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Page 1842
Could Sony, ST, Intel or China acquire InvenSense?
Could Sony, ST, Intel or China acquire InvenSense?
Business news |
Inertial and microphone MEMS provider InvenSense Inc. (San Jose, Calif.), a startup that emerged to go public in August 2011,…
MEMS design contest posts $5,000 first prize
MEMS design contest posts $5,000 first prize
Feature articles |
Cadence, X-Fab, Coventor and Reutlingen University, the sponsors of a two-year worldwide MEMS design contest have announced the opening of…
RISC-V core for IoT beats Cortex-M, claims startup
RISC-V core for IoT beats Cortex-M, claims startup
Technology News |
Fabless chip company GreenWaves Technologies SAS (Villard-Bonnot, France) is getting close to taping out its GAP8 multicore processor, which it…
Ultra-thin substrate integrates ESD protection to eliminate Zener diodes
Ultra-thin substrate integrates ESD protection to eliminate Zener diodes
New Products |
TDK has developed a new ultra-thin ceramic substrate that integrates ESD protection within a multilayer structure to eliminate the need…

Programmable mixed-signal IC technology adds power switching, sequencing
Programmable mixed-signal IC technology adds power switching, sequencing
New Products |
Silego Technology has extended its GreenPAK programmable mixed-signal IC architecture with a device that functions as a completely configurable and very small power management IC, with functions including voltage monitoring,…
Constant current DC-DC LED driver delivers up to 40W
Constant current DC-DC LED driver delivers up to 40W
New Products |
The AL8860 hysteresis mode DC-DC step-down converter from Diodes Incorporated was designed for driving single or multiple series‑connected LEDs efficiently from a voltage source higher than the LED voltage.
Current-sense amp for motor drives
Current-sense amp for motor drives
New Products |
Texas Instruments' latest device for the motor-drive sector is a current-shunt monitor that improves efficiency and accuracy for motor and solenoid control applications.
Interface IC simplifies thermocouple temperature sensing
Interface IC simplifies thermocouple temperature sensing
New Products |
Melexis' MLX90342 is a high-performance quadruple thermocouple interface that provides rapid response and very high levels of accuracy when measuring extreme temperatures. Melexis says it is responding to requirements, notably…
MEMS-based RF switches operate up to 14 GHz
MEMS-based RF switches operate up to 14 GHz
New Products |
Analog Devices has introduced RF switch technology capable of 14 GHz operation, using chip-scale switching elements – MEMS switches – that it is initially aiming at markets such as test…
Murata offers 3-axis MEMS accelerometer
Murata offers 3-axis MEMS accelerometer
New Products |
Murata's SCA3300 series of 3-axis MEMS accelerometers aimed at a broad range of industrial and automotive applications. Measuring 7.6 x 8.6 x 3.3 mm this small surface mounted MEMS sensor…
Analysis and test of PSI5 and SENT sensor protocols
Analysis and test of PSI5 and SENT sensor protocols
New Products |
Vector (Stuttgart, Germany) has introduced CANoe .Sensor, for analysis, simulation and testing of sensor-specific protocols, such as PSI5 and SENT, comprising software and the VT2710 hardware module.
Sensor IC gives accurate RH and temperature
Sensor IC gives accurate RH and temperature
New Products |
The ams' ENS210 sensor module features temperature measurement accuracy of ±0.2°C over the entire range 0°C to 70°C; the device also outputs relative humidity measurements on its I²C interface, enabling,…
Rohm puts global focus on automotive, industrial
Rohm puts global focus on automotive, industrial
Interviews |
At Electronica EE Times Europe caught up with Satoshi Sawamura, the president of Rohm. Co Ltd., which trades as Rohm Semiconductor, and asked him for an update on progress at…
Convolutional neural networks: What’s next?
Convolutional neural networks: What’s next?
