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Page 3146
Designing graphene into transparent and lightweight speakers
Designing graphene into transparent and lightweight speakers
Technology News |
Researchers Jyongsik Jang and coworkers from Seoul National University have used inkjet printing and vapour deposition to deposit graphene oxide…
Enea’s CEO resigns
Enea’s CEO resigns
Business news |
Enea’s President and CEO Per Åkerberg has decided to resign. The board has initiated the search for a successor. Per…
True blue light emission improves OLED displays
True blue light emission improves OLED displays
Technology News |
Researchers from IMRE, a research institute of Singapore's Agency for Science, Technology and Research (A*STAR), and the University of Michigan…
Semikron gears up for sales growth
Semikron gears up for sales growth
Business news |
Semikron is celebrating the company’s 60th anniversary by expanding its headquarters in Nuremberg, Germany. The company has opened a 12,300…

Next generation dual high-speed CAN delivers improved performance and vehicle efficiency
Next generation dual high-speed CAN delivers improved performance and vehicle efficiency
New Products |
NXP Semiconductors N.V. has unveiled the company’s next generation of CAN transceivers with the introduction of the dual high-speed (HS) CAN transceiver, TJA1048. Enabling simpler and more efficient in-vehicle networking…
Low-power audio codec prevents speaker damage
Low-power audio codec prevents speaker damage
New Products |
The MAX98089 integrated stereo audio codec from Maxim Integrated Products has been designed to improve audio performance and prevent speaker damage. An easy-to-use graphical user interface (GUI) significantly eases the…
Bosch, Daimler, launch e-car motors JV
Bosch, Daimler, launch e-car motors JV
Business news |
Automotive tier one Robert Bosch GmbH and carmaker Daimler AG have signed agreements on the establishment of a 50:50 joint venture for electric motors. The new company, which is to…
Optimizing fast switching frequency power supplies
Optimizing fast switching frequency power supplies
Feature articles |
From a power-stage's point of view, going high frequency is very desirable for a number of reasons: it decreases the size of magnetic components, reducing the amount of capacitance required…
Simulation techniques test automotive cluster display ECUs
Simulation techniques test automotive cluster display ECUs
Technology News |
With automotive display cluster being the main means to convey the status and information of a vehicle system and drive conditions, it is of utmost importance to ensure reliable functional…
Scalable solutions for hybrid automotive instrument clusters
Scalable solutions for hybrid automotive instrument clusters
Technology News |
With increased electronics content, increasingly connected cars and computers taking more and more control in vehicles, it is only logical that instrument clusters massively change their appearance and functions. The…
Toshiba Automotive MCUs meet ISO 26262
Toshiba Automotive MCUs meet ISO 26262
New Products |
Toshiba Electronics Europe has announced that it will introduce two automotive microcontrollers for electronic control units compliant with ISO 26262, a functional safety standard for automobiles. The new products are…
Ultra-low power 8/16-bit AVR XMEGA MCU includes USB and high-precision analog systems
Ultra-low power 8/16-bit AVR XMEGA MCU includes USB and high-precision analog systems
New Products |
Atmel Corporation has added new features to the company's 8/16-bit AVR XMEGA microcontroller (MCU) family with the industry's lowest power consumption of 100 nA with 5 µS wake-up time. The…
IR unveils dual PQFN2x2 and dual PQFN3.3×3.3 power MOSFETs for low power applications
IR unveils dual PQFN2x2 and dual PQFN3.3×3.3 power MOSFETs for low power applications
New Products |
International Rectifier is enhancing the company’s PQFN offering with the introduction of a PQFN 2 mm x 2 mm and PQFN 3.3 mm x3.3 mm package. The new packages integrate…
Adobe and Sony launch competition to develop apps for new tablets
Adobe and Sony launch competition to develop apps for new tablets
Market news |
The ‘Adobe AIR App Challenge Sponsored by Sony’ is intended to drive the creation of innovative Android applications for the two models of Sony tablet devices and offer developers a…
PREMO GROUP agrees new French distribution deal
PREMO GROUP agrees new French distribution deal
Business news |
French distributor, Equipements Scientifiques (ES) has signed a new distribution agreement with Spain’s PREMO Group.
