MENU

Page 1903

Page 1903
Carmakers want to keep up with consumer chip design processes
Carmakers want to keep up with consumer chip design processes
Partners |
Car designers increasingly love to integrate consumer electronics functions into their vehicles, but in the world of consumer electronics, design…
Keeping ahead of the interference challenges
Keeping ahead of the interference challenges
Technology News |
In our highly wireless world, interference is an unwelcome addition to the equation that results in noise, interrupts cell phone…
16x26x2.6mm LTE Cat M1 module aims for IoT
16x26x2.6mm LTE Cat M1 module aims for IoT
New Products |
u-blox plans to launch modules supporting Category M1 (Cat M1) LTE networks, which will allow a larger number of devices…
Bluetooth LE module in a tiny 8- x 8- x 1-mm SIP
Bluetooth LE module in a tiny 8- x 8- x 1-mm SIP
New Products |
Building on the success of its ISP1300 series modules, Insight SIP is releasing the ISP1507 to offer customers the next…

European flexible electronics meet with Asia
European flexible electronics meet with Asia
Business news |
A project worth nearly €3m is supporting the transfer of flexible, low power organic semiconductor screen technology to Asia.
MEMS FPGA targets high temperature environments
MEMS FPGA targets high temperature environments
Technology News |
Microsemi has teamed up with Moog Controls and two UK universities to develop FPGAs for high temperature environments using micromachined relays.
Transimpedance preamplifier ASIC targets optical sensors
Transimpedance preamplifier ASIC targets optical sensors
New Products |
The transimpedance preamplifier circuit CCG1401 from Creative Chips uses a proven BiCMOS technology to achieve excellent noise characteristics for use in optical sensor applications.
80×80 pixels thermal sensor ready for large-volume applications
80×80 pixels thermal sensor ready for large-volume applications
New Products |
Delivered in a Ball Grid Array (BGA) wafer level package, the fully digital Micro80 Gen2 thermal sensor from ULIS is claimed to be the first infrared sensor box packaged in…
Complete Bluetooth LE module shrunk to 8x8x1mm
Complete Bluetooth LE module shrunk to 8x8x1mm
New Products |
Building on the success of its ISP1300 series modules, Insight SIP is releasing the ISP1507 to offer customers the next generation in Bluetooth Low Energy Technology in a 8x8x1mm System-in-Package.
ARM acquisition completed: CEOs comment on future plans
ARM acquisition completed: CEOs comment on future plans
Business news |
Following completion of Japanes SoftBank Group Corp’s acquisition of ARM Holdings on 5th Septembeer 2016, SoftBank Chairman & CEO Masayoshi Son and ARM CEO Simon Segars issued a joint open…
MEMS FPGA targets high temperature environments
MEMS FPGA targets high temperature environments
Technology News |
Microsemi has teamed up with Moog Controls and two UK universities to develop FPGAs for high temperature environments using micromachined relays.
Programmable buck-boost converter targets smartphones
Programmable buck-boost converter targets smartphones
New Products |
Fairchild Semiconductor has launched a 2.5A, 1.8MHz digitally programmable buck-boost regulator for the power supplies used in smartphones, tablets and other battery-powered mobile devices.
Bluetooth LE SDK introduces secure over-the-air updates
Bluetooth LE SDK introduces secure over-the-air updates
New Products |
The latest nRF5 SDK v12.0 from Nordic Semiconductor supports secure and signed over-the-air device firmware updates (OTA-DFU) to strengthen application updates from potentially damaging malicious device upgrade attacks by using…
European project to boost flexible organic semiconductor production in Asia
European project to boost flexible organic semiconductor production in Asia
Business news |
A project worth nearly €3m is supporting the transfer of flexible, low power organic semiconductor screen technology to Asia.
On Semi clear to buy Fairchild
On Semi clear to buy Fairchild
Business news |
On Semiconductor Corp. has moved a step closer to its acquisition of Fairchild Semiconductor International Inc. for $2.4 billion.
Lidar startup becomes ‘unicorn’
Lidar startup becomes ‘unicorn’
Business news |
Quanergy Systems Inc. (Sunnyvale, Calif.), a provider of solid-state lidar sensor systems, has raised $90 million in Series B funding; a funding round that values the company at more than…
Spanish startup funded to develop CMOS MEMS
Spanish startup funded to develop CMOS MEMS
Business news |
Nanusens SL (Barcelona, Spain), a company set up to develop MEMS sensors in CMOS, has received €1.3 million (about $1.5 million) in funding from Caixa Capital Risc, Inveready Technology Investment…
Security vulnerabilities found in cars connected to smartphones
Security vulnerabilities found in cars connected to smartphones
Technology News |
In a recently published paper, researchers from New York University (New York, NY) and George Mason University (Fairfax, VA) unveiled the vulnerabilities posed by MirrorLink, an industry standard for connecting…
UMC partners to expand MEMS business
UMC partners to expand MEMS business
Business news |
United Microelectronics Corp. (Hsinchu, Taiwan) has formed a partnership with Asia Pacific Microsystems Inc. (Hsinchu, Taiwan) to provide MEMS manufacturing using 200mm and 300mm diameter wafers.
Bluetooth LE SDK introduces secure over-the-air updates
Bluetooth LE SDK introduces secure over-the-air updates
New Products |
The latest nRF5 SDK v12.0 from Nordic Semiconductor supports secure and signed over-the-air device firmware updates (OTA-DFU) to strengthen application updates from potentially damaging malicious device upgrade attacks by using…
Top four companies dominate as GaN market booms
Top four companies dominate as GaN market booms
Business news |
The market for gallium nitride (GaN) devices will grow 17% a year to over $3.4bn by 2024 with four companies dominating, according to a new research report.
VR via satellite to be demonstrated
VR via satellite to be demonstrated
Technology News |
SES S.A., and Fraunhofer Heinrich Hertz Institute HHI in Berlin, will demonstrate a groundbreaking R&D project at the IBC Conference this year showcasing the transmission of a 10K x 2K…
Carbon nanotube transistors outperform silicon for first time
Carbon nanotube transistors outperform silicon for first time
Technology News |
Looking at their singular properties, carbon nanotubes have been very promising candidates for very fast and high-efficiency transistors, particularly for wireless communications. But the actual realization of commercially viable transistors…
Modular phone a no go, says Google
Modular phone a no go, says Google
Technology News |
Only a few months after announcing a developer edition to be shipped by this fall, Alphabet Inc’s Google has reportedly suspended Project Ara. The modular smartphone project is being hit…
Car hack uses the driver’s smartphone as a gateway
Car hack uses the driver’s smartphone as a gateway
Technology News |
In a recently published paper "A Security Analysis of an In Vehicle Infotainment and App Platform", researchers from New York University and George Mason University unveiled the vulnerabilities posed by…
SiC power technology reaching maturity
SiC power technology reaching maturity
Interviews |
At the last PCIM Europe, ROHM Semiconductor showcased a variety of SiC (silicon carbide) power devices. Although SiC is disadvantageous compared to silicon in terms of price, cost reductions are…
MEMS FPGA targets high temperature environments
MEMS FPGA targets high temperature environments
Technology News |
Microsemi has teamed up with Moog Controls and two UK universities to develop FPGAs for high temperature environments using micromachined relays.
Virtual reality via satellite demonstrated
Virtual reality via satellite demonstrated
Technology News |
SES S.A., and Fraunhofer Heinrich Hertz Institute HHI in Berlin, will demonstrate a groundbreaking R&D project at IBC this year showcasing the transmission of a 10K x 2K panoramic video…


10s