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Page 1269
Tiny common mode choke for noise suppression in CAN applications
Tiny common mode choke for noise suppression in CAN applications
New Products |
Coilcraft’s 1812CAN Series common mode chokes provide noise suppression on CAN (1 Mbps) or CAN FD (5 Mbps) data lines in automotive…
Zinc producer looks to expand with US accelerator
Zinc producer looks to expand with US accelerator
Business news |
Belgian zinc producer EverZinc has set up a dedicated innovation unit and accelerator to develop new zinc-based products. …
Hyundai to add transparent solar roof to its cars
Hyundai to add transparent solar roof to its cars
Business news |
Kia Motors and Hyundai Motor are to add solar panels to cars from next year to provide power for internal…
Bluetooth 5 SoCs deliver low power for battery-free IoT
Bluetooth 5 SoCs deliver low power for battery-free IoT
New Products |
Ultra-low-power wireless fabless semiconductor startup Atmosic Technologies (Saratoga, CA) has launched what it says are the industry's lowest power wireless…

Hyundai to add transparent solar roof to its cars
Hyundai to add transparent solar roof to its cars
Business news |
Kia Motors and Hyundai Motor are to add solar panels to cars from next year to provide power for internal combustion engines (ICE) as well as hybrid and battery versions.
Low-profile common mode choke for noise suppression in CAN applications
Low-profile common mode choke for noise suppression in CAN applications
New Products |
Coilcraft has launched a series of common mode chokes for noise suppression on CAN (1 Mbps) or CAN FD (5 Mbps) data lines in industrial automation and automotive applications.
VW, Mobileye set up electric ride hailing service in Israel
VW, Mobileye set up electric ride hailing service in Israel
Business news |
Volkswagen, Mobileye and Champion Motors plan to jointly develop the first Ride Hailing Service with autonomous electrically driven vehicles (Mobility-as-a-Service, MaaS) in Israel from 2019. In this context, the partners…
Shrinking a supercapacitor
Shrinking a supercapacitor
New Products |
Taiyo Yuden has launched its smallest lithium ion-based supercapacitor for short term energy supply…
48Mpixel 0.8μm image sensors for smartphones
48Mpixel 0.8μm image sensors for smartphones
New Products |
Samsung Electronics has launched two new 0.8-micrometer (μm) pixel image sensors – the 48-megapixel (Mp) Samsung ISOCELL Bright GM1 and the 32Mp ISOCELL Bright GD1.
Publicly-funded VR/AR centre opens in Brooklyn
Publicly-funded VR/AR centre opens in Brooklyn
Technology News |
Columbia University announced it took part in the launch of RLab, the US’s first ever publicly-funded virtual and augmented reality (VR/AR) lab.
Lens-free OLEDs as efficient as inorganic LEDs
Lens-free OLEDs as efficient as inorganic LEDs
Technology News |
The use of organic light-emitting diodes (OLEDs) has extended to various applications, but their efficiency is still lagging behind inorganic light-emitting diodes.
Mini LED backlighting to ramp up in 2019, production costs still a challenge, says TrendForce
Mini LED backlighting to ramp up in 2019, production costs still a challenge, says TrendForce
Market news |
According to the latest report - New Display Technology Cost Analysis - by WitsView, a division of TrendForce, Mini LED technology has made constant process over the past year, with a significant increase in…
System-level power analysis platform is AI-based
System-level power analysis platform is AI-based
New Products |
Mirabilis Design has launched VisualSim AI-based Power, a system-level power analysis platform for design teams looking to optimize power requirements in the early stage of product design. …
Chip scale Li-Ion protection for wearables
Chip scale Li-Ion protection for wearables
New Products |
Ricoh Electronic Devices in Japan has launched two single cell Li-Ion battery protection ICs in a Wafer Level Chip Scaled Package (WLCSP) specially designed for use in rechargeable wearable designs…
DARPA looks to teach machines common sense
DARPA looks to teach machines common sense
Technology News |
The Defense Advanced Research Projects Agency (DARPA) has launched a program designed to explore methods for teaching computers broad strategies for solving problems - similar to the basic background knowledge…
Advantest, TSSI team on cloud-based semiconductor test software
Advantest, TSSI team on cloud-based semiconductor test software
Business news |
Advantest in Germany has teamed up with Test Systems Strategies, Inc. (TSSI) on a software module to convert electronic design automation (EDA) formats (e.g., VCD, EVCD, WGL, STIL) to the…
Board enables simple testing of DOSA power converters
Board enables simple testing of DOSA power converters
New Products |
Recom in Austria has developed evaluation board for its recent DOSA-format DC-DC power supplies to simplify testing.
