow for IC-Package-Board Design is intended as a solution for integrated circuit (IC), package, and printed circuit board (PCB) co-design and optimisation.
70 GHz real-time oscilloscope from Tek claims lowest noise, highest ENOB
70 GHz real-time oscilloscope from Tek claims lowest noise, highest ENOB
Feature articles |
Tektronix' claims for its DPO70000SX 70 GHz ATI Performance Oscilloscope include the lowest-noise and highest effective bits of any ultra-high bandwidth real-time oscilloscope available on the market. Tek is aiming…
5 GHz power amplifier module extends WLAN range
5 GHz power amplifier module extends WLAN range
Feature articles |
A PA module from Microchip cuts the cost and complexity of implementing wireless LAN installations based on the IEEE 802.11ac Wi-Fi standard; SST11CP22 delivers ultra low EVM (error vector magnitude)…
Software development kit for SmartMesh IP wireless sensor networks
Software development kit for SmartMesh IP wireless sensor networks
Feature articles |
Linear Technology’s SmartMesh IP wireless sensor networking products now provide the ability to program industrial Internet of Things (IoT) applications directly on the embedded ARM Cortex-M3, running Micrium’s µC/OS-II real-time…
4th-gen mixed-signal programmables add analogue features, boost accuracy
4th-gen mixed-signal programmables add analogue features, boost accuracy
Feature articles |
Silego Technology’s SLG46620V GreenPAK4 is the the fourth generation of its GreenPAK (GPAK) mixed-signal matrix ICs, a family of configurable mixed-signal devices that can be programmed to yield system functions…
Vampire power and the need to save energy little and often
Vampire power and the need to save energy little and often
Feature articles |
Jim Bird of Texas Instruments points out that "standby" may be a convenience in home electronics but it is also an energy drain. More needs to be done in saving…
Microsemi acquires Vitesse Semiconductor
Microsemi acquires Vitesse Semiconductor
Feature articles |
The diversified semiconductor company Microsemi has announced a further intended broadening of its coverage with the acquisition of Vitesse; Microsemi says that the move, “Expands [its] differentiated technology offering for…
Cadence/Intel collaboration yields 14nm library characterisation reference flow
Cadence/Intel collaboration yields 14nm library characterisation reference flow
Feature articles |
For customers of Intel’s Custom Foundry business, Cadence’s Virtuoso Liberate Characterisation Solution and Spectre Circuit Simulator together ensure accurate 14nm logic libraries…
Cadence and ARM’s strategic partnership on IP
Cadence and ARM’s strategic partnership on IP
Feature articles |
Striking a broad Intellectual Property (IP) interoperability agreement, IC design tool provider Cadence and number one IP provider ARM are reinforcing their relationship with a multiyear agreement that gives them…
Roll-to-roll printing of organic solar cells and LEDs gets closer
Roll-to-roll printing of organic solar cells and LEDs gets closer
Feature articles |
An EU-funded research project is claiming a number of successes at its mid-term review of technologies being developed to facilitate roll-to-roll (R2R) production of organic optoelectronic devices such as solar…
Complete embedded UI has A8 processor, OS and display
Complete embedded UI has A8 processor, OS and display
Feature articles |
In andersDX’ entry-level DX series Embedded Display platforms, the DX1 is priced at under £100 (UK£ or equivalent) and based on the latest 600MHz ARM Cortex A8 processor from Texas…
Amantys and the spider
Amantys and the spider
Feature articles |
Why we should celebrate Amantys, a five year-old startup that has closed down.
Synopsys speeds up virtual development kit process, for virtual prototyping
Synopsys speeds up virtual development kit process, for virtual prototyping
Feature articles |
The latest release of Synopsys’ Virtualizer tool for creating Virtualizer Development Kits (VDKs) – software development kits that use virtual prototypes as the embedded target – aim to reduce the…
Mouser and ADI sponsor “Create the Future” design contest
Mouser and ADI sponsor “Create the Future” design contest
Feature articles |
Once again with sponsoring partner Analog Devices, distributor Mouser Electronics is participating in the 13th annual “Create the Future” Design Contest, a challenge to engineers and students worldwide to create…
GaN Systems uprates its custom GaN transistor package with topside cooling
GaN Systems uprates its custom GaN transistor package with topside cooling
Feature articles |
Enabling simpler PCB design, GaNPX packaging enables use of conventional heat dissipation techniques with GaN Systems’ (Ottawa, Canda) high-power enhancement-mode gallium nitride power switching semiconductors.
LDO design techniques for small spaces, part 2
LDO design techniques for small spaces, part 2
Feature articles |
Erik Mentze, senior IC design engineer with Cactus Semiconductor (Chandler, Arizona), continues his discussion of voltage regulation in the context of miniature systems.


10s