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Page 2746
Fluke’s wireless measurement DMM toolkit
Fluke’s wireless measurement DMM toolkit
New Products |
Distributor Farnell element14 is to stock the Fluke CNX3000 wireless multimeter, which allows you to solve problems faster and manage…
Tiny multilayer chip beads attenuate EMC noise
Tiny multilayer chip beads attenuate EMC noise
New Products |
TDK has developed a miniaturised multilayer chip bead series that is nearly 80% smaller in volume and 65% in area…
360° wraparound view system incorporates approaching-object detection
360° wraparound view system incorporates approaching-object detection
Feature articles |
Fujitsu Semiconductor 's MB86R24 is one of the company's third-generation high-performance graphic SoCs for automotive applications. The chip also enables…
Programmable power supplies now rated to 800W
Programmable power supplies now rated to 800W
New Products |
TDK has added to its Z+ Series of PSUs with higher power units for standalone or system applications, that can…

Next-generation NAND flash memory coming soon from Toshiba
Next-generation NAND flash memory coming soon from Toshiba
Feature articles |
Toshiba has announced that the it has developed second generation 19-nanometre process technology that it will apply to mass production of 2-bit-per-cell 64 gigabit NAND memory chips later this month.
Benchmarking code for automotive MVUs will factor energy efficiency
Benchmarking code for automotive MVUs will factor energy efficiency
Feature articles |
Many MCUs in cars are not completely switched off when the driver parks and locks the vehicle, but remain "semi-active" in sleep mode - and over time, even ultra-low power…
Gemalto teams with Encore Networks for mission critical M2M communications
Gemalto teams with Encore Networks for mission critical M2M communications
Business news |
European smartcard specialist Gemalto has teamed up with US machine-to-machine (M2M) router supplier Encore Networks to provide reliable wireless links for mission critical applications as operators pull out of wired…
EDA environment for the analysis of on chip passive devices
EDA environment for the analysis of on chip passive devices
New Products |
Sonnet Software has announced, Blink™, an easy-to-use EDA environment for the analysis of on chip passive devices such as spiral inductors and MIM capacitors. Blink will be available to the…
Rogers to show advanced circuit materials at IMS 2013
Rogers to show advanced circuit materials at IMS 2013
New Products |
Rogers Corporation will highlight several of its high quality printed circuit board (PCB) materials at the upcoming 2013 IEEE International Microwave Symposium (IMS). In addition, John Coonrod, Rogers Market Development…
World’s lowest power Bluetooth smart chip is unveiled
World’s lowest power Bluetooth smart chip is unveiled
New Products |
Dialog Semiconductor plc launches SmartBond, which claims to be the world’s lowest power and smallest Bluetooth Smart System-on-Chip that more than doubles the battery life of an app-enabled smartphone accessory…
Automotive microcontroller benchmark takes energy efficiency into account
Automotive microcontroller benchmark takes energy efficiency into account
Technology News |
Today, cars are crammed with microprocessors, and many of them are not completely switched off when the driver parks and locks the vehicle. Instead, many remain "semi-active" in sleep mode…
OMAP5432 processor-based EVM boosts graphics capabilities for industrial applications
OMAP5432 processor-based EVM boosts graphics capabilities for industrial applications
New Products |
Texas Instruments Incorporated has introduced the company's OMAP5432 processor-based evaluation module (EVM) for high-performance industrial applications to help developers jumpstart their product designs.
DMA reference design is released for Stratix V and PCIe Gen3 solutions
DMA reference design is released for Stratix V and PCIe Gen3 solutions
New Products |
Altera Corporation's 28 nm Stratix V GX FPGAs have achieved inclusion on the latest PCI-SIG Integrators List for the PCI Express (PCIe) 3.0 specification (Gen3).
