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Technology News Page 85

Technology News Page 85
Tenstorrent chooses Samsung to make next AI chiplets
Tenstorrent chooses Samsung to make next AI chiplets
Technology News |
AI processor pioneer Tenstorrent Inc. (Toronto, Canada) has announced it will use Samsung Foundry to bring its next generation AI…
TRUMPF, KDPOF show first 980nm multi-gigabit interconnect system for automotive
TRUMPF, KDPOF show first 980nm multi-gigabit interconnect system for automotive
Technology News |
Trumpf Photonic Components and KDPOF in Spain have shown the first 980nm multi-gigabit interconnect system for automotive systems Trumpf and…
New QSFP-DD specification pushes bandwidth to 1.6 Tbps
New QSFP-DD specification pushes bandwidth to 1.6 Tbps
Technology News |
Improving performance, scalability and power handling, revision 7 of the QSFP-DD MSA specification introduces a higher 200 bps lane rate.
H1 quantum computer demonstrates an advance in fault-tolerant operations
H1 quantum computer demonstrates an advance in fault-tolerant operations
Technology News |
Quantinuum’s H1 quantum computer successfully executes a fully fault-tolerant algorithm with three logically-encoded qubits Fault-tolerant quantum computers that offer radical…

First microLED based transceiver IC in 16nm finFET CMOS
First microLED based transceiver IC in 16nm finFET CMOS
Technology News |
1-Tbps microLED-based transceiver IC in 16nm finFET CMOS enables fast low-power chip-to-chip communications.
First merchant 800G silicon photonic datacentre chip
First merchant 800G silicon photonic datacentre chip
Technology News |
DustPhotonics in Israel is laying claim to the first merchant silicon photonics chip for 800G datacentre interconnect. The 800G PIC (Photonic Integrated Circuit), shown at the European Conference on Optical…
Scalable 200Gbit/s SiGe BiCMOS optical receiver targets the datacentre
Scalable 200Gbit/s SiGe BiCMOS optical receiver targets the datacentre
Technology News |
Researchers in Belgium have developed a scalable silicon germanium (SiGe) optical receiver that can run at speeds of 200Gbit/s. The team at IDLab, an imec research group at Ghent University,…
Bio-magnetic sensor startup with metaverse potential raises funds
Bio-magnetic sensor startup with metaverse potential raises funds
Business news |
Bio-sensor startup Neuranics Ltd. (Glasgow, Scotland) has raised US$2.3 million in a seed round of founding. Founded in 2021 as a joint spinout from the University of Glasgow and the…
Negligible voltage decay for cobalt-free battery
Negligible voltage decay for cobalt-free battery
Technology News |
Researchers in China have developed a cobalt-free lithium battery with minimal voltage decay using a lithium manganese-rich (LMR) layered oxide. A research team led by City University of Hong Kong…
Intel begins EUV lithography of ‘Intel 4’ process in Ireland
Intel begins EUV lithography of ‘Intel 4’ process in Ireland
Business news |
Intel has started the mass production of chips using the ‘Intel 4’ process at an opening event for Fab 34 in Leixlip, Ireland. This will be the first time extreme…
Tool boosts interoperability of eSIM, iSIM services
Tool boosts interoperability of eSIM, iSIM services
Technology News |
The Trusted Connectivity Alliance (TCA) has released a free tool to boost the interoperable deployment of SIM-based value-added services. The TCALoader tool enables mobile operators and application developers to download, install…
GaN Systems launches fourth generation power transistors
GaN Systems launches fourth generation power transistors
Technology News |
GaN Systems has launched its fourth generation gallium nitride transistors. The e-mode devices target a 20% improvement in input and output figures-of-merit with reduced losses and lower costs, although details…
Power and cooling challenges of the Raspberry Pi 5
Power and cooling challenges of the Raspberry Pi 5
Technology News |
The higher performance of the Raspberry Pi 5 has led to significant changes in the design of the board. The Raspberry Pi 5 board consumes significantly less power and runs…
Segger taps J-link tech for headless device debug
Segger taps J-link tech for headless device debug
Technology News |
Segger has developed a simpler way to configure a device that does not have a display based on its J-Link debugger probe technology. The Segger emWeb tool means that connecting…
