MENU

Feature articles Page 115

Feature articles Page 115
Low-frequency vibrations can be energy-harvested, say researchers
Low-frequency vibrations can be energy-harvested, say researchers
Feature articles |
Singapore-based researchers have reported success in harvesting vibrations to power microsensors; they are developing a means of efficiently harnessing low…
Android development kit for IoT apps – distributor issues the RIoT board
Android development kit for IoT apps – distributor issues the RIoT board
Feature articles |
‘Revolutionising the Internet of Things’ leads to the tag line of the “RIoT” board from Farnell element14; an open source,…
LPRS’ low-power wireless connectivity for Raspberry Pi now in distribution
LPRS’ low-power wireless connectivity for Raspberry Pi now in distribution
Feature articles |
Raspberry Pi products available from RS feature low-power RF technology, and Wi-Fi, to add low cost, low power wireless functionality…
This Week; Chip markets pick up, ARM shares quiver, CMOS keeps on keepin’-on
This Week; Chip markets pick up, ARM shares quiver, CMOS keeps on keepin’-on
Feature articles |
Analysts IHS report that the industrial electronic chip market turned around in 2013 with double-digit growth.

Wearables in cars – a long way to go for programmers
Wearables in cars – a long way to go for programmers
Feature articles |
The latest trend for electronics in vehicles is wearables of any form factor. At the recent Consumer Electronics Show (CES), a herd of exhibitors played around with this type of…
Opinion: the hyperspectral era has already begun
Opinion: the hyperspectral era has already begun
Feature articles |
Research institute IMEC, a pioneer of hyperspectral imaging, is helping roll out the technology in high-end markets but we should not lose sight of the fact that hyperspectral imaging is…
Software-defined radio platforms host Xilinx Kintex FPGAs, span DC-6GHz
Software-defined radio platforms host Xilinx Kintex FPGAs, span DC-6GHz
Feature articles |
National Instruments company Ettus Research’s latest software-defined radio platforms incorporate Kintex-7 FPGAs and offer 2x2 MIMO capability…
Cadence renews efforts on high-level synthesis: snaps up Forte
Cadence renews efforts on high-level synthesis: snaps up Forte
Feature articles |
High-Level Synthesis, “has moved beyond early adopters toward mainstream adoption by market-leading system and semiconductor companies” - according to Cadence, in a statement announcing its acquisition of Forte Design Systems.
ARM ups revenues, sees shares slide
ARM ups revenues, sees shares slide
Feature articles |
Processor IP market leader ARM reported its figures for the last quarter of 2013 yesterday and despite recording revenues of $303million for the quarter – exceeding market expectations and taking…
Commercial camera sector gains hyperspectral imaging sensor technology
Commercial camera sector gains hyperspectral imaging sensor technology
Feature articles |
Belgian nanoelectronics research centre Imec is forming strategic partnerships to expand the ecosystem around its hyperspectral image sensor technology – that is, sensing specific optical bands both within and outside…
Lime moves from SiGe to CMOS for its latest wideband CMOS software-radio chip
Lime moves from SiGe to CMOS for its latest wideband CMOS software-radio chip
Feature articles |
Lime Microsystems hasd been proactive in pushing the conecpt of open-source hardware for RF; the same thinking has contributed to the definition of a wideband CMOS RF chip.
Reconfigurable CMOS RF Front-End serves global LTE bands in one technology
Reconfigurable CMOS RF Front-End serves global LTE bands in one technology
Feature articles |
Peregrine Semiconductor has introduced “Global 1” - an offering that includes a CMOS power amplifier that can deliver comparable RF performance to GaAs devices, for use in worldwide LTE handset…
Wearables in cars – a long way to go for app designers
Wearables in cars – a long way to go for app designers
Feature articles |
The latest trend for electronics in vehicles is wearables of any form factor. At the recent Consumer Electronics Show (CES), a herd of exhibitors played around with this type of…
Manufacturers’ top tips to cost-effective 3D IC production
Manufacturers’ top tips to cost-effective 3D IC production
Feature articles |
