{"id":19955,"date":"2019-03-19T19:44:19","date_gmt":"2019-03-19T19:44:19","guid":{"rendered":"https:\/\/\/white_papers\/evolution-cryoconnect-et-microconnect\/"},"modified":"2022-01-26T15:08:32","modified_gmt":"2022-01-26T15:08:32","slug":"evolution-cryoconnect-et-microconnect","status":"publish","type":"white_papers","link":"https:\/\/www.ecinews.fr\/fr\/white_papers\/evolution-cryoconnect-et-microconnect\/","title":{"rendered":"Evolution Cryoconnect et Microconnect"},"content":{"rendered":"","protected":false},"excerpt":{"rendered":"<p>L&rsquo;architecture des syst\u00e8mes \u00e9lectrom\u00e9caniques micro \/ nano conna\u00eet une croissance rapide, et la technologie d&rsquo;interconnexion doit suivre le rythme d\u2019\u00e9volution des performances. En bref, cette architecture exige des solutions qui continuent de r\u00e9pondre aux besoins de commande et d&rsquo;extraction de donn\u00e9es, dans des applications syst\u00e8me de plus en plus exigeantes.<br \/>\nLe d\u00e9veloppement de solutions d&rsquo;interconnexion impliquant des micro- et nano-interconnexions, associ\u00e9es \u00e0 des conducteurs en alliage \u00e0 haute r\u00e9sistance, pouvant descendre \u00e0 0,05 mm, peut \u00eatre \u00e0 la fois stimulant et gratifiant pour les sp\u00e9cialistes de ces technologies avanc\u00e9es. En termes simples, les applications cryog\u00e9niques ne cessent d&rsquo;exiger plus de donn\u00e9es et plus de signaux de d\u00e9tection, dans ce qui est devenu un segment de march\u00e9 en fort d\u00e9veloppement.<\/p>\n","protected":false},"featured_media":19957,"template":"","tags":[],"company":[197],"wp_category":[],"ppma_author":[],"class_list":["post-19955","white_papers","type-white_papers","status-publish","has-post-thumbnail","hentry","company-tekdata-interconnections"],"acf":[],"yoast_head":"<title>Evolution Cryoconnect et Microconnect ...<\/title>\n<meta name=\"description\" content=\"L&#039;architecture des syst\u00e8mes \u00e9lectrom\u00e9caniques micro \/ nano conna\u00eet une croissance rapide, et la technologie d&#039;interconnexion doit suivre le rythme...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/white_papers\/19955\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Evolution Cryoconnect et Microconnect\" \/>\n<meta property=\"og:description\" content=\"L&#039;architecture des syst\u00e8mes \u00e9lectrom\u00e9caniques micro \/ nano conna\u00eet une croissance rapide, et la technologie d&#039;interconnexion doit suivre le rythme d\u2019\u00e9volution des performances. 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