{"id":26960,"date":"2011-05-19T22:00:00","date_gmt":"2011-05-19T22:00:00","guid":{"rendered":"https:\/\/\/white_papers\/jtag-et-instruments-embarques\/"},"modified":"2022-01-26T15:20:49","modified_gmt":"2022-01-26T15:20:49","slug":"jtag-et-instruments-embarques","status":"publish","type":"white_papers","link":"https:\/\/www.ecinews.fr\/fr\/white_papers\/jtag-et-instruments-embarques\/","title":{"rendered":"JTAG et instruments embarqu\u00e9s"},"content":{"rendered":"","protected":false},"excerpt":{"rendered":"

Aujourd’hui, l’\u00e9lectronique fait appel \u00e0 une technologie de montage en surface toujours plus miniaturis\u00e9e, combin\u00e9e \u00e0 des fonctionnalit\u00e9s et des fr\u00e9quences syst\u00e8me croissantes. Cette miniaturisation rend l’acc\u00e8s aux broches des composants sur les cartes de plus en plus difficile, voire impossible. Les \u00e9quipements traditionnels de test et de mesure s’en remettent \u00e0 la connexion de sondes externes. Toutefois, lorsque ce type d’acc\u00e8s n’est pas disponible, il n’est m\u00eame pas possible de v\u00e9rifier la connectivit\u00e9 entre deux broches au moyen d’un simple multim\u00e8tre \u00e0 \u00a0\u00bb buzzer \u00ab\u00a0. La meilleure illustration en est fournie par les bo\u00eetiers BGA dont les broches sont invisibles et, a fortiori, insondables. D’autres applications, telles que le d\u00e9bogage de logiciel via un \u00e9mulateur in-situ externe, sont g\u00ean\u00e9es non seulement par la miniaturisation mais aussi par l’accroissement des fr\u00e9quences syst\u00e8me.<\/p>\n","protected":false},"featured_media":26962,"template":"","tags":[],"company":[448],"wp_category":[],"ppma_author":[1149],"class_list":["post-26960","white_papers","type-white_papers","status-publish","has-post-thumbnail","hentry","company-jtag-technologies"],"acf":[],"yoast_head":"JTAG et instruments embarqu\u00e9s ...<\/title>\n<meta name=\"description\" content=\"Aujourd'hui, l'\u00e9lectronique fait appel \u00e0 une technologie de montage en surface toujours plus miniaturis\u00e9e, combin\u00e9e \u00e0 des fonctionnalit\u00e9s et des...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/white_papers\/26960\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"JTAG et instruments embarqu\u00e9s\" \/>\n<meta property=\"og:description\" content=\"Aujourd'hui, l'\u00e9lectronique fait appel \u00e0 une technologie de montage en surface toujours plus miniaturis\u00e9e, combin\u00e9e \u00e0 des fonctionnalit\u00e9s et des fr\u00e9quences syst\u00e8me croissantes. Cette miniaturisation rend l'acc\u00e8s aux broches des composants sur les cartes de plus en plus difficile, voire impossible. Les \u00e9quipements traditionnels de test et de mesure s'en remettent \u00e0 la connexion de sondes externes. Toutefois, lorsque ce type d'acc\u00e8s n'est pas disponible, il n'est m\u00eame pas possible de v\u00e9rifier la connectivit\u00e9 entre deux broches au moyen d'un simple multim\u00e8tre \u00e0 " buzzer ". La meilleure illustration en est fournie par les bo\u00eetiers BGA dont les broches sont invisibles et, a fortiori, insondables. 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