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Page 1527
Researchers exceed data storage density limit
Researchers exceed data storage density limit
Technology News |
The miniaturization of storage media is reaching fundamental limits. A new approach is to use spin crossover molecules as the…
Automotive, IoT chip markets leave other segments behind
Automotive, IoT chip markets leave other segments behind
Market news |
There are currently two big sellers in the semiconductor market: Automotive and Internet of Things. With an average annual growth…
Broadcom ups the ante on Qualcomm hostile takeover
Broadcom ups the ante on Qualcomm hostile takeover
Business news |
Broadcom Limited is in for the long haul in its takeover of Qualcomm Incorporated – announcing its intention to nominate…
Bias in AI algorithms: How do we keep it out?
Bias in AI algorithms: How do we keep it out?
Feature articles |
Francisco Socal, vision and AI product manager with Imagination Technologies Ltd., discusses the various sources of bias that can enter…

Rohm supplies SiC power modules to Formula E racing team
Rohm supplies SiC power modules to Formula E racing team
Market news |
Rohm (Kyoto, Japan) is to supply full silicon-carbide (SiC) power modules to the Venturi Formula E electric car racing team.
SiC MOSFET research promises improved power devices
SiC MOSFET research promises improved power devices
Technology News |
A research group in Japan has found that the electrical resistance of silicon-carbide SiC can be reduced by two-thirds by suppressing the scattering of conduction electrons in the material. This…
IBM unveils ‘most advanced’ server designed for AI
IBM unveils ‘most advanced’ server designed for AI
Technology News |
IBM (Armonk, NY) has unveiled its next-generation Power Systems servers, which use the company's newly designed POWER9 processor.
6A voltage regulator fits in a cubic millimetre
6A voltage regulator fits in a cubic millimetre
New Products |
Endura Technologies has launched a 3-phase 6A switching regulator inside a package that measures less than one cubic millimetre.
Modular active harmonic filters feature three level IGBT topology
Modular active harmonic filters feature three level IGBT topology
New Products |
Schaffner has launched a new generation of active harmonic filters that use a three level IGBT topology to mitigate emissions to the 50th harmonic.
Six pack power devices in flow90 module cut board costs by half
Six pack power devices in flow90 module cut board costs by half
New Products |
Vincotech has launched a line of six pack modules in its flow90 line of housings to save space in bookshelf inverters and rack-mounted power designs.
3-D printed plastic sensors connect to Wi-Fi
3-D printed plastic sensors connect to Wi-Fi
Technology News |
Researchers at the University of Washington (Seattle, WA) have developed what they claim are the first 3-D printed plastic objects and sensors that can connect to Wi-Fi without electronics.
Renesas bets on SG-MONOS for MCUs with over 100MB of embedded flash
Renesas bets on SG-MONOS for MCUs with over 100MB of embedded flash
Technology News |
A year after it had announced the functional operation of its split-gate metal-oxide nitride oxide silicon (SG-MONOS) 3D flash memory at IEDM 2016, Renesas implemented it as an embedded flash…
RF GaN transistor targets electronic warfare applications
RF GaN transistor targets electronic warfare applications
New Products |
Wolfspeed (Durham, NC), a Cree Company, has showcased its new internally-matched CG2H30070 GaN HEMT device at the 54th Annual AOC International Symposium and Convention. The device is ideal for electronic…
Cellular IoT baseband modem chip claims industry’s lowest power
Cellular IoT baseband modem chip claims industry’s lowest power
New Products |
Vancouver-based startup Riot Micro has made its market debut with the Riot Micro RM1000 chip, which claims to be the industry’s lowest power baseband modem chip for the cellular Internet…
Top ten Chinese chip companies ranked
Top ten Chinese chip companies ranked
Market news |
China's IC design industry revenue will reach RMB200.6 billion (about $30.33 billion) in 2017, an annual growth of 22 percent, according to market research firm TrendForce (Hsinchu, Taiwan).
