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Analog class-D audio amplifier exhibits power density of 3.2-W/mm2
Analog class-D audio amplifier exhibits power density of 3.2-W/mm2
New Products |
STMicroelectronics has introduced a high-performance, analog class-D audio amplifier that is claiming best-in-class power density. The achievement will allow equipment…
CSR showcases VNC Automotive technology at CES
CSR showcases VNC Automotive technology at CES
New Products |
At the 2012 International CES in Las Vegas, CSR plc demos its first wireless implementation of RealVNC's technology on the…
DC/DC converter with high maximum junction temperature
DC/DC converter with high maximum junction temperature
New Products |
Linear Technology has announced the H-grade version of the LT3692A, a monolithic, dual output step-down switching regulator that delivers up…
Ultra-low power MCU with integrated LCD cuts system cost of consumer medical devices
Ultra-low power MCU with integrated LCD cuts system cost of consumer medical devices
New Products |
Texas Instruments Incorporated has introduced the company’s lowest cost microcontroller (MCU) with an integrated LCD controller. Based on TI’s MSP430…

SK Innovation, Continental announce Li-ion battery JV
SK Innovation, Continental announce Li-ion battery JV
Business news |
At the Detroit Motor Show, Korean energy R&D group SK Innovation and German automotive tier one Continental AG have announced the launch of a joint venture aiming at developing and…
HiWave demonstrates ultra-low power Bluetooth flat speaker design at CES
HiWave demonstrates ultra-low power Bluetooth flat speaker design at CES
Technology News |
HiWave in Cambridge, UK, is showing new loudspeaker driver and amplifier designs in its “Tempus” demonstrator at Consumer Electronics Show (CES) this week and the ALMA (The International Loudspeaker Association)…
Partnership to develop cloud-based gesture-enabled gaming services
Partnership to develop cloud-based gesture-enabled gaming services
Technology News |
Ubitus, a software platform leader for fixed-mobile convergence applications, and Omek Interactive, a leading provider of gesture recognition and body tracking technology, have announced the formation of a partnership to…
Class-D audio amplifier exhibits power density of 3.2-W/mm-square
Class-D audio amplifier exhibits power density of 3.2-W/mm-square
New Products |
STMicroelectronics has introduced a high-performance, analog class-D audio amplifier that is claiming best-in-class power density. The achievement will allow equipment manufacturers to combine superior audio quality with a small form…
PLL synthesizers deliver flexibility and phase noise performance
PLL synthesizers deliver flexibility and phase noise performance
New Products |
Analog Devices, Inc., has released two new PLL synthesizer that claim to allow utmost flexibility and phase noise performance. The ADF4151 and ADF4196 PLL synthesizers ease design in a variety…
Intel specifies Medfield, tips Lenovo, Motorola deals
Intel specifies Medfield, tips Lenovo, Motorola deals
Technology News |
Intel has provided details of its Medfield 32-nm platform for smartphones claiming that the main SoC consumes less than 800-mW worst case. It has also announced that it has deals…
3D optical profilers integrate imaging topography software
3D optical profilers integrate imaging topography software
New Products |
Heliotis and Digital Surf announced that MountainsMap Imaging Topography surface metrology software based upon Digital Surf's Mountains Technology will be supplied with Heliotis M3 and M3-XL 3D Optical Profilers. M3…
microATX industrial motherboard supports fast data throughput
microATX industrial motherboard supports fast data throughput
New Products |
The NEX 890 microATX industrial motherboard was designed for systems integrators and product designers looking for a embedded computing solution capable of supporting fast data throughput and high-quality video/data. The…
Eulitha and the EV Group to jointly develop HB-LED nano-patterning solution
Eulitha and the EV Group to jointly develop HB-LED nano-patterning solution
Business news |
Eulitha AG has signed a joint-development and licensing agreement with EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets.
