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Page 2959
Digi-Key signs global distribution agreement with Maxwell Technologies
Digi-Key signs global distribution agreement with Maxwell Technologies
Business news |
Digi-Key Corporation has signed a global distribution agreement and will now distribute Maxwell Technologies products worldwide.
Micross to offer Intersil’s precision analog die and custom packaging solutions
Micross to offer Intersil’s precision analog die and custom packaging solutions
Technology News |
Intersil Corporation has expanded the company's precision analog die offerings through authorized distributor Micross Components.
Garden luminaire, additional colors expand Osram’s Noxlite line
Garden luminaire, additional colors expand Osram’s Noxlite line
New Products |
Osram is expanding its line of Noxlite outdoor LED luminaires. New in the range is the Noxlite LED Garden Spot…
Nufront’s third-generation mobile applications processor integrates Cadence DDR3/3L/LPDDR2 memory interface IP solution
Nufront’s third-generation mobile applications processor integrates Cadence DDR3/3L/LPDDR2 memory interface IP solution
Technology News |
Nufront's NS115 chipset has been integrated with the Cadence configurable DDR3/3L/LPDDR2 Memory Controller and Hard PHY IP core in its…

Energy Micro partners Spectrum Design Solutions to offer energy-efficient wireless designs
Energy Micro partners Spectrum Design Solutions to offer energy-efficient wireless designs
Business news |
Energy Micro has forged a strategic relationship with Spectrum Design Solutions, a division of Digi International that provides wireless design services. The two companies will work together to solve customers’…
Half-pitch package option for transistor photocouplers offers direct replacement for popular couplers while improving insulation peak voltage
Half-pitch package option for transistor photocouplers offers direct replacement for popular couplers while improving insulation peak voltage
New Products |
Toshiba Electronics Europe (TEE) has expanded its family of general purpose transistor photocouplers with its first devices in a small, low-profile SO4 half-pitch package.
Hall effect switch supports portable product miniaturization
Hall effect switch supports portable product miniaturization
New Products |
Diodes Incorporated has introduced what the company claims is the world's smallest programmable omnipolar Hall effect switch. The AH1892 is well-suited for proximity and position detection in space-constrained portable and…
A $49 Android PC
A $49 Android PC
New Products |
VIA Technologies has launched a $49 Android PC system.
Half-pitch package option for transistor photocouplers offers direct replacement for popular couplers
Half-pitch package option for transistor photocouplers offers direct replacement for popular couplers
New Products |
Toshiba Electronics Europe (TEE) has expanded its family of general purpose transistor photocouplers with its first devices in a small, low-profile SO4 half-pitch package.
Hall-effect current sensor IC is optimised for 3.3 V operation at high temperatures
Hall-effect current sensor IC is optimised for 3.3 V operation at high temperatures
New Products |
The new ACS759 from Allegro MicroSystems is a high-current/high-temperature linear Hall-effect current sensor IC that provides an economical and precise solution for AC or DC current sensing in 3.3 V…
TrenchMOS power transistors tested for high reliability
TrenchMOS power transistors tested for high reliability
New Products |
NXP Semiconductors has introduced a family of automotive power MOSFETs based on the company's proprietary Trench 6 technology, featuring extremely low RDSon, high switching performance, and outstanding quality and reliability.
New 32bit microcontroller IP Core for low energy embedded applications
New 32bit microcontroller IP Core for low energy embedded applications
New Products |
French processor IP core designer Cortus has extended its family of cores with an energy efficient design aimed at low power embedded applications such as wireless sensor networks, touchscreen controllers,…
AdvancedMC module provides affordable FPGA performance and flexible I/O
AdvancedMC module provides affordable FPGA performance and flexible I/O
New Products |
CommAgility in Loughborough, UK, has developed an AdvancedMC FPGA module with an extensive set of high speed I/O for maximum flexibility in interfacing for applications such as wireless, general-purpose FPGA…
Ashling supports cJTAG debug interface standard for Synopsys DesignWare ARC processor cores
Ashling supports cJTAG debug interface standard for Synopsys DesignWare ARC processor cores
New Products |
Ashling has released support for Compact JTAG (cJTAG), which is based on the IEEE 1149.7 standard and allows debugging of Synopsys DesignWare ARCTM processor cores through a two-wire interface when…
Bond via array technology pushes interconnect boundaries between memory and processor dies to 1,512 pins
Bond via array technology pushes interconnect boundaries between memory and processor dies to 1,512 pins
Technology News |
Provider of IC packaging and interconnect solutions, Invensas has unveiled a package-on-package (PoP) solution relying on an internally developped bond via array (BVA) technology.
