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Page 1751
SoC module is built on the Xilinx Zynq UltraScale+ MPSoC
SoC module is built on the Xilinx Zynq UltraScale+ MPSoC
New Products |
The Mercury+ XU1 from Enclustra is a SoC module built around Xilinx' Zynq UltraScale+ MPSoC. It accommodates 6 ARM cores,…
Dow Corning expands optical silicone encapsulants for LEDs
Dow Corning expands optical silicone encapsulants for LEDs
New Products |
Dow Corning added five new optical encapsulants (OEs) to its fast-growing portfolio of advanced LED solutions.
Voice recognition by sensor fusion; radar plus MEMS microphones
Voice recognition by sensor fusion; radar plus MEMS microphones
Market news |
Infineon Technologies has collaborated with XMOS (Bristol, UK) to deliver a new building block for voice recognition. It features a…
Rohde & Schwarz Cybersecurity tests IoT & mobile IP security
Rohde & Schwarz Cybersecurity tests IoT & mobile IP security
New Products |
Rohde & Schwarz has added a security-oriented feature to its radio communications tester, drawing on its expertise from its own…

Development kit for design of Bluetooth-enabled wearables
Development kit for design of Bluetooth-enabled wearables
New Products |
This starter kit from Toshiba supports applications that need to process multiple sensor inputs. The comprehensive development kit that provides the hardware and software needed to create wearable devices. The…
Modular automotive imaging dev kit operates out-of-the-box
Modular automotive imaging dev kit operates out-of-the-box
New Products |
ON Semiconductor’s Modular Automotive Reference System (MARS) is designed to give system and software developers a ready-to-use camera for research and development activities. The MARS platform enables users to reconfigure…
Wireless charging for multiple small devices, simultaneously
Wireless charging for multiple small devices, simultaneously
Market news |
Semtech has disclosed added capabilities planned for its LinkCharge wireless charging platform, enabling it to concurrently charge multiple, low-power devices, typically wearables, using a single transmitter. The technology is being…
Rail-rail op amps combine precision & power efficiency
Rail-rail op amps combine precision & power efficiency
New Products |
LTC6258/59/60 and LTC6261/62/63 are single/dual/quad op amps, that join a family of power efficient op amps ranging from 1.3 MHz GBW product at 20 µA supply current to 720 MHz…
Full-360˚ angle sensor ICs with safety-critical support
Full-360˚ angle sensor ICs with safety-critical support
New Products |
Allegro MicroSystems has added two 0˚ to 360˚ angle sensor ICs that provide contactless high-resolution angular position information based on magnetic Circular Vertical Hall (CVH) technology. Allegro has incorporated advanced…
Backplane connector system maxes signal integrity at 28 Gbps
Backplane connector system maxes signal integrity at 28 Gbps
New Products |
Molex’ Impact zX2 backplane connector system, optimises density and signal integrity performance, while supporting data rates of up to 28 Gbps, in a modular design. The system utilises Molex’ Impel…
Rad-hard 32-ch driver/decoder cuts board space in satellite applications
Rad-hard 32-ch driver/decoder cuts board space in satellite applications
New Products |
Intersil says its highly integrated ISL72813SEH can reduce command and telemetry design size by as much as 50%; the radiation hardened 32-channel driver is the first high current driver to…
Micro-mechanical switches for both power and 5G applications
Micro-mechanical switches for both power and 5G applications
New Products |
A Digital-Micro-Switch (DMS) technology platform from Menlo Micro is now qualified for production, delivering a next-generation wafer-level process that enables the fabrication of micro-mechanical switches for both power and RF…
Organic artificial synapse holds promise for brain-machine technologies
Organic artificial synapse holds promise for brain-machine technologies
Technology News |
Led by associate professor Alberto Salleo from Stanford University (Stanford, CA , an international team of researchers has devised a low-cost, compliant and very energy-efficient artificial synapse mostly made out…
Far-field voice capture demonstrated using radar, audio beamforming
Far-field voice capture demonstrated using radar, audio beamforming
Technology News |
Infineon Technologies AG (Neubiberg, Germany) partnered with XMOS Ltd. (Bristol, UK) to demonstrate far-field voice capture.
