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Page 591
First MLCC range with low-resistance soft termination
First MLCC range with low-resistance soft termination
New Products |
The CN range of MLCC ceramic capacitors from TDK has standard resistance with 10 μF in 3216 size and 22…
Leti combines nine research tracks for sustainable electronics  
Leti combines nine research tracks for sustainable electronics  
Technology News |
CEA-Leti in France identifies resistive memories, 3D stacking, in-memory-computing, neuromorphic computing and quantum computing as well as edge computing and…
Renesas, OmniVision unveil reference design for automotive camera system
Renesas, OmniVision unveil reference design for automotive camera system
New Products |
Renesas and OmniVision Technologies Inc, have introduced an integrated reference design for a high-definition automotive camera system. It is based…
LIGENTEC and X-FAB create Europe’s largest photonic IC foundry service
LIGENTEC and X-FAB create Europe’s largest photonic IC foundry service
Business news |
Strategic partnership will address rapidly growing demand for low-loss silicon nitride photonic integrated circuits across a broad range of industry…

Scalable simulation and validation speeds car development
Scalable simulation and validation speeds car development
New Products |
Development tool simulation company dSpace GmbH is introducing a web-based, scalable cloud platform for simulation and validation tasks in automotive development. Simphera significantly accelerates the computationally intensive validation of functions…
Carbon Mobile starts smartphone manufacturing in Germany
Carbon Mobile starts smartphone manufacturing in Germany
Business news |
Smartphone manufacturing in Germany to reduce carbon emissions with the aim of minimizing the use of hard-to-recycle materials and maximizing recyclability.
Vehicle computer with Android operating system
Vehicle computer with Android operating system
New Products |
With its JLT6012A vehicle computer, the Swedish manufacturer JLT Mobile Computers is primarily targeting logistics companies. The computer is designed for maximum reliability and runs under the productivity-enhancing operating system…
Machine learning boost for complex chip and package reliability analysis
Machine learning boost for complex chip and package reliability analysis
New Products |
The cloud-enabled PrimeSim Reliability Analysis tool from Synopsys is part of an ISO26262 safety critical design flow for reliability analysis of complex chips and system-in-package designs…
Genetic algorithm, metal 3D printing builds high power heat exchanger
Genetic algorithm, metal 3D printing builds high power heat exchanger
Technology News |
Researchers at the University of Illinois Urbana-Champaign are using genetic algorithms and metal 3D printing to design ultra-compact, high-power heat exchangers.
Return of smartphone manufacturing in Germany
Return of smartphone manufacturing in Germany
Business news |
Carbon Mobile has begun manufacturing eco-friendly smartphones in Flensburg, Germany.
Galway in line for Intel megafab
Galway in line for Intel megafab
Business news |
Intel is looking closely at building a leading edge semiconductor fab in Galway in the West of Ireland.
Imagination looks to IPO or sale
Imagination looks to IPO or sale
Business news |
UK IP developer Imagination Technologies is considering a return to the stock market or a company sale, according to a Bloomberg report.
NXP teams for Tensilica’s latest AI cores
NXP teams for Tensilica’s latest AI cores
Business news |
NXP is using the Tensilica AI Platform from Cadence Design Systems for a cross-over real time microcontroller…
ABB develops hybrid predictive maintenance technology
ABB develops hybrid predictive maintenance technology
Technology News |
ABB has combined machine learning and fault analysis algorithms to provide automated predictive maintenance for all kinds of applications across Industry 4.0…
Indian analog wafer fab plan stuck in neutral
Indian analog wafer fab plan stuck in neutral
Business news |
Plans for a $3 billion 65nm analog wafer fab in the Gujurat region of India are in jeopardy with Tower Semiconductor, a potential project participant, threatening to pull out because…
BMW backs GaN Systems for production power
BMW backs GaN Systems for production power
Business news |
GaN Systems has signed a comprehensive Capacity Agreement with the BMW Group for automotive grade gallium nitride devices.
Telecoms market growth slows
Telecoms market growth slows
Market news |
The positive growth of the telecoms equipment market has slowed slightly in the second quarter of 2021 as the growth in China slowed says the latest data from Dell'Oro.
Signal creation and analysis tool speeds RF component development
Signal creation and analysis tool speeds RF component development
New Products |
Electronic test equipment maker Rohde & Schwarz (R&S) and computational software company Cadence Design Systems say they have collaborated on a solution aimed at simplifying the engineering process from RF…
Intel’s European mega-fab could go to Galway, Ireland
Intel’s European mega-fab could go to Galway, Ireland
Business news |
A former military firing range in Oranmore near Galway in the west of Ireland is the Industrial Development Agency's "preferred site" for an Intel chip foundry that would employ 10,000…
Onsemi, Ramaxel team for next generation cloud server power
Onsemi, Ramaxel team for next generation cloud server power
Business news |
Ramxel in China is using key power devices from onsemi for its next generation VR14 Intel-based cloud server…
NXP certified to cybersecurity standard ISO 21434
NXP certified to cybersecurity standard ISO 21434
Business news |
With the advent of the Connected Car, the risk of a malicious cyber attack on vehicle electronics is also growing. In response to the threat, the industry has created the…
Extreme heat exchanger enabled by genetic algorithm, metal 3D printing
Extreme heat exchanger enabled by genetic algorithm, metal 3D printing
Technology News |
Researchers at the University of Illinois Urbana-Champaign say they are using topology optimization and metal 3D printing to design ultra-compact, high-power heat exchangers.
Highest sensitivity CMOS TIA for optical networks
Highest sensitivity CMOS TIA for optical networks
Technology News |
The HLR11G0 transimpedance amplifier (TIA) from HiLight Semiconductor has a a sensitivity of -22dBm for 10Gbit/s medium distance optical links with PIN photodiodes…
Reverberation test systems add 5G NR option
Reverberation test systems add 5G NR option
Business news |
Users of Bluetest reverberation test systems can now benefit from the CMX500 5G NR communication tester from Rohde & Schwarz for 5G FR1 MIMO OTA.
Imagination preps for IPO or company sale
Imagination preps for IPO or company sale
Business news |
IP cores licensor Imagination Technologies Ltd. (Kings Langley, England) is considering a return to the stock market or a company sale, according to a Bloomberg report.
Efficient lanyard release system for Push-Pull circular connectors
Efficient lanyard release system for Push-Pull circular connectors
New Products |
Yamaichi Electronics Germany has expanded its Y-Circ P series of push-pull circular connectors with a lanyard release system that can be retrofitted to existing connectors.
Industrial partnership to enrich 3D printing profile
Industrial partnership to enrich 3D printing profile
News |
XYZprinting and BASF Forward AM extended 3D printing strategic alliance to enable industrial users across various additive manufacturing technologies to benefit from our high-performance materials.
World’s first general purpose automotive operating system
World’s first general purpose automotive operating system
Technology News |
Rocksolid Core is the only licensable platform for all car functions from powertrain and steering to cockpit electronics.


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