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Page 1347
DARPA selects Applied Materials for new AI electronic switch
DARPA selects Applied Materials for new AI electronic switch
Technology News |
Semiconductor manufacturing equipment maker Applied Materials has been selected by DARPA to work with ARM Ltd. and research firm Symetrix…
ST reports steady growth set to continue
ST reports steady growth set to continue
Business news |
STMicroelectronics NV (Geneva, Switzerland) has reported its 2018 second quarter with double-digit percentage growth in both sales and profits and…
Carmakers must invest in battery development and recycling, study suggests
Carmakers must invest in battery development and recycling, study suggests
Business news |
The leading car nations are driving the topic of electromobility forward. For this reason and due to speculation, prices for…
Virtual testing of navigation and location of autonomous vehicles
Virtual testing of navigation and location of autonomous vehicles
New Products |
Reliable and accurate information about the exact position and speed of the vehicle at any time is crucial for the…

Virtual testing of navigation and location of autonomous vehicles
Virtual testing of navigation and location of autonomous vehicles
New Products |
Reliable and accurate information about the exact position and speed of the vehicle at any time is crucial for the function of ADAS (Advanced Driver Assistance Systems) or for future…
Process for improved LED production developed
Process for improved LED production developed
Technology News |
More precision and at the same time better efficiency in LED production is promised by research work at the University of Duisburg-Essen in cooperation with the Ruhr West University of…
Self-calibrating meter chip enables embedded electricity measurement
Self-calibrating meter chip enables embedded electricity measurement
New Products |
Analog Devices (ADI) has developed energy metering IC with autocalibration to simplify embedded single-phase energy measurements.
Intel and SiTime to collaborate 5G timing MEMS
Intel and SiTime to collaborate 5G timing MEMS
Business news |
Intel and SiTime are going to collaborate on microelectromechanical systems (MEMS) for timing within Intel's 5G modem platforms.
Researchers find new vulnerabilities in Intel processors
Researchers find new vulnerabilities in Intel processors
Technology News |
Following the discovery of security flaws in Intel processors at the beginning of the year, researchers at the CISPA Helmholtz Centre (Saarbrücken, Germany) have discovered a new security gap. According…
NextInput has doubled sensitivity of force sensors
NextInput has doubled sensitivity of force sensors
New Products |
NextInput Inc. (Mountain View, Calif.), developer of MEMS-based force sensors, has increased the sensitivity of its ForceGauge sensor family by a factor of two.
Researchers discover new Intel processor vulnerabilities
Researchers discover new Intel processor vulnerabilities
Technology News |
Following the discovery of security flaws in Intel processors at the beginning of the year, researchers at the CISPA Helmholtz Centre (Saarbrücken, Germany) have discovered a new security gap. According…
Design win for UltraSoC underlines China’s significance
Design win for UltraSoC underlines China’s significance
Business news |
Embedded analytics IP vendor UltraSoC Ltd. (Cambridge, England) has licensed its technology for use by C-Sky Microsystems Co. Ltd. (Hangzhou, China), a processor company that was acquired by Alibaba Group…
Self-calibrating energy metering IC simplifies measurement
Self-calibrating energy metering IC simplifies measurement
Analog Devices has launched an energy metering IC that has autocalibration to measure single-phase energy applications.
New IP enables smaller DisplayPort implementations
New IP enables smaller DisplayPort implementations
Microsemi has announced that Bitec’s DisplayPort IP core has been optimised for PolarFire FPGAs, which will allow high-quality imaging in a small, low-power form-factor.
HMS Industrial Networks acquires Beck IPC 
HMS Industrial Networks acquires Beck IPC 
HMS Industrial Networks has purchased all shares in the German embedded communications provider Beck IPC GmbH.
UltraSoC’s Alibaba design win underlines China’s significance
UltraSoC’s Alibaba design win underlines China’s significance
Business news |
Embedded analytics IP vendor UltraSoC Ltd. (Cambridge, England) has licensed its technology for use by C-Sky Microsystems Co. Ltd. (Hangzhou, China), a processor company that was acquired by Alibaba Group…
IPD driver targets 3-phase brushless motors
IPD driver targets 3-phase brushless motors
New Products |
Toshiba Electronics Europe has launched a MOSFET gate driver intelligent power device (IPD) to drive 3-phase brushless motors.
PMICs target AI in next generation consumer designs
PMICs target AI in next generation consumer designs
New Products |
Maxim Integrated Products has launched a pair of high performance scalable power management ICs (PMICs) for computationally intensive deep-learning systems on chip (SoCs), FPGAs and application processors.
Intel processors: Researchers discover new vulnerabilities
Intel processors: Researchers discover new vulnerabilities
Technology News |
Following the discovery of security flaws in Intel processors at the beginning of the year, researchers at the CISPA Helmholtz Centre (Saarbrücken, Germany) have discovered a new security gap. According…
AMS improves Cambridge gas sensor ICs
AMS improves Cambridge gas sensor ICs
New Products |
AMS AG (Premstaetten, Austria) has improved the functionality of its CCS8xx family of gas sensor ICs to reduce initialization time and improve performance in indoor air-quality monitoring applications.
Samsung ramps production of 96-layer 3D-NAND flash
Samsung ramps production of 96-layer 3D-NAND flash
New Products |
Samsung Electronics has started mass production of a 96-layer 256Gbit 3D-NAND flash and has tipped it is getting ready to launch 1Tbit and quad-level cell technology.
SMIC preps the world’s largest 200mm wafer fab
SMIC preps the world’s largest 200mm wafer fab
Business news |
Chip foundry Semiconductor Manufacturing International Corp. (Shanghai, China) has started moving chip making equipment in to what it has claimed will be the largest 200mm wafer fab in the world,…
NextInput raises funds from Marvell co-founders
NextInput raises funds from Marvell co-founders
Business news |
NextInput Inc., a developer of MEMS-based force sensors, has raised $13 million in Series B round of finance and added Sehat Sutardja to the board of directors.
NextInput doubles force sensor sensitivity
NextInput doubles force sensor sensitivity
New Products |
NextInput Inc. (Mountain View, Calif.), developer of MEMS-based force sensors, has increased the sensitivity of its ForceGauge sensor family by a factor of two.
IMEC, Soitec stack device layers
IMEC, Soitec stack device layers
Technology News |
Research institute IMEC and SOI wafer supplier Soitec have demonstrated the stacking of active device layers implemented in 300mm-diameter wafers in a process known as sequential 3D planar.
BluGlass pushes to commercialize RPCVD
BluGlass pushes to commercialize RPCVD
Interviews |
BluGlass Ltd. (Silverwater, Australia), a developer of remote plasma chemical vapor deposition (RPCVD) semiconductor manufacturing technology, has raised approximately AUD$11.2 million (about US$8.3 million) for a push to commercialize its…
Intel selects SiTime for 5G timing MEMS
Intel selects SiTime for 5G timing MEMS
Business news |
Intel and SiTime are going to collaborate on microelectromechanical systems (MEMS) for timing within Intel's 5G modem platforms.
IoT sensing platform adds image, video capture
IoT sensing platform adds image, video capture
New Products |
IoT sensing solutions company Polysense Technologies (Santa Clara, CA) has announced the commercial availability of image and video capturing on its LoRa-based WxS end node and iEdge computing platform.


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