4M fast SRAM in 48-Ball 8x10x1.20mm FBGA package
4M fast SRAM in 48-Ball 8x10x1.20mm FBGA package
New Products |
Alliance Memory is adding to its extensive line of legacy fast asynchronous SRAMs with a new 4M (256K x 16) IC in the 48-ball FBGA package. The AS7C34098A-10BIN can be…
Bluetooth low energy/Smart advanced navigation remote control for connected TVs is demonstrated at CES
Bluetooth low energy/Smart advanced navigation remote control for connected TVs is demonstrated at CES
Technology News |
Nordic Semiconductor ASA has chosen CES to demonstrate the company's upcoming nRFready μBlue Smart Remote reference design -— claimed to be the world's first Bluetooth low energy/Smart advanced navigation remote…
Dual 18-bit current output SPI DAC achieves ±1LSB INL and DNL over temperature
Dual 18-bit current output SPI DAC achieves ±1LSB INL and DNL over temperature
New Products |
Linear Technology Corporation has introduced the industry's first high performance dual, 18-bit, current output digital-to-analog converter (DAC). The LTC2758 offers accurate 18-bit DC specifications, including ±1LSB (max) INL and DNL…
Low power MCU with integrated LCD cuts medical system costs
Low power MCU with integrated LCD cuts medical system costs
New Products |
Texas Instruments Incorporated has introduced the company’s lowest cost microcontroller (MCU) with an integrated LCD controller. Based on TI’s MSP430 ultra-low power MCU core, the AFE4110 delivers an industry-leading combination…
Lumiotec and Universal Display strike OLED technology license agreement
Lumiotec and Universal Display strike OLED technology license agreement
Technology News |
Lumiotec, a manufacturer of OLED lighting panels, and Universal Display Corporation have entered into an OLED technology license agreement under which Lumiotec will be licensed to integrate Universal Display's proprietary…
XP Power extends line-up of miniature board mounted LED drivers
XP Power extends line-up of miniature board mounted LED drivers
New Products |
XP Power has announced additions to its LDU series of PCB mount DC input constant current LED drivers. Comprising four models offering power outputs of 5, 7, 14 and 20…
Philips Lumileds names Pierre Yves Lesaicherre as CEO
Philips Lumileds names Pierre Yves Lesaicherre as CEO
Business news |
Philips LED manufacturing subsidiary Lumileds has announced the appointment of Pierre Yves Lesaicherre as CEO of Philips Lumileds, effective immediately.
Power-management functions for energy harvesting
Power-management functions for energy harvesting
Technology News |
Karthik Kadirvel, John Carpenter and Brian Lum-Shue-Chan of Texas Instruments focus on the power management considerations of DC energy harvesters which are easier to obtain in high volume quantities compared…
High-precision MEMS frequency synthesizer competes directly with quartz
High-precision MEMS frequency synthesizer competes directly with quartz
New Products |
NXP Semiconductors has developed a high-precision silicon MEMS-based frequency synthesizer that it sees competing directly with quartz crystal-based timing devices.
Cypress achieves USB-IF certification of SuperSpeed USB 3.0 controllers
Cypress achieves USB-IF certification of SuperSpeed USB 3.0 controllers
Technology News |
Cypress Semiconductor Corp. has attained USB-IF certification of the company's two SuperSpeed USB Peripheral Controllers: EZ-USB FX3 (CYUSB3014) and West Bridge Benicia (CYWB0263BB). Both of these peripheral controllers are in…
Movea unveils 3D Motion remote reference design based on InvenSense MPU-6150
Movea unveils 3D Motion remote reference design based on InvenSense MPU-6150
New Products |
Movea has released a motion enabled remote control reference design with Movea's Air MotionIC firmware using InvenSense's MPU-6150, which claims to be the world's first and smallest 6-axis MotionTracking device…
SiGe technology platform for 4G RF front-end modules
SiGe technology platform for 4G RF front-end modules
Technology News |
Microsemi Corporation claims to have developed a breakthrough technology platform for 4G RF front-end modules (FEMs) based on silicon germanium (SiGe) technology. The company is already developing next-generation IEEE 802.11ac…
UEI integrates Movea’s SmartMotion technology on next generation motion-sensing remote control platform
UEI integrates Movea’s SmartMotion technology on next generation motion-sensing remote control platform
Technology News |
Movea is entering a collaborative development effort with Universal Electronics Inc. (UEI). The collaboration covers the development and demonstration of Movea's MotionIC platform on UEI's latest UEI WaveMotion remote control…
High-temperature sensor for exhaust systems with large diameters
High-temperature sensor for exhaust systems with large diameters
New Products |
EngineSens Motorsensor GmbH has developed a resistance thermometer with an immersion depth of up to 135 mm. With the product, the company targets particulate filter control applications for Diesel engines…
HomePlug Powerline Alliance unveils AV2 specification for next-generation broadband speeds over powerline wires
HomePlug Powerline Alliance unveils AV2 specification for next-generation broadband speeds over powerline wires
Technology News |
The HomePlug Powerline Alliance is making available the HomePlug AV2 specification. The new HomePlug technology will enable improved performance and coverage for broadband networking over powerline wires while remaining fully…


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