MENU

Page 3228

Page 3228
High-speed ADC at lower power
High-speed ADC at lower power
New Products |
Intersil Corporation has announced its newest family of analogue-to-digital converters (ADCs); pin-compatible 12-, 14- and 16-bit ADCs with sample rates…
High energy Li-ion battery system targets all telecom applications
High energy Li-ion battery system targets all telecom applications
New Products |
Saft has launched a new high energy Evolion Li-ion (Lithium-ion) battery system designed specifically for telecom applications. The new system…
Security goes multi-core
Security goes multi-core
Technology News |
NetLogic Microsystems has introduced the XLP Multi-Core Security Processor with Integrated NETL7 Layer 7 knowledge-based processor for deep-packet inspection and…
LTE processors to get benchmark
LTE processors to get benchmark
Market news |
mimoOn is partnering with independent technology analysis firm BDTI to develop benchmarks for the evaluation of processors used in LTE…

LTE modem integrates 3D apps processor
LTE modem integrates 3D apps processor
Technology News |
Renesas Electronics and its subsidiary, Renesas Mobile Corporation, have introduced a 3D mobile platform, the MP5225. The new mobile platform integrates Renesas Mobile's industry reference LTE triple-mode modem platform, the…
Linaro makes snowball shine
Linaro makes snowball shine
New Products |
An optimized base of software and tools target the new low cost board (Snowball) using ST-Ericsson's dual core Cortex-A9 based AP9500 chipset. The Snowball development boards combine powerful dual core…
Modular approach to 4G/LTE introduced
Modular approach to 4G/LTE introduced
New Products |
After months of collaboration with TEMs to migrate to 40G-ready ATCA platforms, Kontron has officially announced the rollout of an updated program that features two new carrier-grade, 14-slot 10G and…
High Speed Inter-Chip (HSIC) compatible PHY IP launched
High Speed Inter-Chip (HSIC) compatible PHY IP launched
New Products |
Direct chip-to-chip interconnect allows significant power and silicon area savings while retaining all performance features of the USB 2.0 standard.
Microwave combiners for satellite news gathering support 1:1 redundancy
Microwave combiners for satellite news gathering support 1:1 redundancy
New Products |
Luso Electronics launched two high power redundant combiner assemblies (RCAs), for Ku-band and C-band. When configured with the company’s controller, the RCAs facilitate automatic redundancy in a two-amplifier phase combiner.
Proximity sensor is integrated with one inch can-stack linear actuator
Proximity sensor is integrated with one inch can-stack linear actuator
New Products |
Haydon Kerk Motion Solutions Inc., has introduced an integrated end-of-stroke proximity sensor available on the company’s one inch 25000 Series captive linear actuators. The proximity sensor utilizes miniature Hall Effect…
Audi, Alcatel-Lucent demo LTE-equipped car
Audi, Alcatel-Lucent demo LTE-equipped car
Technology News |
At the Mobile World Congress in Barcelona, Audi showed an A8 luxury sedan equipped with LTE broadband communications technology. Audi called the vehicle a “functional prototype”. The LTE equipment was…
Qualcomm tips quad-core Snapdragon plan
Qualcomm tips quad-core Snapdragon plan
Technology News |
Fabless mobile chip company Qualcomm Inc. has announced that its next processor architecture is called Krait and will offer multi-core chips capable of running at a clock frequency of 2.5-GHz.
ST-Ericsson sets out ‘NovaThor’ roadmap
ST-Ericsson sets out ‘NovaThor’ roadmap
Market news |
Wireless chip vendor ST-Ericsson has launched a series of application processors called Nova, modems under the name Thor, and multi-chip platforms under the name NovaThor. However, despite including LTE modems…
High voltage LED series for retrofit lighting applications
High voltage LED series for retrofit lighting applications
New Products |
The 2W product with two LED chips connected in series achieves 140 lm for 2700 K at 95 to 111VDC. The 4 chip LED…
CEA-Leti and Edwards join forces on energy-efficient fabs
CEA-Leti and Edwards join forces on energy-efficient fabs
Technology News |
The system was successfully tested for reliability and energy savings on two tools at CEA-Leti and showed a 75 percent reduction in fuel and water use when the…
PC/104 meets Qseven: what’s your combination?
PC/104 meets Qseven: what’s your combination?
Feature articles |
Read the full article on page 38 of our February digital edition.
Touch screen vision sensors with Ethernet connectivity
Touch screen vision sensors with Ethernet connectivity
New Products |
Inspection setup is accomplished through a menu-driven user interface, with no PC required. The iVu Plus family includes integrated touch screen TG and BCR (Bar…
Agilent uses new ASIC in MSO market attack
Agilent uses new ASIC in MSO market attack
Technology News |
The X-Series scopes use an Agilent-designed custom 90-nm CMOS ASIC with 6M gates and embedded memory. This MegaZoom IV single-chip architecture provides  fast waveform update rates and responsive deep memory…
Nvidia demos quad-core Tegra in tablet
Nvidia demos quad-core Tegra in tablet
Technology News |
Nvidia’s Kal-El chip was demonstrated running in an Android tablet. It can support up to 2,560 x 1,600 pixel resolution and 1,440-progressive video thanks in part to a 12-core…
Avnet Abacus reveals enhanced power strategy to support cost efficient, eco-friendly power design
Avnet Abacus reveals enhanced power strategy to support cost efficient, eco-friendly power design
Business news |
The distributor has strengthened its European team of Power Field Application Engineers (FAEs) with six new recruits who will help to provide applications support to an expanded portfolio of power…
Intel, AMD prep USB 3.0 chips for 2012
Intel, AMD prep USB 3.0 chips for 2012
Technology News |
Official word on the AMD and Intel chips could come as early as March 9. That’s when the USB Implementers Forum holds a developers conference in Amsterdam and is expected…
Software is the new hardware
Software is the new hardware
Technology News |
Read the full article on page 4 of our February digital edition.
Designing USB functionality into embedded systems with no OS
Designing USB functionality into embedded systems with no OS
Feature articles |
Read the full article on page 36 of our February digital edition.
Shunt protectors for sensitive LED lighting applications
Shunt protectors for sensitive LED lighting applications
New Products |
In this configuration, an open LED can cause the entire LED string to go dark, resulting in reduced performance and possible maintenance calls and costly warranty returns.  Adding…
New IO-Link driver saves cost in sensor and actuator applications
New IO-Link driver saves cost in sensor and actuator applications
New Products |
The ZIOL2201 is function- and pin-compatible with the ZIOL2401 and ZIOL2211, ZMDI’s first members of the IO-Link family. The ZIOL2201 is available with smart power functionality for device applications.
ODM solution for unified threat management appliances
ODM solution for unified threat management appliances
New Products |
Powered by Freescale’s QorIQ P1010 processor, the design is intended to help equipment manufacturers create high-performance security products that offer hardware-accelerated security and intrusion prevention services (IPS) at price points…
STMicroelectronics teams with LifeNexus for the Personal Health Card
STMicroelectronics teams with LifeNexus for the Personal Health Card
Business news |
The LifeNexus Personal Health Card was designed specifically to secure and maintain an individual’s Personal Health Record (PHR) on a card in their wallet.  The patented iChip, “Individually…
USB 3.0 modules allow fourth transfer mode at 5.0 Gigabit/s
USB 3.0 modules allow fourth transfer mode at 5.0 Gigabit/s
New Products |
SuperSpeed USB 3.0 technology supports dual-simplex four wire differential signalling compared to half-duplex two wire differential signalling for USB 2.0. Data flows can be simultaneous bi-directional instead of…


10s