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Page 539
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ST’s first 650V HEMT STPower GaN devices are in production now with additional devices in various packages and specification ratings…
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An optical processing platform from Lightelligence can outperform state-of-the-art GPUs by factors of 100x for certain classes of computational problem,…
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NXP signs strategic deal with Foxconn Industrial Internet to provide edge processing and UWB wireless chips…
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Sale of wafer fab in Dortmund to MEMS foundry Silex Microsystems includes a long-term supply agreement until 2027…

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Success on two key test tracks emphasizes interoperability of Open RAN components at third O-RAN Alliance plugfest…
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Thermal gap filler pads ensure complete conformability and the lowest outgassing to optimise heat transfer between components and heat sinks.
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Strategic automotive partnership will initially focus on the development of a full digital cockpit starting mass production in 2023.
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Volkswagen is combining its battery activities into a single company in Salzgitter, creating a European battery giant to take on Chinese competitors.
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Secure Thingz and Intrinsic ID to enable rapid development, implementation, and provisioning of unique and secure identity for IoT applications.
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Alpitronic is using 1200V silicon carbide (SiC) modules from Infineon for a dual output vehicle-to-grid (V2G) wall charger…
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Collaboration combines field-proven reflector technology and an advanced radar echo generator with an EoL radar sensor test system.
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Scientists at the University of Stuttgart (Germany) have developed a 3D process with which complex micro-optics including apertures and other components can be printed in one step. Now the team…
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2G and 3G mobile networks will be shut in the UK by 2033 to help new telecoms suppliers build 5G and 6G networks using Open RAN.
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Broader access to NetID allocations enlarges the LoRaWAN ecosystem — providing an easier path to scaling networks and increasing access to roaming.
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Small Cell Forum lays foundations for reference designs and interfaces that reflect evolving market requirements, while reducing fragmentation.
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STMicroelectronics and Samsung have developed an 18nm FDSOI technology logic platform with embedded phase change memory.
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Engineering samples of the AON1100 chip and development kit from AONDevices are aimed at TinyML voice, audio and sensor applications…
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Infineon has developed a security solution for wireless charging in automotive applications: Optiga Trust Charge automotive complies with version 1.3 of the Wireless Power Consortium (WPC) Qi standard. The standard…
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Murata has co-developed a new generation of RFID modules with Michelin that embed into tyres. The robust passive RFID tags require no external power supply. They survive and continue to…
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Innodisk has developed the first 10GbE LAN module in the M.2 form factor.
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Partnership enables rapid development, implementation, and provisioning of unique and secure identity for IoT applications…
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ROHM Semiconductor Group company LAPIS Technology today announced a chipset capable of providing up to 1W of wireless power for compact, streamlined wearable devices and for industrial smart, miniaturized, and…
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Networking and telecommunications company Ericsson has released the eleventh edition of its ConsumerLab 10 Hot Consumer Trends report, which targets early adopter consumers' views on a 2030 timeline.
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Segger has released a J-Link software package specifically for Microsoft Windows running on ARM processors.
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IBM and Samsung Electronics have proposed a vertical transistor with lower power consumption and better scaling at 2nm than horizontal nanosheet transistors.
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Several companies in the automotive value chain have invested a significant sum into software startup Apex.AI (Palo Alto, Calif, and Munich, Germany). What the company is developing has the potential…
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RFID module delivers low cost and easy tyre traceability throughout its entire lifespan, improving tyre management operations.
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J-Link software package runs natively on Arm processors, ensuring that no performance or power is lost in emulation.


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