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Page 1885
OLEDs on flexible ceramics: more stable says Holst Centre
OLEDs on flexible ceramics: more stable says Holst Centre
Technology News |
The Holst Centre has demonstrated what it claims to be first ever ceramic-based, large-area flexible OLED, manufactured on a 20-40…
Bluetooth SIG developer kits updated to address security, interoperability
Bluetooth SIG developer kits updated to address security, interoperability
New Products |
The Bluetooth Special Interest Group (SIG) has released updates to its developer toolkit line-up. These toolkits enable developers to build…
4.1×3.9mm 2M-pixels CMOS sensors designed for endoscopy
4.1×3.9mm 2M-pixels CMOS sensors designed for endoscopy
New Products |
FRAMOS has designed a tiny CMOS image sensor to enable fast full-HD imaging for endoscopy and other medical applications, improving…
Generate PAM4 signals for receiver compliance testing
Generate PAM4 signals for receiver compliance testing
Feature articles |
56 Gbit/sec links are moving to PAM4 signalling as a way to overcome channel bandwidth issues. As this modulation technique…

E-band transceiver module achieves data rates up to 10 Gbps at 128 QAM
E-band transceiver module achieves data rates up to 10 Gbps at 128 QAM
Technology News |
Following recent advancements in high capacity modem technology, several customers of Filtronic Broadband have now successfully demonstrated wireless data rates up to 10 Gbps at 128 QAM by employing the…
Verification update at DVCon Europe 2016: registration deadline approaching
Verification update at DVCon Europe 2016: registration deadline approaching
Technology News |
This week (commencing 26th September) sees the advance registration deadline for the 2016 Design and Verification Conference in Europe – DVCon – that takes place in Munich on October 19th…
Rad-hard PLL works up to 5 GHz
Rad-hard PLL works up to 5 GHz
New Products |
Based on Peregrine Semiconductor’s radiation-tolerant UltraCMOS process, the PE97640 fractional-N phase-locked loop targets commercial space applications. The device, which is available exclusively from e2v, is capable of frequency synthesis up…
Advanced PCB technologies combined for all-layer dimension shrinks
Advanced PCB technologies combined for all-layer dimension shrinks
New Products |
PCB design and manufacturing company AT&S (Leoben, Austria) has brought together a range of technology options for miniaturisation on all interconnection layers, in a “toolbox” that include embedded component packaging,…
Miniature digital sensors measure low pressure
Miniature digital sensors measure low pressure
New Products |
From All Sensors (California and Grӧbenzell, Germany) the DLHR series of pressure sensors offers a high-resolution digital output and measurement ranges of 0.5 in H2O to 60 in H2O (gauge…
Gate-drive optocouplers for medium-power FET/IGBT switches
Gate-drive optocouplers for medium-power FET/IGBT switches
New Products |
Toshiba has added to its offering of low-input current drive, rail-to-rail output gate-drive photocouplers, with devices that feature bufferless direct drive of low-to-medium-power IGBTs and MOSFETs from microcontrollers.
LDO variant maintains operation to 150°C (H-Grade)
LDO variant maintains operation to 150°C (H-Grade)
New Products |
A higher temperature “H-grade” version of the LT3086 comes in the TSSOP package. The LT3086 is part of Linear’s LDO+ family, offering functionality previously unavailable in linear regulators.
