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New Products Page 108

New Products Page 108
Fast charging for single cell designs with dual phase switched capacitor architecture
Fast charging for single cell designs with dual phase switched capacitor architecture
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Halo Microelectronics in the US has launched two fast charging chips using a dual-phase switched capacitor architecture for single-cell battery…
AI processor IP for SoCs
AI processor IP for SoCs
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Electronic design automation company Synopsys has announced a new neural processing unit (NPU) IP and toolchain that the company says…
Autonomous DAQ engine evaluates sensor data
Autonomous DAQ engine evaluates sensor data
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Small hand-size DAQ computer suitable for Industry 4.0 functions autonomously and has 16 channels for feeding voltage values.
AI and DSP boost for FPGA signal processing
AI and DSP boost for FPGA signal processing
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AMD has launched a premium version of its Versal FPGA with AI chiplets for next-generation radar and wireless systems. The…

3rd-gen HYPERRAM doubles bandwidth for IoT applications
3rd-gen HYPERRAM doubles bandwidth for IoT applications
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Specialty memory IC company Winbond and semiconductor manufacturer Infineon Technologies have announced the expansion of their HYPERRAM product collaboration - a high-speed, low-pin-count, low-power pseudo-SRAM for high-performance embedded systems requiring…
Autonomous DAQ engine for evaluating sensor data
Autonomous DAQ engine for evaluating sensor data
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Acceed in Germany has launched an autonomous data recording system for industrial automation. The MCM-216 data acquisition (DAQ) system functions autonomously and has 16 channels for feeding voltage values. Its…
Multi-band tracking antenna enables EW-resiliance
Multi-band tracking antenna enables EW-resiliance
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Tracking antenna fro air-ground comms can operate on two RF bands at once, delivering improved robustness and tracking aircraft without GPS.
Accuracy boost for GaN and SiC semiconductor analysis
Accuracy boost for GaN and SiC semiconductor analysis
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Teledyne LeCroy has launched an optically isolated 1GHz measurement system for gallium nitride (GaN) and silicon carbide (SiC) power devices. The DL-ISO High Voltage Optically Isolated 1 GHz Probe and…
Neural processor IP for high-performance AI SoCs
Neural processor IP for high-performance AI SoCs
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Electronic design automation company Synopsys has announced a new neural processing unit (NPU) IP and toolchain that the company says delivers the industry's highest performance and support for the latest,…
Cloud-based AI for industrial asset monitoring
Cloud-based AI for industrial asset monitoring
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Sensata Technologies Holding plc has announced a software platform that makes it possible to monitor industrial and commercial remotely. The system uses multiple sensors and allows them to be monitored…
Samsung targets automotive with 13 high temperature MLCCs for powertrain designs
Samsung targets automotive with 13 high temperature MLCCs for powertrain designs
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Samsung Electro-Mechanics has developed high-temperature Multi-Layer Ceramic Capacitor (MLCC) for powertrains in a move to target the automotive market It has developed 13 types of automotive MLCCs with guaranteed use…
Tasking extends tool across Infineon ARM automotive chips
Tasking extends tool across Infineon ARM automotive chips
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German embedded tool developer Tasking has updated its VX-Toolset to support Infineon’s latest automotive microcontroller. The compiler in version 6.0r1 of the VX-Toolset for ARM Cortex-M now supports the Infineon TRAVEO…
First PCIe 6.0 clock buffers and multiplexers
First PCIe 6.0 clock buffers and multiplexers
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Renesas Electronics has introduced the first clock buffers and multiplexers that meet the requirements of the PCI Express 6 (PCIe 6.0) specifications. There are 11 new clock buffers and four…
LoRa platform supports seamless worldwide asset tracking
LoRa platform supports seamless worldwide asset tracking
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Analog and mixed-signal semiconductor supplier Semtech has announced the addition of multi-band capabilities to its LoRa Edge device-to-Cloud geolocation platform, enabling satellite-based networks and simplifying terrestrial network interoperability.
First space-qualified serial interface F-RAM
First space-qualified serial interface F-RAM
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QML-V qualified F-RAM provides 2 Mb density non-volatile storage for extreme environments and nearly infinite endurance.
PCB design software adds collision detection, board folding
PCB design software adds collision detection, board folding
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Pulsonix has announced version 12.0 of its PCB design software with speed improvements and additional features such as board folding and collision detection. Board folding and collision detection allows designers…
OpenCPU system for 5G FWA based on R16-compliant module
OpenCPU system for 5G FWA based on R16-compliant module
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5G FWA system compliant with the advanced 3GPP Release 16 standards, supporting Wi-Fi 6E, up to 160 MHz of bandwidth as well as 4096 QAM.
AI software platform enables giant model training
AI software platform enables giant model training
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AI processor company Cerebras Systems has announced that it has expanded its software platform to enable developers to seamlessly scale large language models.
Neuromorphic analog processor test chip embodies ‘tiny AI’
Neuromorphic analog processor test chip embodies ‘tiny AI’
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Semiconductor company POLYN Technology, has announced that its first neuromorphic analog signal processor (NASP) chip is packaged and evaluated, demonstrating proof of the technology’s brain-mimicking architecture.
First PCIe Gen6 clock buffers and multiplexers
First PCIe Gen6 clock buffers and multiplexers
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PCIe Gen6 clock buffers and multiplexers offer high output count, small packages, and design margin for future requirements.
1200 V SiC MOSFETs deliver highest system efficiency and reliability
1200 V SiC MOSFETs deliver highest system efficiency and reliability
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Advanced SiC MOSFET technology enables a significantly larger gate operation window that improves the on-resistance for a given die size.
First space-qualified serial interface FRAM
First space-qualified serial interface FRAM
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Infineon Technologies has developed the industry’s first radiation-hardened serial interface Ferroelectric RAM (FRAM) for space applications. The FRAM memories have higher reliability and data retention and are more energy efficient…
Drop-in rad-tolerant power modules enable on-orbit processing
Drop-in rad-tolerant power modules enable on-orbit processing
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Mission-critical technologies provider Mercury Systems has announced a new line of drop-in ultra-compact radiation-tolerant power supplies designed for commercial and space applications.
1200V SiC MOSFETs cut on resistance
1200V SiC MOSFETs cut on resistance
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Infineon Technologies has launched a 1200V silicon carbide device with significantly larger gate operation window that improves the on-resistance for a given die size. The CoolSiC MOSFET 1200 V M1H…
Automotive class-G audio amplifier delivers high-definition sound
Automotive class-G audio amplifier delivers high-definition sound
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Integrated audio amplifier reduces size and weight, cuts the bill of materials, simplifies circuit design, and saves developing firmware.
New software engine makes ADAS development faster, cheaper
New software engine makes ADAS development faster, cheaper
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A new iteration of the LeddarEngine platform is powered by LeddarTech’s LCA3 SoC and state-of-the-art modular software, enabling improved sensor performance with the lowest development time.
Controller IP for 800G Ethernet chips designs
Controller IP for 800G Ethernet chips designs
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Cadence Design Systems has developed a High-Speed Ethernet Controller IP family which enables complete Ethernet subsystem solutions up to 800G when used with Cadence SerDes PHY IP in 7nm, 5nm…
Cybersecurity software, dev kit for STM32U5 MCUs
Cybersecurity software, dev kit for STM32U5 MCUs
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Security software solutions developer NXM has announced the release of its NXM Autonomous Security platform for STMicroelectronics series of ultra-low-power (ULP) STM32U5 microcontrollers (MCUs).


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