From a manufacturer’s perspective, 3D IC production will only ramp up if the added costs for implementing Through Silicon Vias (TSVs) and all the subsequent processing steps can be largely…
Packaged T&M unit for EMC test to 26.5 GHz
Packaged T&M unit for EMC test to 26.5 GHz
Feature articles |
Rohde & Schwarz’ R&S CEMS100, is an off-the-shelf solution for EMS testing. The established R&S ESR EMI test receiver now also covers the frequency range up to 26.5 GHz, and…
24-bit, 192 kHz audio goes mobile
24-bit, 192 kHz audio goes mobile
Feature articles |
Wolfson Microelectronics’ WM5102S is an addition to the company’s Audio Hub portfolio, which will allow consumers to experience 24-bit, 192 kHz high-resolution Master Hi-Fi audio playback on a mobile device.
Building a capacitive touch interface on a dual-technology display
Building a capacitive touch interface on a dual-technology display
Feature articles |
Yota Devices, makers of the YotaPhone, designed a dual function display that combines LCD for a “normal” smartphone display, plus and e-paper display to retain information when the phone is…
Precision measurements on PCBs to meet faster signalling specifications
Precision measurements on PCBs to meet faster signalling specifications
Feature articles |
Agilent’s E5063A PCB Analyser for PCB impedance test in manufacturing claims advances in accuracy, repeatability and reproducibility (R&R). The analyser also provides a dedicated user interface with broader language support,…
3D IC summit says: learn from MEMS
3D IC summit says: learn from MEMS
Feature articles |
Under the motto “Application Ready”, this year’s 3D TSV Summit was very much focused on how to make 3D IC design an attractive proposition not only for very demanding niche…
MediaTek targets under-$50 wearable devices
MediaTek targets under-$50 wearable devices
Feature articles |
MediaTek is quietly going after the emerging market of under-$50 wearable devices. The company's new "all-in-one" SoC, called Aster, is sampling now only to a select group of customers.
Ground holes
Ground holes
Feature articles |
John Dunn is a design consultant (and contributor to EDN); here, he relates an unexpected “design constraint”.
Silicon, Security, and the Internet of Things
Silicon, Security, and the Internet of Things
Feature articles |
Maxim has posted an application note that offers thoughts from the company on the Internet of Things and, in particular, the security that will be needed to bring the IoT…
Multi-topology DC/DC controller delivers up to 10A output
Multi-topology DC/DC controller delivers up to 10A output
Feature articles |
LT8710 is the first design that Linear Technology has produced that is a synchronous SEPIC (ingle-ended primary-inductor converter), boost and flyback configuration that is also inverting. This synchronous device replaces…
Can 3D ICs learn from MEMS manufacturing experience?
Can 3D ICs learn from MEMS manufacturing experience?
Feature articles |
EETimes Europe's Editor reports on a meeting in Grenoble on 3D IC technology; under the motto “Application Ready”, this year’s TSV Summit was very much focused on how to make…
MediaTek goes wearable, Chinese and cheap
MediaTek goes wearable, Chinese and cheap
Feature articles |
MediaTek is quietly going after the emerging market of under-$50 wearable devices. The company's new "all-in-one" SoC, called Aster, is sampling now only to a select group of customers.
3D IC ramp up: what can we learn from MEMS?
3D IC ramp up: what can we learn from MEMS?
Feature articles |
Under the motto “Application Ready”, this year’s 3D TSV Summit was very much focused on how to make 3D IC design an attractive proposition not only for very demanding niche…
How SMPS evolution has sparked a PSU design revolution
How SMPS evolution has sparked a PSU design revolution
Feature articles |
With banner statistics that proclaim DC/DC power-conversion efficiencies around 95% becoming another tick-box in the collective mindset, 30-plus years of taming “switchers” marks the end of the road for analogue…
Flexible glass could offer more rugged smartphone displays
Flexible glass could offer more rugged smartphone displays
Feature articles |
Oneof the limitations of big-screen displays on pocketable products - such as smartphones - is that they have to be fronted by a sub-mm-thin sheet of glass. Apple already uses…


10s