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Page 1552
Volkswagen, Google collaborate on quantum computing applications
Volkswagen, Google collaborate on quantum computing applications
Partners |
Volkswagen Group and Google have announced extensive research cooperation in the field of quantum computing at the "Web Summit 2017"…
Renesas’ RZ/T1 MPUs now with HIPERFACE DSL support
Renesas’ RZ/T1 MPUs now with HIPERFACE DSL support
New Products |
Renesas Electronics announced a new solution package for its RZ/T1 group of microprocessors (MPUs) now supporting the HIPERFACE DSL digital…
Altia HMI code generation support brings rich graphics to Cypress’ MCUs
Altia HMI code generation support brings rich graphics to Cypress’ MCUs
New Products |
Altia and Cypress Semiconductor have jointly announced Altia HMI code generation support for Cypress' Traveo automotive microcontroller family.
Startup taps ARM computer vision for deep learning skills
Startup taps ARM computer vision for deep learning skills
Business news |
Cambridge imaging technology startup Spectral Edge has appointed the former R&D director of ARM’s computer vision team as its new Chief…

Magnachip simplifies 700V Ultra High Voltage process
Magnachip simplifies 700V Ultra High Voltage process
New Products |
MagnaChip Semiconductor has launched a 0.35 micron 700V Ultra-High Voltage process technology (UHV) that reduces mask counts, manufacturing time and cost for AC-DC products.
Five companies develop next generation space solar power
Five companies develop next generation space solar power
Technology News |
NASA has chosen five US companies to look at power systems that could be used as part of a deep space gateway.
Aluminium electrolytic capacitors boost low profile energy density
Aluminium electrolytic capacitors boost low profile energy density
New Products |
Cornell Dubilier has launched two series of very low profile aluminium electrolytic that claim the highest-energy density available.
Intel’s latest mobile Core processor includes AMD graphics
Intel’s latest mobile Core processor includes AMD graphics
Market news |
In a partnership that would at one time have seemed improbable, Intel has announced that it will introduce a compute module in its 8th generation Core line-up, that will incorporate…
Very low-profile aluminium electrolytic capacitor breaks energy density barriers
Very low-profile aluminium electrolytic capacitor breaks energy density barriers
New Products |
Cornell Dubilier’s THA and THAS Series Thinpack capacitors claim the highest-energy density available in low-profile aluminium electrolytic technology.
Compact automotive chip varistors with high reliability
Compact automotive chip varistors with high reliability
New Products |
TDK Corporation has expanded its product portfolio of chip-varistors for automotive applications with the AVRH series. The components are designed for a maximum operating voltage of 19 V to 70…
Single-chip radio software bridges Bluetooth and Zigbee
Single-chip radio software bridges Bluetooth and Zigbee
New Products |
Silicon Labs’ multiprotocol wireless software has been designed in reponse to application needs for both Bluetooth (essentially, providing smartphone control-compatibility) and Zigbee – widely adopted in mesh networking and control…
FPGA/PLD chips increase I/O & control options
FPGA/PLD chips increase I/O & control options
New Products |
Lattice Semconductors has extended its programmable logic device range with low-power MachXO3-9400 devices with more internal configuration memory and flexible programmable I/O for more complex applications.
Smallest automotive-grade GNSS module comes from u-blox
Smallest automotive-grade GNSS module comes from u-blox
New Products |
With the MX-M8Q-01A GNSS module, Swiss manufacturer u-blox does not only roll out another automotive-grade navigation module. The device is the smallest automotive-grade GNSS module on the market currently available,…
Diecast aluminium enclosures rated to IP 66 and IP 67
Diecast aluminium enclosures rated to IP 66 and IP 67
New Products |
Now available in eight industry-standard sizes, Rolec’s aluPLUS diecast aluminium electronic enclosures are suitable for a wide range of electronics applications in challenging indoor and outdoor industrial environments.
