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New Products Page 534

New Products Page 534
Multicore RTOS for high performance embedded systems
Multicore RTOS for high performance embedded systems
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In its latest release, Hipperos version 17.02 adds features such as explicit support for hardware acceleration, fast multicore inter-processor communications…
10W PSU modules for Class 1 and Class 2 environments
10W PSU modules for Class 1 and Class 2 environments
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MTM Power’s (Mellenbach, Germany) Print Power module series PMAS10 offers low (quiescent) power consumption in unswitched (always-on) operation.
Pre-integrated Release 13 Cat-NB1 modem SoC
Pre-integrated Release 13 Cat-NB1 modem SoC
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CEVA, Inc., and Hong Kong Applied Science and Technology Research Institute Company Limited (ASTRI) have introduced the Dragonfly NB1, a…
Toolkit tracks driver behavior during test rides
Toolkit tracks driver behavior during test rides
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Throughout the development of new cars, test drives are necessary time and again. The ergonomics experts from Ergoneers GmbH (Manching,…

Embedded secure element chip for mobile, wearables, and IoT
Embedded secure element chip for mobile, wearables, and IoT
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NXP Semiconductors N.V., (Eindhoven, Netherlands) has unveiled its PN80T embedded Secure Element (SE) and NFC system. Claiming to be the industry's first 40nm SE, the PN80T is designed to ease…
SLAM solution targets next-gen mixed, augmented, and virtual reality apps
SLAM solution targets next-gen mixed, augmented, and virtual reality apps
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Mobile computer vision firm Occipital, Inc. (San Francisco, CA) and 3D imaging and vision processor company Inuitive Ltd. (Ra'anana, Israel) have jointly developed a complete hardware and software solution to…
Industrial wireless access point supports up to 867Mbps
Industrial wireless access point supports up to 867Mbps
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Able to transmit data up to 867 Mbps, the BAT 867-R access point is the fastest wireless device in Belden’s (St. Louis, MO) portfolio, offering essential interfaces for wireless local…
Industrial wireless access point supports up to 867 Mbps
Industrial wireless access point supports up to 867 Mbps
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Able to transmit data up to 867 Mbps, the BAT 867-R access point is the fastest wireless device in Belden’s portfolio, offering essential interfaces for wireless local area network (WLAN)…
Quad-FPGA prototyping solution upgraded to Intel’s 14nm Stratix 10
Quad-FPGA prototyping solution upgraded to Intel’s 14nm Stratix 10
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Pro Design has upgraded its proFPGA prototyping hardware with Intel's Stratix 10 FPGA technology. Assembled with 4 pluggable Intel Stratix 10 SG280-based FPGA modules, the quad system offers a capacity…
MEMS scanner allows portable focus-free laser projection
MEMS scanner allows portable focus-free laser projection
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Bosch Sensortec designed the BML050 high-precision MEMS scanner to support focus-free laser projection, turning any surface into a virtual user interface.
SLAM module combines depth sensor and depth processing chip
SLAM module combines depth sensor and depth processing chip
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Occipital, Inc. and Inuitive Ltd. have jointly developed a complete hardware and software solution to enable efficient room-scale sensing and SLAM (simultaneous localization and mapping) for reality, augmented reality and…
ezDisplay UART OLED and LED modules at Mouser
ezDisplay UART OLED and LED modules at Mouser
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Mouser Electronics is now stocking low-power ezDisplay UART OLED and LED modules from Lumex. Each Lumex ezDisplay UART OLED and LED module comes equipped with the necessary onboard driver IC…
First 40nm embedded secure element chip for mobile and IoT devices
First 40nm embedded secure element chip for mobile and IoT devices
New Products |
NXP Semiconductors N.V., has unveiled its PN80T embedded Secure Element (SE) and NFC system. Claiming to be the industry's first 40nm SE, the PN80T is designed to ease development and…
SMT mmWave switch for 5G wireless demonstration systems
SMT mmWave switch for 5G wireless demonstration systems
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MACOM Technology Solutions Inc., has announced the latest entry in its portfolio of components and integrated modules for 5G wireless infrastructure.
