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Industrial IoT platform offers secure device lifecycle management
Industrial IoT platform offers secure device lifecycle management
New Products |
The latest release of the Wind River (Alameda, CA) Helix Device Cloud, a device lifecycle management platform for Industrial IoT,…
Software analyzes multi-region V2X messages
Software analyzes multi-region V2X messages
New Products |
Anritsu Corporation (Atsugi, Kanagawa Prefecture, Japan) has launched the V2X 802.11p Evaluation Software MX727000A, the first of its kind that…
IR LED module for iris and facial biometrics
IR LED module for iris and facial biometrics
New Products |
Lextar Electronics' (Hsinchu City, Taiwan) PR88 IR LED module is suitable for both iris and facial biometric functions. It comes…
America continues to drive chip market growth
America continues to drive chip market growth
Market news |
America remains the hottest geographic market in a global chip market that has recorded its thirteenth consecutive month of year-on-year…

Power-line communications chipset simplifies smart meter design
Power-line communications chipset simplifies smart meter design
New Products |
ST Microelectronics (Geneva, Switzerland) has launched a modular, programmable power-line communications (PLC) chipset that simplifies the design and deployment of new smart meters, smart-grid hardware, smart streetlamps, and home and…
Lithium-sulphur batteries hold promise for electromobility
Lithium-sulphur batteries hold promise for electromobility
Technology News |
Initiated in June 2014, the three-year LiScell (Lithium-sulphur) project led by the Fraunhofer-Gesellschaft in cooperation with other Fraunhofer institutes has come to a conclusion with very promising results.
SiC MOSFETs debut from Littelfuse
SiC MOSFETs debut from Littelfuse
New Products |
Littelfuse (Chicago, IL) has launched its first series of silicon carbide (SiC) MOSFETs following its investment in March in SiC technology development company, Monolith Semiconductor.
26-GHz SMT module addresses European 5G ‘Pioneer Band’
26-GHz SMT module addresses European 5G ‘Pioneer Band’
Technology News |
Plextek RFI, in collaboration with Filtronic Broadband, has developed a front-end, multi-chip module (MCM) to cover the recently-designated European ‘Pioneer Band’ for millimetre-wave (mmWave) 5G around 26-GHz.
Tessera sues Samsung and chip distributors in Europe
Tessera sues Samsung and chip distributors in Europe
Business news |
A subsidiary of Tessera Technologies is suing Samsung and its distributors in Europe over patents relating to ball grid array packaging.
Boosting battery pack production with laser welding and 3D printing
Boosting battery pack production with laser welding and 3D printing
Technology News |
The Fraunhofer Institute for Laser Technology in Aachen, Germany, has developed a technique for building battery packs that combines robotics, laser welding and 3D printing. …
e-peas raises €3.5m for energy harvesting power management
e-peas raises €3.5m for energy harvesting power management
Business news |
Belgian energy harvesting chip startup e-peas Semiconductors has raised €3.5 million (about $4.2 million) in a venture capital round led by Partech Ventures, and including Airbus Ventures, JCDecaux Holding, Semtech,…
Majority of thermal engineers spend over day solving designs
Majority of thermal engineers spend over day solving designs
Technology News |
Two thirds of thermal engineers have to wait at least a day for their simulations says a new report from 6SigmaET.
TSMC’s Morris Chang sets retirement date
TSMC’s Morris Chang sets retirement date
Business news |
Morris Chang, chairman of foundry Taiwan Semiconductor Manufacturing Co. Ltd., has announced he will retire immediately after the annual shareholders meeting in early June 2018.