CMOS fab compatible GaN goes to 200mm wafers, could reach 300mm
CMOS fab compatible GaN goes to 200mm wafers, could reach 300mm
Technology News |
A developer of advanced wide bandgap semiconductor materials technologies, Kyma Technologies announced it has used its new K200 hydride vapor phase epitaxy (HVPE) growth tool to produce high quality 200mm diameter…
300W DC/DC power block ruggedized for harsh environments
300W DC/DC power block ruggedized for harsh environments
New Products |
The TEQ 300WIR models are approved to safety standards IEC/UL 60950-1 and UL 508. With the compliance to EN 50155 and EN 61373 they also find place in the Traco…
iPhone X teardown unveils redesigned power subsystems
iPhone X teardown unveils redesigned power subsystems
Technology News |
The teardown of the iPhone X flagship handset from Apple by iFixit and TechInsights shows how the power sub-systems have had to be redesigned to it new functions.
100V, Bidirectional Multiphase Synchronous Buck or Boost Controller
100V, Bidirectional Multiphase Synchronous Buck or Boost Controller
Technology News |
The LTC3871 is a bidirectional synchronous buck or boost controller to step-down or step-up the voltage between the 12V and 48V batteries in dual battery automotive applications.
Augmented reality drone flight simulator app optimized for smart glasses
Augmented reality drone flight simulator app optimized for smart glasses
Collaborating with global drone leader DJI, Epson – providers of the Moverio® augmented reality (AR) smart eyewear platform – have announced the first glasses-based augmented reality drone flight simulator app,…
LG and IDT partner on first Qi Extended Power Profile smartphone
LG and IDT partner on first Qi Extended Power Profile smartphone
Business news |
LG Electronics (LG) and Integrated Device Technology, Inc., (IDT) have partnered on the first implementation of Qi wireless charging Extended Power Profile (EPP) in a flagship smartphone, the LG V30.
Ericsson and Swisscom offer indoor Gigabit LTE
Ericsson and Swisscom offer indoor Gigabit LTE
Ericsson and Swisscom are bringing gigabit connectivity to Swiss consumers – starting with the deployment of the Ericsson Radio Dot System in Swisscom retail stores across Switzerland.
Continental, Osram announce automotive lighting JV
Continental, Osram announce automotive lighting JV
Business news |
There had already been rumors in the past about a planned joint venture between the automotive supplier Continental and lighting technology provider Osram. The companies have now made their intention…
Continental, Osram announce automotive lighting JV
Continental, Osram announce automotive lighting JV
Business news |
There had already been rumors in the past about a planned joint venture between the automotive supplier Continental and lighting technology provider Osram. The companies have now made their intention…
Sensirion offers high accuracy temperature sensor
Sensirion offers high accuracy temperature sensor
New Products |
Sensirion AG, a leading provider of environmental and flow sensors, has developed the STS35 temperature sensor – the most accurate sensor in the STS3x series.
iPhone X teardown shows redesigned power subsystems
iPhone X teardown shows redesigned power subsystems
Technology News |
The teardown of the iPhone X flagship handset from Apple by iFixit and TechInsights shows how the power sub-systems have had to be redesigned to it new functions.
Lithium-ion anode materials double battery capacity
Lithium-ion anode materials double battery capacity
Technology News |
Researchers at the University of Texas at Austin have discovered a family of anode materials that can double the charge capacity of lithium-ion batteries.
Wireless charging chipset features authentication
Wireless charging chipset features authentication
New Products |
Integrated Device Technology (San Jose, CA) has launched a 15W wireless power chipset with bi-directional communication and authentication between the transmitter and receiver.
‘Internet of packaging’ partnership digitizes entire product lifecycle
‘Internet of packaging’ partnership digitizes entire product lifecycle
Market news |
QR Code mobile technology services company Scanbuy (New York, NY) and product serialization, tracking, and tracing services company Kezzler (Oslo, Norway) have partnered to bring the "Internet of Packaging" (IOP)…


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