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Page 949
For V2X, Ford relies on the cloud
For V2X, Ford relies on the cloud
Technology News |
After DSRC and C-V2X, Ford Motor Company is adding another flavor to the application world of automated vehicle communication: The…
For V2X, Ford relies on the cloud
For V2X, Ford relies on the cloud
Technology News |
After DSRC and C-V2X, Ford Motor Company is adding another flavor to the application world of automated vehicle communication: The…
Printable Schottky diode for flexible electronic power
Printable Schottky diode for flexible electronic power
Technology News |
PragmatIC Printing Ltd. has developed a thin-film Schottky diode for use within its FlexLogIC printed electronics manufacturing system.
Reseachers combine AI with satellite imagery to enrich GPS maps
Reseachers combine AI with satellite imagery to enrich GPS maps
Technology News |
A team of researchers at MIT and Qatar Computing Research Institute (QCRI) has developed a machine-learning model that leverages satellite…

Battery pack service for untethered electronics
Battery pack service for untethered electronics
New Products |
Anglia's battery pack service offers full design-in support on standard, customised and fully bespoke solutions for portable applications with a wide range of chemistries.
MRAM pioneer Everspin restructures, lays off staff
MRAM pioneer Everspin restructures, lays off staff
Business news |
Everspin, a pioneer of magnetic RAM, is restructuring and plans to lay off about 15 percent of its staff on Friday (January 31, 2020).
IoT developer toolkit aims to accelerate prototype creation
IoT developer toolkit aims to accelerate prototype creation
New Products |
AI+IoT platform provider Tuya Smart (San Jose, CA) has announced the availability of a developer toolkit for IoT and connected device developers.
Electrically conductive die attach epoxy has high Tg of 140-150°C
Electrically conductive die attach epoxy has high Tg of 140-150°C
New Products |
Master Bond EP17HTS-DA is a new one-component, no-mix, die attach epoxy that is electrically conductive and withstands high temperatures. It is a silver filled system.
Let smart buildings count people with ToF
Let smart buildings count people with ToF
New Products |
Time-of-Flight (ToF) sensor maker Terabee has launched a ceiling-mount sensor, Terabee People Counting L, that consists of an IoT device with a Power over Ethernet (PoE) interface and a wide…
Moisture getter film targets hermetic packages
Moisture getter film targets hermetic packages
New Products |
Designed for hermetic packages, the Staydry Z20 silicone moisture getter film released by MacDermid Alpha Electronics Solutions comes with a newly developed proprietary backing adhesive that meets rigid outgassing and…
Intuitive touch controls for STM32-based smart devices
Intuitive touch controls for STM32-based smart devices
New Products |
STMicroelectronics and Fieldscale, an ST Authorized Partner and provider of simulation software, have joined forces to simplify the development of touch-enabled user interfaces for smart devices containing ST’s STM32 microcontrollers.
DesignSpark new year giveaway: worth over £2,500
DesignSpark new year giveaway: worth over £2,500
Business news |
Distributor RS Components has teamed up with Maxim Integrated, STMicroelectronics and TE Connectivity to offer one lucky member of DesignSpark, its go-to engineering platform, the chance to win an exclusive…
Anglia delivers total battery pack service for untethered electronics
Anglia delivers total battery pack service for untethered electronics
Business news |
Anglia has announced a total battery pack service, offering full design-in support on standard, customised and fully bespoke solutions based on primary or rechargeable cells in a choice of output…
Intel contributes Advanced Interface Bus to open source consortium
Intel contributes Advanced Interface Bus to open source consortium
Market news |
CHIPS Alliance, a consortium advancing common and open hardware for interfaces, processors, and systems, has announced that chipmaker Intel (Santa Clara, CA) is its newest member.
PragmatIC reports on printable Schottky diode
PragmatIC reports on printable Schottky diode
Technology News |
PragmatIC Printing Ltd. has developed a thin-film Schottky diode for use within its FlexLogIC printed electronics manufacturing system.
Boréas pairs BOS1211 haptic driver with TDK 120V actuator
Boréas pairs BOS1211 haptic driver with TDK 120V actuator
New Products |
Boréas Technologies Inc. has paired its BOS1211 high-voltage piezoelectric driver IC with TDK's PowerHap 120V piezo actuators to demonstrate automotive applications.
Test standard for 3D power chips adds parallel operation
Test standard for 3D power chips adds parallel operation
Technology News |
The IEEE Std 1838-2019 allows die makers to design power controllers with a stack-level test access architecture for 3D chips.
Online platform automates software integration for networked vehicle architectures
Online platform automates software integration for networked vehicle architectures
Technology News |
In modern vehicles, the software is increasingly supplied by external providers. The role of OEMs is thus increasingly taking on the character of system integrators. Tier One Supplier Continental facilitates…
FPGA development tool gets Functional Safety certification
FPGA development tool gets Functional Safety certification
New Products |
Designers for FPGA-based automotive and industrial application can now use the Lattice Diamond FPGA design and software verification environment for applications that require functional safety: Lattice Semiconductor, vendor of the…
ST forms touch sensor design partnership with Fieldscale
ST forms touch sensor design partnership with Fieldscale
New Products |
Fieldscale, a supplier of cloud-based design and simulation software for capacitive touch sensors, has teamed up with STMicroelectronics. The two companies are working together to aid development of touch-enabled user-interfaces…
Testing stacked dies in 3D integrated circuits
Testing stacked dies in 3D integrated circuits
Technology News |
Following a standardization effort for the DfT (design-for-test) of 3D integrated circuits (3D-ICs) initiated by research centre imec, the new standard IEEE Std 1838TM-2019 recently approved by the IEEE Standards…
Quartz RFSoC board aligned to SOSA technical standard
Quartz RFSoC board aligned to SOSA technical standard
Pentek’s new Quartz Model 5550 is an eight-channel A/D and D/A converter, 3U OpenVPX board that is based on the Xilinx Zynq UltraScale+ RFSoC.
Developing analysis tools for embedded critical systems
Developing analysis tools for embedded critical systems
Technology News |
Launched last December for a duration of two years, the Multicore Analysis Service and Tools for Embedded Critical Systems (MASTECS) Fast Track to Innovation (FTI) project aims to develop validation…
Mouser adds TI’s latest mmWave sensors
Mouser adds TI’s latest mmWave sensors
Mouser Electronics is now stocking the IWR1843 industrial radar sensor from Texas Instruments (TI) for industrial applications.
1838-2019 test standard for 3D chips adds parallel operation
1838-2019 test standard for 3D chips adds parallel operation
Technology News |
The IEEE Std 1838-2019 allows die makers to design dies which, once stacked in a 3D-IC, have a consistent, faster stack-level test access architecture.
First single channel 43.5GHz USB vector network analyzer
First single channel 43.5GHz USB vector network analyzer
New Products |
Anritsu's ShockLine MS46131A USB vector network analyzer (VNA) is the industry’s first modular 1-port VNA that supports measurement frequencies up to 43.5 GHz.
43.5GHz 1-port USB vector network analyzer is industry’s first
43.5GHz 1-port USB vector network analyzer is industry’s first
New Products |
Anritsu’s ShockLine MS46131A USB vector network analyzer (VNA) is what the company claims to be the industry’s first modular 1-port VNA that supports measurement frequencies up to 43.5 GHz.
Thinner wafers will slash solar cells costs, say MIT researchers
Thinner wafers will slash solar cells costs, say MIT researchers
Technology News |
Although solar panel costs have plummeted lately thanks to volume production and increased adoption, slimming down silicon wafers could lead to even lower costs and faster industry expansion, according to…


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