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Renesas targets high-volume markets with new generation of its R-Car SoCs
Renesas targets high-volume markets with new generation of its R-Car SoCs
Business news |
Renesas targets high-volume markets with new generation of its R-Car SoCs…
Blockchain secures premium malt whisky for the first time
Blockchain secures premium malt whisky for the first time
Technology News |
A whisky bottling firm in Scotland is using blockchain to guarantee the authenticity of its products to prevent counterfeits. A…
Electromobility: Checking charging points with mobile measurement tech
Electromobility: Checking charging points with mobile measurement tech
Technology News |
The German national metrology institute PTB has developed a measurement system that can be used in the field to check…
Everspin swings to profit, appoints CEO
Everspin swings to profit, appoints CEO
Business news |
MRAM component supplier Everspin Technologies Inc. (Chandler, Arizona) has reported a full-year profit for 2021 and appointed Sanjeev Aggarwal as…

Sensor startup raises funds for dead-reckoning revolution
Sensor startup raises funds for dead-reckoning revolution
Business news |
Inertial motion sensor startup Zero Point Motion Ltd. (Bristol, England) has raised £2.58 million in a first round of funding from Foresight Williams. Foresight Williams is a collaboration between Foresight…
Fine pitch socket for co-packaged optical modules
Fine pitch socket for co-packaged optical modules
Business news |
Swiss connector giant TE Connectivity has developed a fine pitch socket interposer technology for co-packaged optics and optical modules. The technology was developed with Ranovus for the Odin 800Gbps Analog-Drive…
SparkFun, MikroElektronika expand rapid prototyping offerings
SparkFun, MikroElektronika expand rapid prototyping offerings
New Products |
Electronics retailer SparkFun Electronics and embedded system development tools maker MikroElektronika have partnered to create two new boards that merge their combined rapid prototyping ecosystems.
OQ Technology taps Alif for NB-IoT satellite
OQ Technology taps Alif for NB-IoT satellite
Business news |
OQ Technology has signed a deal with Alif Semiconductor for microcontrollers on its IoT satellite. The Luxembourg-based satellite developer is developing a narrowband internet-of-things (NB-IoT) system for hybrid terrestrial satellite…
GF teams for 300mm wafer photonics
GF teams for 300mm wafer photonics
Business news |
GlobalFoundries has launched a new 300mm platform for photonics, with key partnerships on designs and EDA tools. The company has active design wins with major customers for its 300mm Fotonix…
Encrypted computing comes to low-power devices
Encrypted computing comes to low-power devices
Technology News |
Researchers at Carnegie Mellon University say they have developed new algorithms and hardware designs that make low-power encrypted computing feasible.
II-VI expands SiC wafer factories in Sweden, US
II-VI expands SiC wafer factories in Sweden, US
Business news |
II‐VI is accelerating its investment in 150mm and 200mm silicon carbide (SiC) substrate and epitaxial wafer manufacturing in Sweden and the US. The company previously announced a $1bn investment over…
Open-source startup offers chip design platform
Open-source startup offers chip design platform
Business news |
ChipFlow Ltd. (Cambridge, England) is a startup company that claims it can “democratize” integrated circuit design with open-source EDA software. The company was founded in April 2021 and says it…
IEC 61850 gateway to streamline power substation networks
IEC 61850 gateway to streamline power substation networks
New Products |
Moxa has launched an IEC 61850 gateway to simplify system integration and communication security for power substations. The MGate 5119 Series substation gateway provides DNP3/IEC 101/IEC 104/Modbus-to-IEC 61850 protocol conversions…
Doubling the capacity of cryochips for quantum computers
Doubling the capacity of cryochips for quantum computers
Technology News |
Researchers at Fraunhofer IZM in Germany have developed a high density process for cryogenic electronics for quantum computers. The team has used indium bumps with a pitch of 7.5um to…
Cisco and Rakuten agree to accelerate Open RAN
Cisco and Rakuten agree to accelerate Open RAN
Business news |
Companies will combine their leading technology portfolios, expertise, and services to develop and deliver products for 4G/5G mobile networks based on Open RAN.
3U OpenVPX Cube development enclosure
3U OpenVPX Cube development enclosure
New Products |
Pixus Technologies has launched a a small form factor enclosure for development and demonstration of 3U OpenVPX systems. The OpenVPX Cube Chassis is 4U tall and 42HP (8.4in) wide and…
Adaptive compute acceleration co-packaged optics platform
Adaptive compute acceleration co-packaged optics platform
Technology News |
Package combines Xilinx Versal and Ranovus Odin™ 800Gbps CPO 2.0 cutting footprint by 75 percent and consumption by 40 percent in the optical interconnect.
Analog Devices invests €100 Million in Europe
Analog Devices invests €100 Million in Europe
Business news |
Investment in operations via ADI Catalyst launch is designed to accelerate collaborative innovation and support R&D in Europe.
Analog Devices to invest €100 million in Limerick R&D centre
Analog Devices to invest €100 million in Limerick R&D centre
Business news |
Mixed-signal to RF chip maker Analog Devices Inc. has announced it will invest €100 million (about US$110 million) in a development centre in Limerick. The investment in ADI Catalyst –…
Edge-native AI for manufacturing delivers real-time analysis
Edge-native AI for manufacturing delivers real-time analysis
Technology News |
AI software suite reduces downtime and material costs, while improving quality and providing deep insight into machine and human productivity.
Body control chip combines power window and trunk functionalities
Body control chip combines power window and trunk functionalities
New Products |
Door-zone and rear-window controller from STMicroelectronics offers additional functions for boot lid and tailgate…
Sony, Honda team to bring new EV to market
Sony, Honda team to bring new EV to market
Business news |
Sony has signed a strategic alliance with Honda to develop and sell battery electric vehicles (EVs) alongside mobility services. The deal will see a new electric car company, using the…
Americas’ chip market growth goes above 40%
Americas’ chip market growth goes above 40%
Market news |
In January the Americas market for semiconductors was 40.2 percent higher than a year before on a three-month average basis, according to the US Semiconductor Industry Association. This phenomenal regional…
ST borrows €600 million in pursuit of ‘European sovereignty’
ST borrows €600 million in pursuit of ‘European sovereignty’
Business news |
The European Investment Bank (EIB) has agreed to loan STMicroelectronics NV €600 million (about US$650 million) for R&D and pilot manufacturing investment. The loan is in line with European strategy…
Cloud-based device eval environment for automotive SoCs
Cloud-based device eval environment for automotive SoCs
New Products |
Advanced semiconductor solutions supplier Renesas Electronics Corporation and software optimization company Fixstars Corporation have announced that they plan to collaborate in the automotive deep learning field.
MikroElektronika, SparkFun team for rapid prototyping
MikroElektronika, SparkFun team for rapid prototyping
Business news |
European board maker MikroElektronika (MikroE) has teamed up with SparkFun Electronics in the US on two new boards that merge their combined rapid prototyping ecosystems The SparkFun RP2040 mikroBUS Development…
Nowi teams for world’s smallest energy harvesting NB-IoT module
Nowi teams for world’s smallest energy harvesting NB-IoT module
Business news |
Dutch power chip designer Nowi has teamed up with Murata and Deutsche Telekom to develop the world’s smallest energy harvesting NB-IoT module. The Autonomous NB-IoT Development Solution (ANDS) is the…
Machine learning diagnoses 3D printing errors in real time
Machine learning diagnoses 3D printing errors in real time
Technology News |
Researchers at Penn state say they have created a first-of-its-kind methodology for diagnosing 3D printing errors of RF devices with machine learning in real time.


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