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New Products Page 977

New Products Page 977
Duo of driver chip and IGBT gate drivers target HEV powertrain
Duo of driver chip and IGBT gate drivers target HEV powertrain
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Designed for the main inverter of hybrid and electric vehicles (HEV), Infineon's next generation of high-voltage IGBT gate drivers enable…
Requirements lifecycle management tool targets safety-critical FPGA and ASIC design
Requirements lifecycle management tool targets safety-critical FPGA and ASIC design
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Aldec's Spec-TRACER is a requirements lifecycle management solution for use in safety-critical industries in which rigorous certification standards exist; such…
Ultra-wideband doherty amplifiers
Ultra-wideband doherty amplifiers
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NXP Semiconductors has made available its ultra-wideband Doherty reference design using the BLF884P and BLF884PS – the industry’s first wideband…
High-voltage IGBT gate drivers speed ASIL C/D designs for HEV subsystems
High-voltage IGBT gate drivers speed ASIL C/D designs for HEV subsystems
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Infineon Technologies AG has introduced the company's next generation of high-voltage IGBT gate drivers.

Family of modules provides all-in-one LTE connectivity for M2M
Family of modules provides all-in-one LTE connectivity for M2M
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French 4G chipmaker Sequans Communications has introduced a new line of LTE modules with a complete RF front end and key interfaces in a single, compact package for M2M designs.
Bluetooth low energy chip doubles the battery life of app-enabled peripherals
Bluetooth low energy chip doubles the battery life of app-enabled peripherals
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Dialog Semiconductor has launched what it claims is the industry's lowest power Bluetooth system-on-chip.
Driver chip features primary-side peak-current mode for high-brightness LEDs
Driver chip features primary-side peak-current mode for high-brightness LEDs
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ZMDI (Dresden, Germany) has introduced the ZSLS7031, a primary-side peak-current mode LED driver for high-brightness LED lighting. This product is suited for many consumer, commercial and industrial lighting applications, particularly…
Bluetooth SoC only draws 3.8mA at transmission and reception
Bluetooth SoC only draws 3.8mA at transmission and reception
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With SmartBond, Dialog Semiconductor has released what the company claims to be the world's lowest power and smallest Bluetooth Smart System-on-Chip (SoC), which more than doubles the battery life of…
Test card evaluates mobile device behaviour in extreme temperatures
Test card evaluates mobile device behaviour in extreme temperatures
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With the increase of M2M (Machine to Machine) communication, mobile device requirements are increasing as well. Comprion's new test card helps confirm the proper functioning of mobile phones in extreme…
World’s lowest power Bluetooth smart chip is unveiled
World’s lowest power Bluetooth smart chip is unveiled
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Dialog Semiconductor plc launches SmartBond, which claims to be the world’s lowest power and smallest Bluetooth Smart System-on-Chip that more than doubles the battery life of an app-enabled smartphone accessory…
Industrial USB camera delivers 2592×1944 pixels at 15fps in a 23×26.5×21.5mm casing
Industrial USB camera delivers 2592×1944 pixels at 15fps in a 23×26.5×21.5mm casing
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With the XS, IDS is launching a generation of cameras that combines the convenient operation of a standard consumer camera, along with the versatility of a robust industrial camera. The…
Automotive “personality” for digital oscilloscope measurement set
Automotive “personality” for digital oscilloscope measurement set
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A number of enhancements have been introduced to the Yokogawa DLM4000 Series of 8-channel mixed-signal oscilloscopes. These include the L16 option, which adds 16 extra channels of logic, plus upgraded…
New contender for lowest-power Bluetooth Smart chip; battery life could double
New contender for lowest-power Bluetooth Smart chip; battery life could double
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Dialog Semiconductor has launched what it claims is the industry's lowest power Bluetooth system-on-chip.
M2M over LTE provided my module product line
M2M over LTE provided my module product line
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French 4G chipmaker Sequans Communications has introduced a new line of LTE modules with a complete RF front end and key interfaces in a single, compact package for M2M designs.
Fluke’s wireless measurement DMM toolkit