Raspberry Pi 5 moves to disaggregated architecture with in-house silicon
Raspberry Pi 5 moves to disaggregated architecture with in-house silicon
Technology News |
Raspberry Pi has launched its fifth generation board with a new architecture based around a new in-house chip and higher performance processor from Broadcom. Raspberry Pi 5 is based around…
Unified 3nm chiplet platform with UCIe IP
Unified 3nm chiplet platform with UCIe IP
Technology News |
Synopsys is extending its collaboration with TSMC on multi-die chiplet system designs on the 3nm N3E process technology. Synopsys says its physical IP for the Universal Chiplet Interconnect Express (UCIe)…
Winbond stacks memory die for generative AI at the edge
Winbond stacks memory die for generative AI at the edge
Technology News |
Winbond Electronics in Taiwan has launched a technology to stack memory on a processor for generative AI in edge devices. The Winbond customized ultra-bandwidth elements (CUBE) enable memory technology to…
Beam me down Scotty
Beam me down Scotty
Technology News |
ETRI Researchers Beam Signals Through Rock for Reliable Underground Wireless Communications Researchers from South Korea’s Electronics and Telecommunications Research Institute (ETRI) have developed what they call the world’s…
Stellantis looks to AI to slash the number of chips in cars
Stellantis looks to AI to slash the number of chips in cars
Technology News |
Stellantis is looking to a new automotive architecture to significantly cut the number of processors in a vehicle. The new Stellantis platform design includes a ground-up design for vehicle electronics…
Nissan taps CCTV for self driving car trial on UK residential roads
Nissan taps CCTV for self driving car trial on UK residential roads
Technology News |
Nissan has started the UK’s latest research project into self driving car technology on residential and rural roads using V2X technologies. evolvAD will put the Nissan LEAF self driving car…
From Shower to Power – Luffa sponges
From Shower to Power – Luffa sponges
Technology News |
It is possible to capture small amounts of electricity by repeatedly squeezing treated luffa sponges Luffa sponges are porous shells that are left behind when the fruit of a luffa…
Tachyum runs x86-64 binaries on FPGA model
Tachyum runs x86-64 binaries on FPGA model
Technology News |
Chip designer Tachyum has hit a key milestone by running non-native x86_64 application under Linux running on a model of its Prodigy chip on an FPGA emulation system. The ability…
Drawing LEDs on your shirt
Drawing LEDs on your shirt
Technology News |
Paper and textiles hold great potential as platforms for next-generation flexible and wearable electronics Researchers from the Department of Electrical & Systems Engineering, Washington University in St. Louis, have developed…
Codasip selects Verilock for chaos-based chip security
Codasip selects Verilock for chaos-based chip security
Technology News |
RISC-V processor licensor Codasip GmbH (Munich, Germany) has signed an exclusive deal with hardware security startup Verilock Inc. (Estes Park, Colo.) to provide security technology to its ASIC customers. Verilock…
New material for 6G flexible printed circuit boards
New material for 6G flexible printed circuit boards
Technology News |
Panasonic has developed a new material for flexible printed circuit boards that can be used to create metasurface designs for 6G radio applications as well as wearables and lightweight designs.
Heating where it is needed most
Heating where it is needed most
New Products |
Nowadays, we heat whole rooms and car interiors to keep people warm. Too much energy is wasted! qCella, a Zurich startup, developed a method to impregnate natural fibers with copper…
Intel backs Samsung’s novel DRAM module form factor
Intel backs Samsung’s novel DRAM module form factor
Technology News |
Memory chip market leader Samsung Electronics has received support from Intel for its Low Power Compression Attached Memory Module (LPCAMM) form factor for DRAMs. The company claims the LPCAMM –…
All glass femtosecond laser spinout for photonic quantum computing
All glass femtosecond laser spinout for photonic quantum computing
Technology News |
Researchers in Switzerland are commercialising a femtosecond laser technology that can be built entirely in glass. A team at EPFL in Neuchâtel has developed a palm-sized, all-glass GHz femtosecond laser cavity…


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