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Technology News Page 30

Technology News Page 30
Marvell partners with Micron, Samsung, SK Hynix on custom HBM
Marvell partners with Micron, Samsung, SK Hynix on custom HBM
Partners |
Marvell has said it has been working with the three leading memory chip makers – Micron, Samsung and SK Hynix…
Altermagnetism can create new memory devices
Altermagnetism can create new memory devices
News |
A new class of magnetism called altermagnetism has been imaged for the first time in a new study. The findings…
First AI-powered hyper-definition radar OS for ADAS
First AI-powered hyper-definition radar OS for ADAS
Technology News |
Radar operating system delivers clear visibility to LIDAR resolution in any weather or time of day at a reasonable cost…
imec taps CCD for 3D CXL memory in data centres
imec taps CCD for 3D CXL memory in data centres
Technology News |
Belgian research lab imec has developed a 3D charge-coupled device that could be used as a replacement for DRAM in…

TrustInSoft aligns with CISA initiative on C/C++ vulnerabilities
TrustInSoft aligns with CISA initiative on C/C++ vulnerabilities
Technology News |
TrustInSoft Analyzer supports software security efforts by CISA with tools that mathematically prove the absence of memory-related vulnerabilities in C/C++.
BadRAM memory vulnerability hits AMD processors
BadRAM memory vulnerability hits AMD processors
Technology News |
European cybersecurity researchers have identified a memory vulnerability that impacts AMD processors. The BadRAM vulnerability involves rogue memory modules that deliberately provide false information to the processor during startup. When…
‘Shape’ helps people with visual impairment navigate through haptic perception
‘Shape’ helps people with visual impairment navigate through haptic perception
New Products |
A groundbreaking navigation device can help people with visual impairment perform a location task as well as sighted people, new research shows Researchers from Imperial College London, working with the…
Speed Lightning to data centers and circuit boards
Speed Lightning to data centers and circuit boards
News |
IBM Research scientists are bringing optical speed and capacity somewhere they haven’t previously gone: inside data centers and onto circuit boards Scientists at IBM Research have announced…
Dutch amateurs telescope receives signals from Voyager 1
Dutch amateurs telescope receives signals from Voyager 1
News |
‘Only a few telescopes in the world have received these signals, which are very faint due to the distance of Voyager 1: almost 25 billion kilometers, more than four times…
Quobly, ST to develop FDSOI process for quantum computing
Quobly, ST to develop FDSOI process for quantum computing
Business news |
Startup Quobly SA (Grenoble, France) has formed an exclusive partnership with STMicroelectronics to develop a manufacturing process to support quantum computing. The partners will use ST’s 28nm FDSOI volume manufacturing…
Redesigning the quantum computer
Redesigning the quantum computer
Technology News |
Researchers in the US have come up with a new modular architecture for scaling a superconducting quantum computer. Instead of creating a massive 2D array of qubits, the researchers at…
Combining light sensing and modulation in a single device
Combining light sensing and modulation in a single device
New Products |
Researchers at CEA-Leti in France have combined a liquid crystal cell and a custom CMOS image sensor to sense and modulate light in a single solid state device. The compact…
ST rolls out AI-microcontroller family
ST rolls out AI-microcontroller family
New Products |
ST has announced details of its STM32N6 family of 32bit ARM-based microcontrollers with a neural acceleration unit called Neural-Art on-chip. The addition of machine learning capabilities to a microcontroller makes…
Quobly shows spin qubits on FD-SOI CMOS process
Quobly shows spin qubits on FD-SOI CMOS process
Technology News |
French quantum computing startup Quobly has shown spin qubits for quantum gates built on mainstream CMOS FD-SOI process technology. Quobly, previously Siquance, is a spin out of the CEA-Leti research…
DDS adopted into all AUTOSAR packages and platforms

DDS adopted into all AUTOSAR packages and platforms

Technology News |
RTI is the leading DDS contributor in AUTOSAR, committed to enhancing safety and connectivity for automotive systems.
Magnesium electrolyte sparks next generation battery design
Magnesium electrolyte sparks next generation battery design
News |
University of Waterloo researchers have made a key breakthrough in developing next-generation batteries that are made using magnesium instead of lithium When the idea to create batteries using magnesium…
Kioxia announces low-power, high density OCTRAM technology
Kioxia announces low-power, high density OCTRAM technology
Technology News |
OCTRAM technology delivers low-power, patterning extremely small features, and fully suppresses row hammer interference.
The wind of change is in the Willow – Google’s new AI chip
The wind of change is in the Willow – Google’s new AI chip
News |
Google Quantum AI’s new chip promises error correction and performance that paves the way to a useful, large-scale quantum computer The first is that Willow can reduce errors exponentially as…
Google shows 105 qubit quantum processor with real time error correction
Google shows 105 qubit quantum processor with real time error correction
Technology News |
Google has shown a quantum processor with 105qubits and real time error correction that allows a scalable quantum computer. The Willow quantum processor uses superconducting metals to form resonant circuits…
Battery Pack Monitoring Technology for Electric Vehicles
Battery Pack Monitoring Technology for Electric Vehicles
News |
This IC can help protect high-voltage batteries from overcurrent by constantly monitoring the battery current and slope every eight microseconds NXP® Semiconductors today announced the MC33777, the…
Superconducting CMOS gives AI chip power boost
Superconducting CMOS gives AI chip power boost
Technology News |
imec in Belgium has shown key superconducting building blocks in CMOS for building AI and high performance computing (HPC) systems with dramatically lower energy. The three critical building blocks of…
Robotic fibres with light-emitting, self-healing and magnetic properties
Robotic fibres with light-emitting, self-healing and magnetic properties
Technology News |
Novel multifunctional fibres enhance human-robot interactions in applications ranging from smart textiles to robotic applications.
Connecting qubit islands with quantum bridges
Connecting qubit islands with quantum bridges
News |
Researchers at QuTech have managed to, for the first time, perform coherent logic operations between spin qubits 250 micrometers apart on the same chip. Such ‘enormous’ distances create new opportunities…
Bird-inspired drone can jump for take-off
Bird-inspired drone can jump for take-off
News |
EPFL researchers have built a drone that can walk, hop, and jump into flight with the aid of birdlike legs, greatly expanding the range of potential environments accessible to unmanned…
Leaftronics reloaded: Leaf-inspired solution for sustainable water treatment
Leaftronics reloaded: Leaf-inspired solution for sustainable water treatment
News |
As the team reports in the renowned scientific journal “NJP Flexible Electronics”, they aim to use the nature-inspired “Leaftronics” design in combination with a unique metallization process for an innovative…
Imec shows double row CFET standard cell for A7 process node
Imec shows double row CFET standard cell for A7 process node
Technology News |
imec in Belgium is proposing a standard cell architecture for logic and SRAM on a 0.7nm CMOS A7 process and has built a key component of the cell. Intel, TSMC…
First 3.5D face-to-face packaging for AI processors
First 3.5D face-to-face packaging for AI processors
Technology News |
Broadcom has combined 3D silicon stacking and 2.5D face-to-face packaging technology for AI processors for the first time. The 3.5D eXtreme Dimension System in Package (XDSiP) technology integrates more than…
Samsung, SK Hynix partner on processing-in-memory
Samsung, SK Hynix partner on processing-in-memory
Business news |
Memory chip manufacturers Samsung and SK Hynix are collaborating to standardize processing-in-memory (PIM) in the form of an LP-DDR6 memory, according to Business Korea. The collaboration includes preliminary work to…


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