Fluke’s wireless measurement DMM toolkit
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Distributor Farnell element14 is to stock the Fluke CNX3000 wireless multimeter, which allows you to solve problems faster and manage results from multiple sources.
EDA environment for the analysis of on chip passive devices
EDA environment for the analysis of on chip passive devices
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Sonnet Software has announced, Blink™, an easy-to-use EDA environment for the analysis of on chip passive devices such as spiral inductors and MIM capacitors. Blink will be available to the…
Tiny multilayer chip beads attenuate EMC noise
Tiny multilayer chip beads attenuate EMC noise
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TDK has developed a miniaturised multilayer chip bead series that is nearly 80% smaller in volume and 65% in area than existing types with comparable performance, showing high impedance values…
Rogers to show advanced circuit materials at IMS 2013
Rogers to show advanced circuit materials at IMS 2013
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Rogers Corporation will highlight several of its high quality printed circuit board (PCB) materials at the upcoming 2013 IEEE International Microwave Symposium (IMS). In addition, John Coonrod, Rogers Market Development…
Programmable power supplies now rated to 800W
Programmable power supplies now rated to 800W
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TDK has added to its Z+ Series of PSUs with higher power units for standalone or system applications, that can be 2U rack mounted…
OMAP5432 processor-based EVM boosts graphics capabilities for industrial applications
OMAP5432 processor-based EVM boosts graphics capabilities for industrial applications
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Texas Instruments Incorporated has introduced the company's OMAP5432 processor-based evaluation module (EVM) for high-performance industrial applications to help developers jumpstart their product designs.
DMA reference design is released for Stratix V and PCIe Gen3 solutions
DMA reference design is released for Stratix V and PCIe Gen3 solutions
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Altera Corporation's 28 nm Stratix V GX FPGAs have achieved inclusion on the latest PCI-SIG Integrators List for the PCI Express (PCIe) 3.0 specification (Gen3).
UL-certified software streamlines development for consumer functional safety
UL-certified software streamlines development for consumer functional safety
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New UL-certified software packages from Texas Instruments are helping make designing functional safety consumer applications using C2000 real-time control microcontrollers (MCUs) easier and faster.
Cadence launches massively parallel timing tool to speed SoC design
Cadence launches massively parallel timing tool to speed SoC design
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Cadence Design Systems has launched a new static timing analysis and closure tool designed to run on passively parallel hardware and enable System-on-Chip (SoC) developers to speed timing closure and…
39 nH, 01005, is more inductance in smaller space
39 nH, 01005, is more inductance in smaller space
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Murata says it is offering the largest inductor value available within a standard ultra-miniature 01005 (EIA) package size measuring 0.4 x 0.2 x 0.2 mm…
Rugged SBC offers flexible I/O for data processing in compact displays
Rugged SBC offers flexible I/O for data processing in compact displays
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MEN Micro has launched a low power, rugged single board computer (SBC) with a 1.6GHz Atom processor that incorporates flexible I/O for demanding graphics environments.
MLCC types address automotive and industrial markets
MLCC types address automotive and industrial markets
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TDK Corporation has expanded its portfolio of automotive-grade multi-layer ceramic capacitors (MLCCs) with new mid-voltage types featuring C0G temperature characteristics and rated voltages from 100 V to 630 V. Typical…
ZigBee single-chip solution connects smart lighting to infrastructure
ZigBee single-chip solution connects smart lighting to infrastructure
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To simplify the development of ZigBee wireless connectivity-enabled smart energy infrastructure, home and building automation and intelligent lighting gateways, Texas Instruments Incorporated announced the availability of the CC2538 system-on-chip (SoC).
u-blox to develop 3G HSPA module based on Intel’s XMM 6255 HSPA platform
u-blox to develop 3G HSPA module based on Intel’s XMM 6255 HSPA platform
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Swiss-based u-blox announced it is collaborating with Intel to bring a small, cost-effective 3G-only HSPA module to the market.


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