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Business news Page 169

Business news Page 169
Sivers Semiconductors completes the integration of MixComm
Sivers Semiconductors completes the integration of MixComm
Business news |
Merger with MixComm creates a strong global challenger in 5G, SATCOM and radar with synergies of approximately SEK 10 million…
congatec enters functional safety market
congatec enters functional safety market
Business news |
German board maker congatec is entering the functional safety (FuSa) market based around the latest Intel processor on a COM…
Cariad commits to open source software
Cariad commits to open source software
Business news |
VW Group's software company, Cariad, is joining the Eclipse Foundation open source community and becoming a strategic member of the…
Partnership brings Rust programming to eSOL RTOS platform
Partnership brings Rust programming to eSOL RTOS platform
Business news |
Combination of eSOL RTOS and Ferrous Systems Rust compiler creates an attractive combination of safety and performance on heterogeneous multi/manycore…

Wingcopter raises $42m for drone production
Wingcopter raises $42m for drone production
Business news |
German drone developer Wingcopter has added $42m (€45m) to its fundraising for series production. The extended series A funding round brings the total raised to over $64m, adding German retailer…
Nordic and customers gain license to Huawei cellular IoT
Nordic and customers gain license to Huawei cellular IoT
Business news |
Fabless wireless chip company Nordic Semiconductor ASA has signed a royalty-bearing component-level license with Huawei Technologies Co. Ltd. for low power wide area (LPWA) cellular IoT standard essential patents (SEPs).
GitHub supports Autosar C++, Cert C++ for functional safety applications
GitHub supports Autosar C++, Cert C++ for functional safety applications
Business news |
In partnership with Woven Planet, GitHub releases CodeQL queries that implement implement the standards CERT C++ and Autosar C++. These queries aid developers looking to demonstrate ISO 26262 Part 6…
Intel wants €593 million interest from Europe on scrapped fine
Intel wants €593 million interest from Europe on scrapped fine
Business news |
Intel has filed a claim calling for the European Commission to pay €593 million in interest on an anti-trust fine the chip company paid but that was overturned on appeal.
Digi-Key unveils immersive ‘engineer’s workshop’ web experience
Digi-Key unveils immersive ‘engineer’s workshop’ web experience
Business news |
Electronic components distributor Digi-Key Electronics has introduced an interactive simulation of a modern engineer's workshop.
Solid Sands, Sysgo extend safety-critical deal
Solid Sands, Sysgo extend safety-critical deal
Business news |
Dutch compiler and library testing and validation tool developer Solid Sands has extended its deal with Sysgo for real time operating system technology in safety critical designs. The two companies…
Scintil Photonics raises funds to advance silicon photonic IC production
Scintil Photonics raises funds to advance silicon photonic IC production
Business news |
Funds will enable fabless company to accelerate CMOS-based industrialization and global commercialization of its III-V Augmented Silicon Photonic ICs for optical interconnects.
Fault detection across 5G cloud and network infrastructure
Fault detection across 5G cloud and network infrastructure
Business news |
Adaptive service assurance platform from EXFO uses platform observability by Intel to deliver a better 5G experience with full-stack visibility.
Peugeot starts series production of hydrogen vehicle
Peugeot starts series production of hydrogen vehicle
Business news |
Some time ago, the Stellantis vehicle group announced a comprehensive hydrogen strategy. Now the company has taken an important step to turn this strategy into reality.
Innoscience grabs former senior NXP engineer to lead R&D
Innoscience grabs former senior NXP engineer to lead R&D
Business news |
Innoscience Technology Co. Ltd., a Chinese startup that manufactures GaN-on-Si power transistors, has recruited former NXP executive Jan Sonsky as vice president of engineering. Sonsky previously spent 19 years with…
DRAM prices to fall in third quarter
DRAM prices to fall in third quarter
Business news |