Lowest-power Bluetooth 5 SoCs promise battery-free IoT
Lowest-power Bluetooth 5 SoCs promise battery-free IoT
New Products |
Ultra-low-power wireless fabless semiconductor startup Atmosic Technologies (Saratoga, CA) has launched what it says are the industry's lowest power wireless Bluetooth 5 platforms for battery-free connected IoT.
Multiprotocol gigabit TSN-enabled processors for Industry 4.0
Multiprotocol gigabit TSN-enabled processors for Industry 4.0
New Products |
Texas Instruments has released what the company claims to be the industry’s first multiprotocol gigabit (Gb) time-sensitive networking (TSN)-enabled processor family.
About custom display design
About custom display design
Feature articles |
Leading UK based display specialist Anders, design, develop, and deliver LCD touchscreen and embedded display technology. The company has transformed, its continued investment in engineering, supports the growing industrial need…
1080p LCOS microdisplay integrates driver functions and memory
1080p LCOS microdisplay integrates driver functions and memory
New Products |
OmniVision Technologies’ OP02220 is claimed to be the industry’s first 1080p liquid crystal on silicon (LCOS) microdisplay with integrated driver functions and memory. This compact, low-power and cost-effective microdisplay is…
Samsung launches 7nm EUV process, SAFE partnership
Samsung launches 7nm EUV process, SAFE partnership
Technology News |
Samsung Electronics Co. Ltd. has announced the launch of its 7LPP 7nm manufacturing system along with a set of partners to help take designs through to foundry production.
EU’s Tulipp project delivers its results for embedded vision
EU’s Tulipp project delivers its results for embedded vision
Technology News |
Launched in 2016, EU initiative Tulipp (Towards Ubiquitous Low-power Image Processing Platforms) target the development of high performance, energy-efficient embedded systems for a growing range of increasingly complex image processing…
IEDM: SK Hynix makes PCM-based 3D crosspoint memory
IEDM: SK Hynix makes PCM-based 3D crosspoint memory
Technology News |
Memory chip maker SK Hynix Inc. (Icheon, South Korea) is set to follow in the footsteps of Intel and Micron with its own version of a 3D-crosspoint non-volatile memory based…
Report: China forms RISC-V consortium
Report: China forms RISC-V consortium
Business news |
More than 50 companies, academic units and research institutes in China have come together to form the China RISC-V Industry Consortium, according to a Digitimes report.
Micron to buy Intel out from manufacturing venture
Micron to buy Intel out from manufacturing venture
Business news |
Memory chip maker Micron Technology Inc. (Boise, Idaho) has said it intends to acquire Intel's remaining interest in the IM Flash Technologies LLC (Lehi, Utah) joint venture for approximately $1.5…
IEDM: Intel embeds MRAM in FinFET process
IEDM: Intel embeds MRAM in FinFET process
Technology News |
Intel has followed in the footsteps of Globalfoundries, Samsung and TSMC in developing magnetic RAM as an embedded non-volatile memory (NVM) for use in IC manufacturing.
ASML, IMEC to take EUV lithography to high-NA
ASML, IMEC to take EUV lithography to high-NA
Technology News |
Semiconductor manufacturing equipment maker ASML Holding NV (Veldhoven, The Netherlands) and research institute IMEC (Leuven, Belgium) have agreed to extend collaboration on EUV lithography to go beyond the 3nm logic…


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