Synchronous step-down DC/DC controller supports wide operating junction temperatures
Synchronous step-down DC/DC controller supports wide operating junction temperatures
New Products |
Linear Technology Corporation has introduced the H- and MP- grade versions of the company’s LTC3851A, a wide input voltage range (4 V to 38 V) synchronous step-down DC/DC controller that…
Hynix and Toshiba sign joint development for MRAM
Hynix and Toshiba sign joint development for MRAM
Business news |
Hynix Semiconductor and Toshiba Corporation have agreed to strategic collaboration in the joint development of Spin-Transfer Torque Magnetoresistance Random Access Memory (MRAM). The companies also intend to cooperate in manufacturing…
Automotive MCUs meet ISO 26262
Automotive MCUs meet ISO 26262
Technology News |
Toshiba Electronics Europe has announced that it will introduce two automotive microcontrollers for electronic control units compliant with ISO 26262, a functional safety standard for automobiles. The new products are…
dSpace ASM get JMAG parameterization support
dSpace ASM get JMAG parameterization support
New Products |
The dSPACE ASM Electric Components simulation package is now supported by JMAG, a Finite Element Analysis (FEA) tool for electromechanical design developed by the JSOL Corporation. This enables users to…
OpenLink drivers enable low cost WiFi access points
OpenLink drivers enable low cost WiFi access points
Technology News |
Texas Instruments is now pre-integrating its open source Linux-based OpenLink drivers for WiFi and Bluetooth on to its Sitara-based WiLink 6.0 modules. It is the first time engineers can repurpose…
CUI cooperates with Ericsson to provide multi-source digital POL platform
CUI cooperates with Ericsson to provide multi-source digital POL platform
Business news |
CUI Inc, a subsidiary of CUI Global, Inc., has reached a statement of cooperation with Ericsson, a leading provider of technology and services to telecom operators, under which it will…
Real-time hardware encryption processor for USB mass storage
Real-time hardware encryption processor for USB mass storage
New Products |
Enova Technology launched its 9th generation X-Wall DX processor, what the company claims to be the first true real-time hardware encryption processor for USB mass storage class devices. The patent…
UV and remote-head cameras for industrial endoscopy
UV and remote-head cameras for industrial endoscopy
New Products |
PPT Vision has added two high-performance JAI cameras to its M-Series embedded machine vision system line, including an ultra-violet (UV) camera for inspections that benefit from this shorter wavelength of…
AVX participates in “Solutions for Hope Project” for “conflict-free” tantalum
AVX participates in “Solutions for Hope Project” for “conflict-free” tantalum
Business news |
AVX Corporation, in partnership with a leading producer of communications technology, has developed the “Solutions for Hope Project,” which is a pilot program established to demonstrate a process to deliver…
Researcher develops smaller, longer-lasting LED light
Researcher develops smaller, longer-lasting LED light
Technology News |
The University of Miami's College of Engineering has designed a light-emitting diode (LED) light that utilizes an array of LEDs 100 times smaller than conventional LEDs. The device is more…
Robots get Kinect’s ‘eyes and ears’
Robots get Kinect’s ‘eyes and ears’
Technology News |
Microsoft Robotics has been giving away its free Robotics Developer Studio, complete with a 3D simulator, for the last six years, but without gaining much visibility.
IMEC claims ReRAM filament breakthrough
IMEC claims ReRAM filament breakthrough
Technology News |
Nanoelectronics research institute IMEC has claimed to have made a breakthrough in the understanding of the physical nature of filaments in resistive RAM devices.
Fully depleted silicon-on-insulator technology shown to be the most cost-effective approach at the 22 nm node
Fully depleted silicon-on-insulator technology shown to be the most cost-effective approach at the 22 nm node
Technology News |
Research firm IC Knowledge LLC has completed a comprehensive cost analysis that determines fully depleted silicon-on-insulator (FD-SOI) wafers offer the global semiconductor industry the most cost effective solution compared to…


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