Weak demand for components means DRAM prices are set to fall by 3 to 8 percent in 3Q22 quarter-on-quarter, according to TrendForce. This is after a fall of between 0…
Applied Materials buys European ALD pioneer Picosun
Applied Materials buys European ALD pioneer Picosun
Business news |
Fab equipment maker Applied Materials has acquired a Finnish pioneer in atomic layer deposition (ALD) technology. The ALD technology developed Picosun, based in Espoo, is used in chip making from…
Speciality ALD prompts Applied Materials’ to swoop for Picosun
Speciality ALD prompts Applied Materials’ to swoop for Picosun
Business news |
Leading chipmaking equipment supplier Applied Materials Inc. (Santa Clara, Calif.) has acquired Picosun Oy (Espoo, Finland) for an undisclosed amount. Picosun was founded in 2003 to commercialize atomic layer deposition…
Japan to provide 40% subsidy to TSMC, Sony venture
Japan to provide 40% subsidy to TSMC, Sony venture
Business news |
The Japanese government will pay up to 476 billion yen (about US$3.5 billion) towards an $8.6-billion wafer fab being built by TSMC, Sony and Denso, according to local reports. The…
Japan, US make plans for independent 2nm production
Japan, US make plans for independent 2nm production
Business news |
Japan is planning to work with the United States to create domestic manufacturing for 2nm integrated circuits in the 2025 fiscal year, according to a Nikkei report. The move is…
ST opens $244m SiC power packaging line in Morocco
ST opens $244m SiC power packaging line in Morocco
Business news |
STMicroelectronics has opened its latest silicon carbide power packaging line for electric vehicles. The $244m extension to the plant in Bouskoura, located in the Casablanca-Settat region of Morocco, is a…
SGET boosts embedded module standard, launches design guide
SGET boosts embedded module standard, launches design guide
Business news |
The Standardization Group for Embedded Technologies (SGET) has published two important milestones for its Open Standard Module (OSM) specification. OSM version 1.1 provides backward-compatible improvements and future-proof extensions, while the…
Smart camera AI edge solution to be demoed
Smart camera AI edge solution to be demoed
Business news |
Product engineering services provider eInfochips, an Arrow Electronics company, has announced that it will be showcasing its AI inferencing at the edge solution, developed in collaboration with Qualcomm Technologies, at…
Imverse raises $4.8m for live holograms on Zoom
Imverse raises $4.8m for live holograms on Zoom
Business news |
Swiss startup Imverse has raised $4.8m to develop its volumetric pixel (voxel) software platform for real time 3D graphics and live holograms to simplify the development of the metaverse.
Verification supports chiplets using UCIe standard
Verification supports chiplets using UCIe standard
Business news |
Avery Design Systems in the US has announced comprehensive support for the Universal Chiplet Interconnect Express (UCIe) standard. The offering supports standalone UCIe die to die adapter and LogPHY verification…
Hughes verifies 5G satellite backhaul interoperability
Hughes verifies 5G satellite backhaul interoperability
Business news |
Hughes JUPITER System satellite ground platform is 5G ready for mobile network operators and offers an easy LTE to 5G transition.
Audio pioneers Dirac and Dolby cooperate for high-end car sound system
Audio pioneers Dirac and Dolby cooperate for high-end car sound system
Business news |
Swedish digital audio pioneer Dirac and Dolby, a provider of immersive infotainment, are collaborating to bring a high-end audio experience to the car.
ST looks at joint European wafer fab with GlobalFoundries
ST looks at joint European wafer fab with GlobalFoundries
Business news |
European chip maker ST Microelectronics is reported to be in talks with Globalfoundries on building a joint wafer fab in France. The two companies want to take advantage of the…
Schaeffler integrates thermal management into electric axle drive
Schaeffler integrates thermal management into electric axle drive
Business news |
With new electric axle drives, automotive supplier and mechatronics expert Schaeffler is underlining its commitment to electromobility. The common denominator is a higher integration density compared to previous approaches.


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