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Page 1676
Chip-scale-pack 200-V GaN transistor is under 10% size of comparable MOSFET
Chip-scale-pack 200-V GaN transistor is under 10% size of comparable MOSFET
New Products |
EPC – Efficient Power Conversion – has added the EPC2046 power transistor for use in applications including wireless power, multi-level…
Nanoalloy slashes platinum use in fuel cell boost
Nanoalloy slashes platinum use in fuel cell boost
Technology News |
A new type of nanomaterial used as a catalyst could provide a key breakthrough for fuel cells says researchers in…
Debug IP firm draws investors, raises £5m
Debug IP firm draws investors, raises £5m
Business news |
Embedded debug and analytics semiconductor IP licensor UltraSoC Technologies Ltd. (Cambridge, England) has raised £5 million (about $6.4 million) and…
ATE core configuration provides power infrastructure for test systems
ATE core configuration provides power infrastructure for test systems
New Products |
National Instruments launched a configurable 19in rack system that provides the core mechanical, power and safety infrastructure to help users…

Flexible printed battery can power wearable sensors
Flexible printed battery can power wearable sensors
Technology News |
Researchers at the University of California San Diego have developed the first printed zinc battery that is flexible, stretchable and rechargeable.
BMA connectors and adapters operate at up to 22GHz
BMA connectors and adapters operate at up to 22GHz
New Products |
Pasternack has released a new line of 52 BMA connectors and adapters with maximum operating frequency of 22GHz. Typical applications include blind mating, rack and panels, phased array systems, RF…
60V, 100V photorelays in a 1.45×2.0x1.75mm package
60V, 100V photorelays in a 1.45×2.0x1.75mm package
New Products |
Toshiba America Electronic Components has added two high-current products to its lineup of photorelays housed in S-VSON4 packages measuring only 1.45x2.0x1.75mm.
Cloud-based DRC/LVS tools: affordable EDA for SMEs
Cloud-based DRC/LVS tools: affordable EDA for SMEs
Feature articles |
The recent expansion of small and medium enterprises needing to produce IC designs to support high growth areas such as Internet of Things (IoT) has led to a new EDA…
MEMS market on 14% CAGR
MEMS market on 14% CAGR
Market news |
The annual market for MEMS components will hit $13.2 billion in 2017 and nearly double to reach $25.5 billion in 2022, according to Yole Developpement.
Bosch, ST lose market share in 2016 MEMS vendor ranking
Bosch, ST lose market share in 2016 MEMS vendor ranking
Market news |
MEMS market leaders Robert Bosch and STMicroelectronics both lost market share in 2016 as their MEMS sales fell on an annual basis, according to the annual top 30 MEMS vendor…
Automotive IC market to grow 22% in 2017
Automotive IC market to grow 22% in 2017
Market news |
The automotive IC market is set to grow to an annual value of $28.0 billion in 2017, up 22.4 percent from $22.9 billion in 2016, according to IC Insights.
Power quality in the medical sector
Power quality in the medical sector
Feature articles |
You may have seen a lot more people checking in at A&E or taking selfies from their hospital bed recently. It’s not that all your Facebook friends have suddenly been…
Time Sensitive Networking (TSN) added to data acquisition platform
Time Sensitive Networking (TSN) added to data acquisition platform
New Products |
NI has developed two multislot Ethernet chassis that add time-based synchronization over Ethernet to the CompactDAQ platform for distributed measurement and test systems.
Intel opens up Thunderbolt 3 for USB-C
Intel opens up Thunderbolt 3 for USB-C
Technology News |
Intel calls its I/O format Thunderbolt 3, “one of the most significant cable I/O updates since the advent of USB”. The all-in-one port specification – power, signal, high-speed data transfer…
Small surface-mount antenna for 863-870MHz / 902-928MHz ISM bands
Small surface-mount antenna for 863-870MHz / 902-928MHz ISM bands
New Products |
Antenova (Hatfield, UK) has added the ‘Grandis’ antenna (SR42I010), an an SMD antenna that is physically smaller yet provides enhanced performance in the 863-870 MHz and 902-928MHz bands. It directly…
Phoenix’ PCB connectivity technology at RS Components
Phoenix’ PCB connectivity technology at RS Components
New Products |
RS Components is now stocking the latest connectivity device based on the innovative SKEDD plug-in technology. Delivering a reduction in purchase and installation cost, the new series of 3.5mm-pitch SDDC…
NXP licenses TMR sensing for automotive
NXP licenses TMR sensing for automotive
Business news |
Crocus Technology SA, a developer of magnetic memory technology founded in France in 2004, has licensed magnetic sensor technology to NXP for use in automotive applications.
Conducting fabric promises power-generating clothes
Conducting fabric promises power-generating clothes
Technology News |
Researchers at the University of Massachusetts Amherst have developed a way to apply breathable, pliable, metal-free electrodes to fabric and off-the-shelf clothing so it feels good to the touch while…
Is voice the next big thing?
Is voice the next big thing?
Technology News |
To date the Amazon Echo, which runs the Amazon Alexa digital assistant has been quite a success, which has just been followed up with the latest Echo featuring a built…
Global mobile operator specializes in IoT
Global mobile operator specializes in IoT
Business news |
A global mobile operator specialized in the Internet of Things (IoT) aims to connect millions of devices around the world – even without Wi-Fi…
NYU WIRELESS, Sprint team up on 5G
NYU WIRELESS, Sprint team up on 5G
Technology News |
Sprint has joined the university research center at the NYU Tandon School of Engineering as an industry affiliate sponsor to combine forces on the development of mobile 5G.
LTE IoT multimode field trials start in China
LTE IoT multimode field trials start in China
Technology News |
Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, plans to commence the first eMTC/NB-IoT/GSM (LTE Cat M1/NB1 and E-GPRS) multimode field trials in China, with China Mobile Research Institute (CMRI)…
Reports: ARM agrees to create Chinese IP firm
Reports: ARM agrees to create Chinese IP firm
Business news |
Processor intellectual property (IP) company ARM and a venture capital fund it helped form in China have agreed to form a Chinese joint venture to create intellectual property for IC…
Many-core processor targets embedded AI applications
Many-core processor targets embedded AI applications
Technology News |
Fabless many-core chip company Kalray SA (Grenoble, France) has announced a third generation of its massively parallel processor architecture (MPPA3) under the codename "Coolidge."…
Intel to open-release Thunderbolt 3 interface spec
Intel to open-release Thunderbolt 3 interface spec
Market news |
Intel calls its I/O format Thunderbolt 3, “one of the most significant cable I/O updates since the advent of USB”. The all-in-one port specification – power, signal, high-speed data transfer…
Samsung adds 4nm and FDSOI processes to roadmap
Samsung adds 4nm and FDSOI processes to roadmap
Technology News |
Samsung Electronics Co. Ltd. has announced a several semiconductor processes that it intends to bring into manufacturing over the next three or four years covering FinFETs, FDSOI and beyond.
LTE IoT multimode field trials start in China
LTE IoT multimode field trials start in China
Technology News |
Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, plans to commence the first eMTC/NB-IoT/GSM (LTE Cat M1/NB1 and E-GPRS) multimode field trials in China, with China Mobile Research Institute (CMRI)…
Globalfoundries, Chengdu to spend big on FDSOI design
Globalfoundries, Chengdu to spend big on FDSOI design
Business news |
Globalfoundries Inc. and Chengdu municipality in China have agreed to spend more than $100 million encouraging the design of chips for mobile, IoT and automotive applications on Globalfoundries' fully-depleted silicon-on-insulator…


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