E-band linear-circular polarizer delivers exceptional cross-pol discrimination
E-band linear-circular polarizer delivers exceptional cross-pol discrimination
New Products |
The Millitech brand of Smiths Microwave Subsystems has released an ultra-wide bandwidth E-band linear-circular polarizer boasting a low axial ratio of < 0.6 dB, low insertion loss of < 0.5…
Kymeta and TECOM bring leading antenna technology to aviation
Kymeta and TECOM bring leading antenna technology to aviation
Business news |
Kymeta and TECOM, a Smiths Microwave brand, have announced a Partner Development Program Agreement for the aviation market. Under the terms of the agreement, TECOM will incorporate Kymeta® mTenna® technology…
LTE Cat 1 module for IoT cellular wireless links
LTE Cat 1 module for IoT cellular wireless links
New Products |
Developed from the ground up by Swiss company u-blox, the UBX-R3 platform delivers IoT cellular connectivity. The platform is at the heart of the first Cat 1 LTE module, LARA-R3,…
HiL simulator fits on designer’s desk
HiL simulator fits on designer’s desk
New Products |
With the new Scalexio LabBox, embedded tool vendor dSpace offers a compact system for hardware-in-the-loop (HIL) tests. The LabBox fits on a desk and can therefore be used for early…
Wide-Bandgap Boosts EVs
Wide-Bandgap Boosts EVs
Technology News |
In 2010, the U.S. Department of Energy (DoE) set a goal for electric vehicle inverters to be boosted from 4.1 kW/L to 13.4 kW/L by 2020. Now, a 12.1-kW/L inverter…
Bluetooth SIG dev kits address security, interoperability
Bluetooth SIG dev kits address security, interoperability
New Products |
The Bluetooth Special Interest Group (SIG) has released updates to its developer toolkit line-up. These toolkits enable developers to build “faster and smarter” when creating designs such as mobile apps…
Chip market going down, says Future Horizons
Chip market going down, says Future Horizons
Market news |
Malcolm Penn, the founder and CEO of Future Horizons Ltd. and usually one of the most bullish of chip market forecasters, thinks 2017 could be a third year of decline…
Chip market going down, says Future Horizons
Chip market going down, says Future Horizons
Market news |
Malcolm Penn, the founder and CEO of Future Horizons Ltd. and usually one of the most bullish of chip market forecasters, thinks 2017 could be a third year of decline…
PoLight raises another $19 million ahead of IPO
PoLight raises another $19 million ahead of IPO
Business news |
PoLight AS (Horten, Norway), a developer of piezo-MEMS auto-focus lens technology, has announced it has raised NOK160 million (about €17 million or $19 million).
MEMS industry group becomes SEMI partner
MEMS industry group becomes SEMI partner
Business news |
The MEMS & Sensors Industry Group, founded fifteen years ago as the MEMS sectors' industry body, is to become a "strategic association partner" of SEMI.
Acquisitions impact power IC vendor rankings
Acquisitions impact power IC vendor rankings
Market news |
Semiconductor Intelligence LLC (SC-IQ), a consulting firm formed by Bill Jewell, has predicted the 2016 ranking of analog and power IC suppliers.
Bluetooth SIG dev kits address security, interoperability
Bluetooth SIG dev kits address security, interoperability
New Products |
The Bluetooth Special Interest Group (SIG) has released updates to its developer toolkit line-up. These toolkits enable developers to build “faster and smarter” when creating designs such as mobile apps…
Bluetooth LE SoC steps up integration, flexibility
Bluetooth LE SoC steps up integration, flexibility
New Products |
Dialog Semiconductor’s claims for its SmartBond DA14681 include highest performance, lowest power consumption, smallest footprint and lowest system cost for creation of IoT devices, spanning wearables, smart home and other…
Heliatek boosts transparent window power
Heliatek boosts transparent window power
Technology News |
German solar film maker Heliatek is developing a film that will be able to harvest infrared and ultraviolet light to generate electrical energy from windows without blocking the visible light.
Spanish startup ready for 1Gbit/s automotive Ethernet
Spanish startup ready for 1Gbit/s automotive Ethernet
Technology News |
Exhibiting at IEEE's Ethernet & IP @ Automotive Technology Day which took place in Paris this year, Spanish startup KDPOF (Knowledge Development for Plastic Optical Fiber) ran a demo of…
Spanish startup takes 1Gbit automotive Ethernet to plastic
Spanish startup takes 1Gbit automotive Ethernet to plastic
Technology News |
Exhibiting at IEEE's Ethernet & IP @ Automotive Technology Day which took place in Paris this year, Spanish startup KDPOF (Knowledge Development for Plastic Optical Fiber) ran a demo of…
Bluetooth Low Energy SoC steps up integration, flexibility
Bluetooth Low Energy SoC steps up integration, flexibility
Dialog Semiconductor’s claims for its SmartBond DA14681 include highest performance, lowest power consumption, smallest footprint and lowest system cost for creation of IoT devices, spanning wearables, smart home and other…


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