SK Telecom, Nokia to cooperate on quantum cryptography
SK Telecom, Nokia to cooperate on quantum cryptography
Business news |
SK Telecom (Seoul, South Korea) has entered into an agreement with Nokia (Espoo, Finland) to cooperate in the quantum cryptography business. Under the agreement, SK Telecom and Nokia will conduct…
3D printer is compatible with 3rd party filaments
3D printer is compatible with 3rd party filaments
New Products |
XYZ printing has introduced a new 3D printer designed for professional users, the da Vinci Jr. 1.0 Pro. Besides offering a number of user-friendly features, the product is compatible to…
Wearable tech: Are we nearly there yet?
Wearable tech: Are we nearly there yet?
Feature articles |
We’ve seen wearable technology accelerate fast but with every year that passes we’re promised that this year will be ‘the’ year for wearable tech and yet we still seem to…
Cree enhances its COB LEDs
Cree enhances its COB LEDs
New Products |
Cree has enhanced its industry-leading XLamp CXA2 family of chip-on-board (COB) LEDs, including new premium color options, higher light output levels and the longest lifetimes published for this type of…
Optical microscanner turns any surface into a virtual UI
Optical microscanner turns any surface into a virtual UI
New Products |
Transforming any surface into a virtual user interface, Bosch Sensortec’s (Reutlingen, Germany) BML050 is an optical MEMS based scanner that promises improved image quality and focus-free projection, creating flexible and…
Keyword-smart MEMS mic solution for voice-controlled devices
Keyword-smart MEMS mic solution for voice-controlled devices
New Products |
STMicroelectronics (Geneva, Switzerland), DSP Group (San Jose, CA), and Sensory (Santa Clara, CA) have collaborated to design ultra-low power voice processing and MEMS microphone circuitry that enables sound detection and…
LoRa-enabled IoT devices to see more test & measurement solutions
LoRa-enabled IoT devices to see more test & measurement solutions
Market news |
Anritsu (Atsugi, Japan) has announced its intent to create new test and measurement solutions for R&D, certification and manufacturing of LoRa-equipped (wireless RF solution for LPWAN IoT) devices. LoRaWAN is…
Volkswagen, Infineon enter innovation program
Volkswagen, Infineon enter innovation program
Partners |
In order to secure early access to future innovation, Volkswagen has entered a partnership with chipmaker Infineon. The move recognizes the fact that the semiconductor technology can offer a significant…
NB-IoT solution streamlines development of LTE IoT devices
NB-IoT solution streamlines development of LTE IoT devices
Market news |
CEVA (Mountain View, CA), provider of signal processing IP, and Hong Kong Applied Science and Technology Research Institute Company (ASTRI) have disclosed Dragonfly NB1, a cost- and power-optimized NB-IoT solution…
Bluetooth 5 SoC offers ultra-low-power wireless IoT connectivity
Bluetooth 5 SoC offers ultra-low-power wireless IoT connectivity
New Products |
ON Semiconductor's (Phoenix, AZ) RSL10 is a flexible, ultra-miniature multi-protocol Bluetooth 5 certified radio System-on-Chip (SoC) for use with the IoT and connected health & wellness sectors that avoids compromising…
Cree’s COB LEDs to operate beyond 60,000 hours at 105°C
Cree’s COB LEDs to operate beyond 60,000 hours at 105°C
New Products |
Cree has enhanced its industry-leading XLamp CXA2 family of chip-on-board (COB) LEDs, including new premium colour options, higher light output levels and the longest lifetimes published for this type of…
360˚ angle sensor IC for safety-critical applications
360˚ angle sensor IC for safety-critical applications
New Products |
Allegro MicroSystems Europe has introduced two new 0˚ to 360˚ angle sensor ICs that provide contactless high-resolution angular position information based on magnetic Circular Vertical Hall (CVH) technology.
Bluetooth-enabled sensor hub targets wearables
Bluetooth-enabled sensor hub targets wearables
New Products |
Toshiba Electronics Europe's EBTZ1041-SK-A1 ‘starter kit’ provides the hardware and software needed to create wearable devices that handle multiple sensor inputs.
Backplane connector system supports up to 28 Gbps
Backplane connector system supports up to 28 Gbps
New Products |
Molex' Impact zX2 Backplane Connector System supports data rates of up to 28 Gbps in a modular design. The system utilises Impel patented ground shielding and footprint technology to enhance…


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