III-V silicon lasers integrated on 200mm CMOS wafers
III-V silicon lasers integrated on 200mm CMOS wafers
New Products |
French research institute Leti announced it has successfully integrated hybrid III-V silicon lasers on 200mm silicon wafers using a standard CMOS process flow.
MCUs with over 100MB of embedded flash: Renesas bets on SG-MONOS
MCUs with over 100MB of embedded flash: Renesas bets on SG-MONOS
Technology News |
A year after it had announced the functional operation of its split-gate metal-oxide nitride oxide silicon (SG-MONOS) 3D flash memory at IEDM 2016, Renesas implemented it as an embedded flash…
NI provides MAC layer support for Its 802.11 Application Framework for WiFi and 5G research
NI provides MAC layer support for Its 802.11 Application Framework for WiFi and 5G research
New Products |
NI has announced MAC layer support for its LabVIEW Communications 802.11 Application Framework – enabling researchers to take advantage of the new multiuser MAC layer enhancements to the 802.11 Application…
Software tool eases the integration of Ethernet networks in vehicles
Software tool eases the integration of Ethernet networks in vehicles
New Products |
PREEvision guides developers step by step through the complete design process to integrate Ethernet into existing network architectures.
SGVC 3D NAND architecture could easily reach 6Gb/mm2 says Macronix
SGVC 3D NAND architecture could easily reach 6Gb/mm2 says Macronix
Technology News |
At the 2017 IEEE International Electron Devices Meeting (IEDM) that was held in San Francisco, memory manufacturer Macronix International presented test results about its Single-Gate Vertical Channel (SGVC) 3D NAND…
Bluetooth® low energy IC targets automotive applications
Bluetooth® low energy IC targets automotive applications
New Products |
AEC-Q100 compliant for automotive applications, the latest Bluetooth® Low Energy (LE) IC from Toshiba Electronics Europe meets core specification 4.2 and includes support for secure connection, LE privacy features and…
Powerful busbars for safe connection of battery cells
Powerful busbars for safe connection of battery cells
New Products |
Rogers Power Electronics Solutions (PES) has introduced its expanded range of ROLINX busbar solutions. The product variety covers a wide range of applications, including advanced battery technologies for electric and…
4×4 MIMO boosts 4G performance, narrows gap with 5G
4×4 MIMO boosts 4G performance, narrows gap with 5G
Market news |
In a recent report, Strategy Analytics predicts that 4x4 MIMO will gain momentum in the 4G infrastructure market and become a mainstream configuration of flagship smartphones.
Bluetooth LE SoC is automotive-qualified
Bluetooth LE SoC is automotive-qualified
New Products |
Toshiba Electronics Europe introduces a new IC which is compliant with the Bluetooth low energy (LE) Core Specification 4.2 and supports Secure Connection, LE Privacy features and extended BLE packet…
Socio-economic benefits of C-V2X to hit 43 Billion Euros by 2035
Socio-economic benefits of C-V2X to hit 43 Billion Euros by 2035
Market news |
5GAA has published a report, authored by Analysys Mason in conjunction with automotive consultancy SBD Automotive, which weighs up the benefits of cellular vehicle to everything (C-V2X) technology in Europe…
Collaborative German project to deliver power UV LEDs by 2020
Collaborative German project to deliver power UV LEDs by 2020
Technology News |
Last February was launched “UV Power”, a collaborative project funded by the German Federal Ministry of Education and Research (BMBF), bringing together five German research institutes and companies to deliver…
Startup delivers lowest power NB-IoT and eMTC baseband chip
Startup delivers lowest power NB-IoT and eMTC baseband chip
Technology News |
Vancouver-based startup Riot Micro has made its market debut with the Riot Micro RM1000 chip, which claims to be the industry’s lowest power baseband modem chip for the cellular Internet…
RF GaN device for counter-IED and mobile military communications
RF GaN device for counter-IED and mobile military communications
New Products |
Wolfspeed, a Cree Company, has showcased its new internally-matched CG2H30070 GaN HEMT device at the 54th Annual AOC International Symposium and Convention. The device is ideal for electronic warfare C-IED…


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