Technology News |
When your car can distinguish between a traffic sign and a pedestrian, your photo-sharing app can suggest tags based on who is in the image, and your company’s surveillance system…
IoT dev platform adds multiple wireless connectivity options
IoT dev platform adds multiple wireless connectivity options
New Products |
Cypress Semiconductor (San Jose, CA) has announced a new version of its development platform for the Internet of Things (IoT) that enables wireless connectivity in minutes. The Wireless Internet Connectivity…
MicroVision, STMicroelectronics partner on laser beam scanning technology
MicroVision, STMicroelectronics partner on laser beam scanning technology
Market news |
MicroVision (Redmond, WA), active in ultra-miniature projection display and sensing technology; and STMicroelectronics (Geneva, Switzerland) are to work together to develop, sell, and market MEMS mirror-based laser beam scanning (LBS)…
AMS buys optical firm in sensor technology push
AMS buys optical firm in sensor technology push
Business news |
Analog and mixed-signal circuit and sensor company AMS AG (Premstaetten, Austria) has agreed to buy optical packaging and modules company Heptagon Pte. Ltd. (Singapore) for up to approximately $850 million.
Switcher chip provides high accuracy in non-isolated off-line application
Switcher chip provides high accuracy in non-isolated off-line application
New Products |
Power Integrations has launched a rugged off-line buck switcher IC that survives wide fluctuations in mains supply.
AMS to pay up to $850 million for optical business
AMS to pay up to $850 million for optical business
Business news |
Analog and mixed-signal circuit and sensor company AMS AG (Premstaetten, Austria) has agreed to buy optical packaging and modules company Heptagon Pte. Ltd. (Singapore) for up to approximately $850 million.
ASIC based tight-stability TCXO
ASIC based tight-stability TCXO
New Products |
Housed in a miniature 3.2- x 2.5- x 1.1-mm hermetically sealed ceramic package, the IQXT-274 temperature compensated crystal oscillator (TCXO) delivers a phase noise performance of -145 dBc/Hz.
Melexis CEO: Strong alone
Melexis CEO: Strong alone
Interviews |
With sales of €400 million euros in 2015, Melexis is one of the smaller semiconductor vendors, but a nevertheless a rather successful one. At Electronica, EE Times Europe met Melexis…
RS looks to expand its obsolete device support with tools and infrastructure
RS looks to expand its obsolete device support with tools and infrastructure
Business news |
Distributor RS Components (RS) has developed a tool that can help OEMs and product developers to manage the problem of obsolescence and is looking at expanding its support infrastructure.
NXP drives truck platooning
NXP drives truck platooning
Technology News |
NXP Semiconductors believes there’s no better place than truck “platooning” to demonstrate the merits of autonomous driving. The company sees the digital caravans as a way to showcase both recent…
Ultra-thin substrate integrates ESD protection to eliminate Zener diodes
Ultra-thin substrate integrates ESD protection to eliminate Zener diodes
New Products |
TDK has developed a new ultra-thin ceramic substrate that integrates ESD protection within a multilayer structure to eliminate the need for discrete ESD components.
Six CAN-FD channels through a single USB adapter
Six CAN-FD channels through a single USB adapter
New Products |
The PCAN-USB X6 from Peak Systems connects six CAN FD data paths to a USB bus concentrator. Thus, multiple CAN / CAN FD systems can be connected to a computer…
DC-to-DC converter design boosts coin cell IoT
DC-to-DC converter design boosts coin cell IoT
Technology News |
Toshiba has developed a new on-chip Single-Inductor Multiple-Output (SIMO) DC-DC converter for IoT devices that use coin-type lithium-ion batteries.
Pressure-tolerant Li-S batteries for ‘deep-dive’ AUVs move closer to reality
Pressure-tolerant Li-S batteries for ‘deep-dive’ AUVs move closer to reality
Technology News |
Steatite (Worcestershire, UK) has completed the first phase of a 24-month project to develop a pressure-tolerant lithium sulphur (Li-S) battery pack that can improve the endurance and speed of ‘deep-dive’…
Ten Strategies to minimize cross-platform design complexity in an IoT world
Ten Strategies to minimize cross-platform design complexity in an IoT world
Technology News |
Every engineering project demands tradeoffs among its many specifications, which can be classified into three broad factors: performance, power consumption, and price. Each project has a “sweet spot” somewhere within…


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