Interface-oriented FPGAs enable MIPI, video bridging
Interface-oriented FPGAs enable MIPI, video bridging
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Lattice Semiconductor has added to the capabilities of its CrossLink programmable ASSP (pASSP) offering to expand video bridging scenarios with the release of three CrossLink intellectual property (IP) and two…
ON Semi claims lowest power integrated Bluetooth LE
ON Semi claims lowest power integrated Bluetooth LE
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ON Semiconductor's RSL10 is a flexible, ultra-miniature multi-protocol Bluetooth 5 certified radio System-on-Chip (SoC) for use with the IoT and connected health & wellness sectors that avoids compromising battery life…
LXI digitizers for multi-channel HF signal capture & analysis
LXI digitizers for multi-channel HF signal capture & analysis
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Offering fully synchronous Gsample/sec acquisition on up to 24 channels, Spectrum (Grosshansdorf, Germany) has introduced its DN6.22x series of LXI digitizers, developing the company’s digitizerNetbox products by adding eight models…
512 Gbit, 64-layer flash memory sampling – 1 TByte in a package is next
512 Gbit, 64-layer flash memory sampling – 1 TByte in a package is next
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Toshiba has announced sampling of 64-layer, 512-gigabit 3D flash memory, the largest device it has built to date in its BiCS FLASH chip series.
1200V SiC MOSFET in low-inductance package
1200V SiC MOSFET in low-inductance package
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Wolfspeed, part of Cree, has expanded its C3M silicon carbide device platform with a 1200V, 75 mΩ (on-resistance) MOSFET a low-inductance discrete package the company also recently released.
20A 48V ZVS, 10×14 mm buck regulator modules, by Vicor
20A 48V ZVS, 10×14 mm buck regulator modules, by Vicor
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PI3525-00-LGIZ is the latest addition to Vicor's Cool-Power ZVS buck regulators with a 48V (30-60 Vin) input. The PI352x is a higher current offering than the existing PI354x portfolio enabling…
BeagleBoards added for industrial and maker developers
BeagleBoards added for industrial and maker developers
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Distribution company Farnell element14 is adding to its BeagleBoard range; three added products comprise BeagleBone Black Wireless, the element14 Wireless Connectivity Cape and the element14 4.3in. Display Cape.
High-speed cabling routes data centre traffic faster than PCBs
High-speed cabling routes data centre traffic faster than PCBs
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Molex' BiPass cable assemblies offer high-speed, high-density connections; the I/O and backplane assemblies reduce signal to noise ratios and simplify installation.
Time-of-flight sensor has doubled range
Time-of-flight sensor has doubled range
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STMicroelectronics has launched its third-generation time-of-flight (ToF) laser ranging sensor, the VL53L1, which brings multi-object detection and multi-array scanning as well as doubling range of operation to above 4.5m.
Bidirectional power-switching contactor cuts size and weight
Bidirectional power-switching contactor cuts size and weight
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TE Connectivity (TE) has launched a smaller, lighter version of its KILOVAC current-sensing (KCS) high-voltage contactors that weighs just 145g.
Bluetooth dongle accomplishes 720 kbps over 300 meters
Bluetooth dongle accomplishes 720 kbps over 300 meters
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An exceptional broadcast range of 300 meters in free space at data rates up to 720 kbps promises SE Spezial Electronic (Bückeburg, Germany) to users of its SE Skipper UBT21-1…
Pico’s USB scope software now decodes CAN FD
Pico’s USB scope software now decodes CAN FD
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Pico Technology, maker of PC oscilloscopes and data loggers, has added CAN FD decoding to its PicoScope 6 software. This software, available free of charge for all PicoScope oscilloscopes, delivers…
Gate driver allows 4kV isolation for 3.3V microcontrollers
Gate driver allows 4kV isolation for 3.3V microcontrollers
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IXYS has announced a 10A/4000V, dual channel, isolated gate-driver.
Integrated 3A MOSFET voltage regulator for high-density applications
Integrated 3A MOSFET voltage regulator for high-density applications
New Products |
Infineon's IR3883 is a fully integrated and highly efficient DC-DC regulator. It aims at high density Point of Load applications where high efficiency, high reliability and good thermal behaviour are…


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