Automotive MCU benchmark takes energy efficiency into account
Automotive MCU benchmark takes energy efficiency into account
Technology News |
Today, cars are crammed with microprocessors, and many of them are not completely switched off when the driver parks and locks the vehicle. Instead, many remain "semi-active" in sleep mode…
EnSilica partners Cross Border Technologies to boost sales growth in key European markets
EnSilica partners Cross Border Technologies to boost sales growth in key European markets
Business news |
EnSilica has partnered with Cross Border Technologies to accelerate the sales of EnSilica's IC design services and system IP solutions in key European and Asian markets, particularly Germany, France, Japan…
Industry’s first ultra-wideband Doherty amplifiers support broadband operation
Industry’s first ultra-wideband Doherty amplifiers support broadband operation
Technology News |
NXP Semiconductors N.V. has introduced an ultra-wideband Doherty reference design using the BLF884P and BLF884PS – the industry’s first wideband Doherty power amplifiers capable of broadband operation (470 to 806…
Graphics chip recognizes nearby pedestrians and bicycles
Graphics chip recognizes nearby pedestrians and bicycles
Technology News |
Fujitsu Semiconductor Europe (FSEU) announced the development of MB86R24, the company's third-generation graphic SoCs for automotive applications. The device incorporates the Approaching Object Detection functionality—which notifies drivers of nearby people,…
EMS boom for medical industry says analyst
EMS boom for medical industry says analyst
Market news |
Original equipment manufacturers (OEMs) are increasingly turning to electronics manufacturing service (EMS) providers to handle the escalating volumes of electronic content in the medical industry says market analyst Frost &…
Family of modules provides all-in-one LTE connectivity for M2M
Family of modules provides all-in-one LTE connectivity for M2M
New Products |
French 4G chipmaker Sequans Communications has introduced a new line of LTE modules with a complete RF front end and key interfaces in a single, compact package for M2M designs.
Gemalto teams with Encore Networks for mission critical M2M communications as US shifts to wireless
Gemalto teams with Encore Networks for mission critical M2M communications as US shifts to wireless
Business news |
European smartcard specialist Gemalto has teamed up with US machine-to-machine (M2M) router supplier Encore Networks to provide reliable wireless links for mission critical applications as operators pull out of wired…
Bluetooth low energy chip doubles the battery life of app-enabled peripherals
Bluetooth low energy chip doubles the battery life of app-enabled peripherals
New Products |
Dialog Semiconductor has launched what it claims is the industry's lowest power Bluetooth system-on-chip.
Solar industry capital spending hits seven-year low in 2013 but upturn is on the cards
Solar industry capital spending hits seven-year low in 2013 but upturn is on the cards
Market news |
Although global capital spending during 2013 in the photovoltaics supply chain is expected to fall to its lowest level since 2006 market analyst IHS predicts the downturn in investment has…
Apple’s overseas tax evasion stirs debate over US tax code
Apple’s overseas tax evasion stirs debate over US tax code
Market news |
According to the Wall Street Journal, Senate investigators found that Apple Inc paid no corporate income tax to any national government on tens of billions of dollars in overseas income…
Could Intel enable USD200 Ultrabook?
Could Intel enable USD200 Ultrabook?
Market news |
With the traditional PC apparently heading the way of the abacus, market research firm IHS is proposing a radical course of action: that Intel Corp. cut the price of chips…
Driver chip features primary-side peak-current mode for high-brightness LEDs
Driver chip features primary-side peak-current mode for high-brightness LEDs
New Products |
ZMDI (Dresden, Germany) has introduced the ZSLS7031, a primary-side peak-current mode LED driver for high-brightness LED lighting. This product is suited for many consumer, commercial and industrial lighting applications, particularly…
Bluetooth SoC only draws 3.8mA at transmission and reception
Bluetooth SoC only draws 3.8mA at transmission and reception
New Products |
With SmartBond, Dialog Semiconductor has released what the company claims to be the world's lowest power and smallest Bluetooth Smart System-on-Chip (SoC), which more than doubles the battery life of…
Places2Be project aims to boost European leadership around FD-SOI
Places2Be project aims to boost European leadership around FD-SOI
Technology News |
A group of 19 leading European companies and academic institutions have launched Places2Be, a 3-year, €360 million advanced-technology pilot-line project to support the industrialization of Fully-Depleted Silicon-On-Insulator (FD-SOI) microelectronics technology.
Test card evaluates mobile device behaviour in extreme temperatures
Test card evaluates mobile device behaviour in extreme temperatures
New Products |
With the increase of M2M (Machine to Machine) communication, mobile device requirements are increasing as well. Comprion's new test card helps confirm the proper functioning of mobile phones in extreme…


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