Zeiss invests €30 million in German incubator
Zeiss invests €30 million in German incubator
Business news |
Optoelectronics specialist Carl Zeiss AG has announced plans to build a shared innovation hub on the north campus of the Karlsruhe Institute of Technology (KIT). Construction is scheduled to begin…
Full Bluetooth 5 compliant wireless MCU module
Full Bluetooth 5 compliant wireless MCU module
New Products |
Swiss company, u‑blox has launched a full Bluetooth 5 compliant NINA-B3 wireless MCU (microcontroller unit) module that features Bluetooth low energy long range connectivity, high data transfer rates and support…
Intel’s hardware+software platform to ease deployment of FPGA acceleration
Intel’s hardware+software platform to ease deployment of FPGA acceleration
New Products |
Intel has announced a hardware and software platform solution to enable faster deployment of customized field programmable gate array (FPGA)-based acceleration of networking, storage and computing workloads. Intended to simplify…
Wirepas and Telit launch multifrequency radio module for IoT
Wirepas and Telit launch multifrequency radio module for IoT
New Products |
Wirepas and Telit are launching a, Wirepas enabled, multifrequency connectivity module to the market that is ideal for large-scale Iot applications. Wirepas Connectivity on the multifrequency Telit RE866 module enables…
Portable, matched network/spectrum analyser T&M family from Rohde & Schwarz
Portable, matched network/spectrum analyser T&M family from Rohde & Schwarz
New Products |
The ZNL network analyzer and FPL1000 spectrum analyzer form a family of compact, portable test instruments, designed to be compact, portable and versatile instruments for research, service and production.
Infineon, IBM, GreenCom & icentic to work on secure connected energy utilities
Infineon, IBM, GreenCom & icentic to work on secure connected energy utilities
Partners |
Infineon Technologies, IBM, GreenCom Networks and icentic have joined forces to develop and provide scalable solutions for building a future grid of diverse energy generators and consumers that will have…
Report finds two thirds of thermal engineers must spend a day or more solving their designs
Report finds two thirds of thermal engineers must spend a day or more solving their designs
Technology News |
According to the new State of Thermal report from 6SigmaET 66-percent of thermal engineers must wait at least a day for their thermal simulations to solve. In compiling the report,…
Mixed-signal-programmable IC maker kicks off design contest
Mixed-signal-programmable IC maker kicks off design contest
Market news |
Silego and efabless have created the “Go Configure Design Challenge Series”, intended to highlight Siligo’s customisable mixed-signal chips, and offering over $15,000 in prizes.
10W, 16W wireless power demo kits show multiple-device charging
10W, 16W wireless power demo kits show multiple-device charging
New Products |
Efficient Power Conversion Corporation (EPC) has added two demonstration kits - the EPC9127, a complete wireless power kit including a 10W, class 2 amplifier, category 3 receiver device and the…
Handheld RF/microwave analyzer extends signal analysis features
Handheld RF/microwave analyzer extends signal analysis features
New Products |
Keysight Technologies has added signal demodulation, vector signal analysis and I/Q analysis to its FieldFox handheld analyzers…
Multi-region V2X message analysis software
Multi-region V2X message analysis software
New Products |
Anritsu Corporation ihas launched the V2X 802.11p Evaluation Software MX727000A, the first of its kind that supports V2X message analysis for US, EU and Japan vehicle-to-vehicle and vehicle-to-roadside (V2X) communications…
Bluetooth 5 MCU module supports latest mesh additions
Bluetooth 5 MCU module supports latest mesh additions
New Products |
u-blox (Thalwil, Switzerland) has added a full Bluetooth 5 compliant NINA-B3 wireless MCU (microcontroller unit) module. Featuring Bluetooth low energy long range connectivity, high data transfer rates and supporting Bluetooth…
Secure device lifecycle management advances industrial IoT
Secure device lifecycle management advances industrial IoT
New Products |
The latest release of Wind River Helix Device Cloud, a device lifecycle management platform for Industrial IoT, offers a range of new features and capabilities to address legacy devices and…
Silego, eFabless launch ‘fun’ design challenge
Silego, eFabless launch ‘fun’ design challenge
Business news |
Silego Technology Inc. and eFabless Corp. have launched the 'Go Configure Design Challenge Series, with the purpose of promote the open-source, configurable design of analog and mixed-signal electronics – and…
HUBER+SUHNER to debut superior injection molded 3D radar antenna
HUBER+SUHNER to debut superior injection molded 3D radar antenna
Business news |
HUBER+SUHNER will unveil its new injection molded 3D structure radar antenna at European Microwave Week (EUMW) 2017 next week…


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