MENU

Feature articles Page 136

Feature articles Page 136
Asset InterTech buys Arium to add software debug/trace to embedded instrumentation
Asset InterTech buys Arium to add software debug/trace to embedded instrumentation
Feature articles |
With the aim of increasing visibility into complex system development, Arium’s Intel and ARM hardware-assisted debug tools will be integrated…
EDA tools shape custom processor for 3G/LTE Modem
EDA tools shape custom processor for 3G/LTE Modem
Feature articles |
Fujitsu Labs has used Synopsys’ Processor Designer tool to implement a custom DSP that reduces power consumption by 20% compared…
Software quality tools certified by SGS-TÜV SAAR to highest safety levels
Software quality tools certified by SGS-TÜV SAAR to highest safety levels
Feature articles |
Programming Research's QA∙C and QA∙C++ tools have achieved certification that has been extended to cover railways, medical devices and nuclear…
element14 energy harvesting road test design challenge – part 2
element14 energy harvesting road test design challenge – part 2
Feature articles |
Two clear frontrunners have emerged in the element14 Energy Harvesting Design Challenge as the competition nears its final stages. Victor…

Media traffic over IP sees dropped frames; cached packets can help
Media traffic over IP sees dropped frames; cached packets can help
Feature articles |
New coding schemes such as HEVC and Ultra HD are more prone to data loss through dropped packets when streaming on the Internet according to tests by an Israeli equipment…
Reference design embodies vehicle-vehicle interconnection systems
Reference design embodies vehicle-vehicle interconnection systems
Feature articles |
Cohda Wireless and NXP Semiconductors have announced MK4, the latest generation of connected car anti-collision technology based on the NXP/Cohda RoadLINK chipset. The chipset addresses both Vehicle-to-Vehicle (V2V) and Vehicle-to-Infrastructure…
Advanced automotive safety features will appear in all model ranges, says TRW
Advanced automotive safety features will appear in all model ranges, says TRW
Feature articles |
Automotive supplier TRW will display its most advanced active, passive and integrated safety technologies at the IAA International Motorshow in Frankfurt in mid-September. Among the technologies to be displayed are…
More virtual chips, and an application, for Cypress’ PSoC Devices
More virtual chips, and an application, for Cypress’ PSoC Devices
Feature articles |
Cypress Semiconductor has added new IP components to the libraries of its PSoC Creator 2.2 IDE; four pre-verified, “Virtual Chips” that users can drag-and-drop into designs.
Media Transfer Protocol safeguards embedded system/PC file transfers
Media Transfer Protocol safeguards embedded system/PC file transfers
Feature articles |
Segger has introduced an additional module for its emUSB-Device: the Media Transfer Protocol (MTP) component. The MTP class supports file based communication with the host system.
Cryptopgraphic ICs have hardware features to maximise attack-resistance
Cryptopgraphic ICs have hardware features to maximise attack-resistance
Feature articles |
Altis has announced it will sample new products using state-of-the-art cryptology and technologies to address security and performances for mobile and connected devices, by the end of this year.
Driver chip pulses 8A to maximise light output for LED photo-flash
Driver chip pulses 8A to maximise light output for LED photo-flash
Feature articles |
ams has launched an LED flash driver that provides a photo flash light output claimed to be at least four times brighter than flash systems commonly found in smartphones today.
Modbus and CANopen added to protocols in XMOS’ industrial communications range
Modbus and CANopen added to protocols in XMOS’ industrial communications range
Feature articles |
Industrial interfaces expand the range of configurable xCORE multicore microcontrollers; XMOS has added Modbus and CANopen xSOFTip blocks to its range of embedded industrial communications capabilities supported by the xCORE…
Imec overcomes a further barrier to IC fabrication below 10 nm
Imec overcomes a further barrier to IC fabrication below 10 nm
Feature articles |
Imec has announced, at the Semicon West conference in San Francisco, that it has solved metallisation issues in advanced interconnects for the sub-1X technology node.
Spaced out; element14 awards RaspberryPi prize to ‘Pi in the Sky’ project
Spaced out; element14 awards RaspberryPi prize to ‘Pi in the Sky’ project
Feature articles |
An image of the Earth from 38.9km (128,000 ft) has today been confirmed as the winner of element14’s global Raspberry Pi camera competition. David Akerman used a weather balloon to…