Energy Micro partners withSpectrum Design Solutions to offer energy-efficient wireless designs
Energy Micro partners withSpectrum Design Solutions to offer energy-efficient wireless designs
Business news |
Energy Micro has forged a strategic relationship with Spectrum Design Solutions, a division of Digi International that provides wireless design services. The two companies will work together to solve customers’…
IC analysis software supports coupled power and thermal simulations
IC analysis software supports coupled power and thermal simulations
New Products |
Docea Power is now shipping Aceplorer 3.0 with an event scheduler for enhanced scenario creation capabilities and support for thermal models generated by its AceThermalModeler for coupled power and thermal…
120 W SPDT switch for LTE base stations and military communications
120 W SPDT switch for LTE base stations and military communications
New Products |
M/A-COM Technology Solutions has introduced today a 120-W PIN diode SPDT switch for network applications and military communications.
New report suggests the European market for data center power distribution products may have untapped potential
New report suggests the European market for data center power distribution products may have untapped potential
Market news |
A new study by market analyst IMS Research shows that the global data center power distribution market was worth $440 million in 2011.
ROHM Semiconductor unveils the industry’s first mass-produced ‘full SiC’ power modules 
ROHM Semiconductor unveils the industry’s first mass-produced ‘full SiC’ power modules 
Technology News |
ROHM has released what the company claims is the industry's first mass production of SiC power modules (1200 V/100 A rated) comprised entirely of SiC power elements as custom module.
Nufront’s third-generation mobile applications processor integrates Cadence DDR3/3L/LPDDR2 memory interface IP
Nufront’s third-generation mobile applications processor integrates Cadence DDR3/3L/LPDDR2 memory interface IP
Technology News |
Nufront's NS115 chipset has been integrated with the Cadence configurable DDR3/3L/LPDDR2 Memory Controller and Hard PHY IP core in its dual-core ARM Cortex-A9 based mobile applications processor.
Avnet Embedded brings LG Display 12.1” TFT to a broader market
Avnet Embedded brings LG Display 12.1” TFT to a broader market
New Products |
Avnet Embedded introduces the LG Display LB121S03-TL03, industrial 12.1” SVGA TFT panel.
25W to 2500W medical power supplies approved to IEC60601-1 3rd edition standard
25W to 2500W medical power supplies approved to IEC60601-1 3rd edition standard
New Products |
XP Power announced that its 25W to 2500W medical power supply products have been approved to the new IEC60601-1 3rd edition standard.
Video and audio storage requirements drive doubling of maximum hard drive densities by 2016
Video and audio storage requirements drive doubling of maximum hard drive densities by 2016
Market news |
Maximum areal densities in hard disk drives (HDD) are expected to more than double during the five-year period from 2011 to 2016, spurring continued growth for HDDs in storage-intensive applications…
ON Semiconductor expands R&D operations with design centre in Roznov
ON Semiconductor expands R&D operations with design centre in Roznov
Business news |
ON Semiconductor has expanded its operations located in Roznov, Czech Republic, with the opening of a new 4,000 square meter state-of-the-art research and design (R&D) facility.
While LED lighting is becoming ubiquitous OLED is catching up
While LED lighting is becoming ubiquitous OLED is catching up
Feature articles |
Energy efficiency is driving the economy and in the lighting industry, energy efficiency is increasingly becoming a synonym for solid state lighting and digital control techniques.
63V and 75V SMD polymer tantalum capacitors for high voltage application
63V and 75V SMD polymer tantalum capacitors for high voltage application
New Products |
AVX has developed what the company claims to be the industry's first 63V and 75V single-anode tantalum polymer capacitors.
EpiGaN starts production on Research Campus Hasselt
EpiGaN starts production on Research Campus Hasselt
Business news |
EpiGaN is currently offering state-of-the-art GaN epitaxial layers deposited either on Si up to 150 mm or, for specific applications, on SiC.


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