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Page 660
Mezzanine connector upgrades to 32+ Gbit/s
Mezzanine connector upgrades to 32+ Gbit/s
New Products |
The rugged Mezalok mezzanine connector from TE Connectivity increases connectivity with 32Gbit/s at 5GHz…
Security system detects weapons without impacting transit flow
Security system detects weapons without impacting transit flow
Technology News |
Lightweight, portable screening security system quickly and automatically screens without the need to divest purses, backpacks and luggage…
Curved sensor startup to boost imaging performance
Curved sensor startup to boost imaging performance
Business news |
Startup Silina in Paris, France, has created a curved image sensor from conventionally produced planar sensors.
Scaleable RISC-V module for distributed AI processing
Scaleable RISC-V module for distributed AI processing
New Products |
The ARVSOM RISC-V system on module from Antmicro works with a Raspberry Pi carrier board for scaleable computing …

Thermal simulation challenges for aerospace designs
Thermal simulation challenges for aerospace designs
Technology News |
Power management with liquid cooling and 3D printing are key trends for aerospace engineers according to a report from simulation tool developer 6SigmaET…
Nanosatellite to test solar sail
Nanosatellite to test solar sail
Technology News |
NanoAvionics is building a 12U nanosatellite to test out a solar sail propulsion system in low earth orbit…
Si2 to develop standard SiC SPICE model
Si2 to develop standard SiC SPICE model
Technology News |
The Silicon Integration Initiative (Si2) is starting work on a standard SPICE model for silicon carbide (SiC) devices.
Top news in April
Top news in April
Feature articles |
Nick Flaherty looks back at the top news articles in April, from Foxconn and GraphCore to research breakthroughs in scandium and gallium nitride…
CEO interview: Quantum security for the real world
CEO interview: Quantum security for the real world
Interviews |
Crypto Quantique is using advanced quantum tunnelling circuits to secure devices in the IoT. Dr Shahram Mossayebi talks to Nick Flaherty about the challenges.
Edge software tackles EV charger fragmentation
Edge software tackles EV charger fragmentation
Business news |
Siemens Smart Infrastructure is supplying edge software that will bring together hundreds of different electric vehicle charging stations across Germany.
The Next Decade of Industrial Power
The Next Decade of Industrial Power
Feature articles |
Mark Patrick of Mouser Electronics looks at the innovative power conversion topologies and materials being developed for the IIoT, automation, AI and big data…
Piezo haptic engine brings HD haptics to wearables
Piezo haptic engine brings HD haptics to wearables
New Products |
Haptic applications-focused semiconductor company Boréas Technologies has unveiled what it claims is the first module to harness the high performance of piezo actuators to solve wearable devices' most significant challenge…
Microsoft finds security vulnerabilities in IoT, OT devices
Microsoft finds security vulnerabilities in IoT, OT devices
Market news |
Microsoft says it has recently uncovered a series of critical memory allocation vulnerabilities in Internet of Things (IoT) and operational technology (OT) devices that adversaries could exploit to bypass security…
Vodafone, Qualcomm team for 5G OpenRAN chips and reference design
Vodafone, Qualcomm team for 5G OpenRAN chips and reference design
Business news |
Qualcomm to develop ASIC chips for OpenRAN Massive MIMO radio unit and distributed processing unit…
China plans 6G patent push, two more test satellites
China plans 6G patent push, two more test satellites
Business news |
China says it dominates global patents for next generation 6G cellular wireless technology, with China Mobile and Huawei planning to launch two 6G test satellites.
Vodafone and Qualcomm create blueprint for Open RAN vendor diversification
Vodafone and Qualcomm create blueprint for Open RAN vendor diversification
Technology News |
Open RAN MaMIMO RU and DU platforms development is expected to boost the Open RAN ecosystem and speed pace of 5G innovation…
Merger creates Swedish embedded design specialist
Merger creates Swedish embedded design specialist
Business news |
BitSim and NOW Electronics in Sweden have merged to create embedded design specialist BitSim Now…
ST hits $12bn run-rate in chip boom
ST hits $12bn run-rate in chip boom
Business news |
First quarter sales at European chip giant STMicroelectronics were $3.02 billion, up 35.2 percent on the same quarter last year at the start of the Covid-19 pandemic.
2nm ‘Eurofab’ talks today with TSMC, Intel and Samsung
2nm ‘Eurofab’ talks today with TSMC, Intel and Samsung
Business news |
Intel, Samsung and TSMC are expected to be part of European Commission discussions today over a 2nm chip fab…
Lowest energy flash memory chip for the IoT
Lowest energy flash memory chip for the IoT
New Products |
Dialog’s AT25EU family of SPI NOR flash memory devices is the lowest power consumption and the fastest operation for the Internet of Things…
Eurotech teams for industrial IoT software
Eurotech teams for industrial IoT software
Business news |
Eurotech and Exosite partner to simplify industrial IoT edge and platform technology…
Autonomous machine learning boost for quantum sensors
Autonomous machine learning boost for quantum sensors
Technology News |
An autonomous machine learning protocol developed at the University of Bristol reverse engineers Hamiltonian models to boost the development of quantum sensors…
AWS open sources its DeepRacer autonomous ML learning robot
AWS open sources its DeepRacer autonomous ML learning robot
Market news |
Amazon Web Services (AWS) has announced that it's open-sourcing the device software for its AWS DeepRacer 1/18th-scale autonomous racing vehicle robot.
Blickfeld integrates motion detection with lidar sensor
Blickfeld integrates motion detection with lidar sensor
New Products |
Blickfeld GmbH (Munich, Germany) has added on-sensor pre-processing to its solid-state lidar adding the feature of motion detection.
Intel, Samsung, TSMC in Brussels for 2nm ‘Eurofab’ talks
Intel, Samsung, TSMC in Brussels for 2nm ‘Eurofab’ talks
Business news |
Intel, Samsung and TSMC are all expected to be represented in European Commission discussions over European chip manufacturing, taking place Friday, April 30.
Molex teams for 112G data centre active cable designs
Molex teams for 112G data centre active cable designs
Business news |
Molex teams with Celestica and Innovium on reference designs for a 112G copper active cable system…
Cloud chip platform aims to ‘rebuild’ AI hardware industry
Cloud chip platform aims to ‘rebuild’ AI hardware industry
Business news |
AI computation platform Anari AI has announced that it has raised $2 million in seed funding to continue developing its "AI chip factory in the cloud" and bring it to…
Ultra-low-power flash devices reduce IoT device energy use
Ultra-low-power flash devices reduce IoT device energy use
New Products |
Family of ultra-low energy, fast read NOR Flash devices deliver significantly faster erase times and power-saving features to reduce energy consumption of IoT devices…


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