iWatt bought by Dialog Semiconductor
iWatt bought by Dialog Semiconductor
Feature articles |
Dialog Semiconductor Plc has entered into an agreement to acquire iWatt Inc., a provider of digital power management ICs.
Current leakage detection IC for automotive applications
Current leakage detection IC for automotive applications
Feature articles |
For backup power supplies in EVs and HEVs that contribute to greater system safety, Rohm has announced an automotive-grade leakage detection IC designed specifically for AC inverters and chargers for…
Modular sampling scopes reveal 20-GHz signals
Modular sampling scopes reveal 20-GHz signals
Feature articles |
At a price point of $15k, Pico's latest series of PC-based oscilloscopes uses sampling-scope techniques to characterise repetitive waveforms in high-speed serial protocols.
Universities contribute as UK’s EPSRC opens National Centre for Power Electronics
Universities contribute as UK’s EPSRC opens National Centre for Power Electronics
Feature articles |
The UK’s capacity in power electronics has received an £18 million boost from the Engineering and Physical Sciences Research Council (EPSRC) following the opening of the first EPSRC National Centre…
60V, 300mA, ultra-small, synchronous step-down DC-DC converter
60V, 300mA, ultra-small, synchronous step-down DC-DC converter
Feature articles |
A new data sheet from Maxim details the MAX15062 fixed-output high-efficiency, high-voltage, synchronous step-down DC-DC converter with integrated MOSFETs that operates over a 4.5V to 60V input voltage range.
Integrated IO-LINK PHY-device has full fault protection
Integrated IO-LINK PHY-device has full fault protection
Feature articles |
TI has introduced a flexible physical layer device that offers high output current with highest operating temperatures for harsh industrial applications.
Plessey releases 350mW GaN on silicon LEDs
Plessey releases 350mW GaN on silicon LEDs
Feature articles |
Plessey is sampling a 350mW LED product (p/n PLB010350), entry level lighting products manufactured on Plessey's 6-inch MAGIC (Manufactured on GaN I/C) line at its Plymouth, England facility.
Value Engineering – Getting the best bangs for your design buck
Value Engineering – Getting the best bangs for your design buck
Feature articles |
Steve Wozniak, co-founder of Apple Inc., counselled, “Be not only innovative but also cost effective. You must have the right costs. Otherwise your product will not reach the market!”…
Integrated buck regulator delivers 10A with 86% efficiency
Integrated buck regulator delivers 10A with 86% efficiency
Feature articles |
Linear Technology Corporation has introduced a 10 A step-down micro-module regulator with high operating efficiency and low temperature rise in a 9 x 15 x 4.92 mm BGA package.
MEMS resonator and oscillator circuitry integrated onto single IC
MEMS resonator and oscillator circuitry integrated onto single IC
Feature articles |
Silicon Labs, using MEMS technology it acquired when it bought Silicon Clocks, has introduced a wide-frequency-range oscillator that uses a MEMS resonator fabricated on the same die as the oscillator…
Distributor survey see upswing in open source hardware and software
Distributor survey see upswing in open source hardware and software
Feature articles |
The use of open source hardware and software will continue to grow among both professional engineers and the hobbyist community in 2013, according to the results of a new survey…
Research cooperation to advance graphene transistors and OLED displays
Research cooperation to advance graphene transistors and OLED displays
Feature articles |
Cambridge University’s Graphene Centre (CGC) and Dresden-based plastic display pioneer Plastic Logic have signed a collaboration agreement, marking Plastic Logic joining the Centre to start work on a research programme…
First LTE-Advanced (LTE-A) Carrier Aggregation (CA) test case
First LTE-Advanced (LTE-A) Carrier Aggregation (CA) test case
Feature articles |
Anite has submitted the first LTE-Advanced (LTE-A) Carrier Aggregation (CA) test case, developed using Anite’s Conformance Toolset and in collaboration with major North American and Asian chipset and device manufacturers.
Tek will use IBM 9HP SiGe technology to take scopes to 70GHz
Tek will use IBM 9HP SiGe technology to take scopes to 70GHz
Feature articles |
Tektronix has confirmed that its next generation of high performance real-time oscilloscopes will incorporate IBM's latest 9HP silicon-germanium (SiGe) chip-making process. This fifth generation of IBM's semiconductor technology along with…


10s