{"id":92740,"date":"2019-03-11T23:00:59","date_gmt":"2019-03-11T23:00:59","guid":{"rendered":"https:\/\/\/les-microvias-des-pcbs-ne-seraient-pas-fiables\/"},"modified":"2019-03-11T23:00:59","modified_gmt":"2019-03-11T23:00:59","slug":"les-microvias-des-pcbs-ne-seraient-pas-fiables","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/les-microvias-des-pcbs-ne-seraient-pas-fiables\/","title":{"rendered":"Les microvias des PCBs ne seraient pas fiables"},"content":{"rendered":"<p><span class=\"tlid-translation translation\">Un certain nombre d&rsquo;entreprises OEM membres d&rsquo;IPC ont approch\u00e9 IPC avec des exemples de d\u00e9faillances de microvia dans du mat\u00e9riel haut de gamme qui n&rsquo;ont pu \u00eatre observ\u00e9es qu&rsquo;apr\u00e8s la fabrication, l&rsquo;inspection et l&rsquo;acceptation de cartes de ciruit imprim\u00e9 nues. Les d\u00e9faillances de microvia ont pass\u00e9 sans \u00eatre aper\u00e7ues le test in-circuit apr\u00e8s refusion, l&rsquo;ESS \u00abBox Level\u00bb, et ont \u00e9t\u00e9 mises en service dans des produits clients.<\/span><\/p>\n<p><span class=\"tlid-translation translation\">Bon nombre de ces d\u00e9faillances sont survenues dans des produits ayant d\u00e9j\u00e0 pass\u00e9 avec succ\u00e8s les tests d&rsquo;acceptation de lots de production traditionnels, conform\u00e9ment \u00e0 la norme existante IPC-6010, Sp\u00e9cifications de performance et de qualification du circuit imprim\u00e9.<\/span><\/p>\n<p><span class=\"tlid-translation translation\">IPC a re\u00e7u des donn\u00e9es montrant que les techniques d&rsquo;inspection traditionnelles utilisant des microsections sous contrainte thermique et des microscopes optiques ne constituent plus un outil d&rsquo;assurance qualit\u00e9 efficace pour la d\u00e9tection des d\u00e9faillances du rev\u00eatement conducteur microvia-\u00e0-cible.<\/span><\/p>\n<p><span class=\"tlid-translation translation\">Dans le m\u00eame ordre d&rsquo;id\u00e9es, IPC a publi\u00e9 en 2018 <a href=\"http:\/\/shop.ipc.org\/IPC-WP-023-English-D\">IPC-WP-023, un white paper sur les acceptations OEM de cartes de circuit imprim\u00e9 bas\u00e9es sur les performances, intitul\u00e9 \u00abTest de continuit\u00e9 des cha\u00eenes de vias: menace cach\u00e9e de fiabilit\u00e9 &#8211; Interface Microvia faible\u00bb.<\/a><\/span><\/p>\n<p><span class=\"tlid-translation translation\">Le white paper affirme des probl\u00e8mes de fiabilit\u00e9 de microvias empil\u00e9s li\u00e9s \u00e0 une interface faible entre les pastilles de cible microvia et le remplissage de cuivre \u00e9lectrolytique et fournit des donn\u00e9es \u00e0 l\u2019appui des observations rapport\u00e9es par de nombreuses soci\u00e9t\u00e9s membres d\u2019IPC OEM.<\/span><\/p>\n<p><span class=\"tlid-translation translation\">\u00c0 la suite de l&rsquo;IPC-WP-023, le sous-comit\u00e9 IPC V-TSL-MVIA sur les solutions technologiques concernant les d\u00e9faillances de microvia a \u00e9t\u00e9 cr\u00e9\u00e9 \u00e0 la fin de 2018 afin de commencer \u00e0 rechercher les causes potentielles de ces d\u00e9faillances et de fournir des ressources \u00e0 l&rsquo;industrie sur le sujet. Ce groupe a pr\u00e9sent\u00e9 sa premi\u00e8re mise \u00e0 jour \u00e0 l&rsquo;industrie lors d&rsquo;un forum ouvert tenu lors de l&rsquo;IPC APEX EXPO 2019 et continuera \u00e0 fournir des mises \u00e0 jour \u00e0 mesure de son avancement. En r\u00e9ponse \u00e0 cela, IPC \u00e9met le message d&rsquo;avertissement suivant, qui sera \u00e9galement inclus dans le prochain IPC-6012E, Qualification et Sp\u00e9cifications de performance pour cartes de circuit imprim\u00e9 rigides.<\/span><\/p>\n<p>\u00e0 suivre:<\/p>\n<hr \/>\n<p><span class=\"tlid-translation translation\">\u00abIl y a eu de nombreux exemples de d\u00e9faillances de microvia post-fabrication au cours des derni\u00e8res ann\u00e9es. En r\u00e8gle g\u00e9n\u00e9rale, ces d\u00e9faillances se produisent pendant la refusion, mais elles sont souvent ind\u00e9tectables (latentes) \u00e0 la temp\u00e9rature ambiante. Plus les pannes se manifestent loin du processus d&rsquo;assemblage, plus elles deviennent ch\u00e8res. Si elles ne sont pas d\u00e9tect\u00e9es avant que le produit ne soit mis en service,elles repr\u00e9sentent un risque de co\u00fbt beaucoup plus important et, plus important encore, peuvent poser un risque pour la s\u00e9curit\u00e9. \u201d<\/span><\/p>\n<p><span class=\"tlid-translation translation\">\u00c0 l&rsquo;avenir, l&rsquo;IPC travaille sur le concept consistant \u00e0 s&rsquo;\u00e9loigner des \u00e9valuations de microsection traditionnelles pour se concentrer sur les tests d&rsquo;acceptation fond\u00e9s sur les performances, une recommandation formul\u00e9e il y a plusieurs ann\u00e9es par le groupe de travail D-33a sur la performance des cartes de circuit imprim\u00e9 rigides responsable pour la sp\u00e9cification IPC-6012. .<\/span><\/p>\n<p><span class=\"tlid-translation translation\">En collaboration avec ce groupe de travail et le groupe de travail sur les coupons de test IPC 1-10c, le groupe de travail Artwork and Generation et le sous-comit\u00e9 sur la m\u00e9thodologie de test de contrainte thermique D-32, IPC continue de travailler \u00e0 la r\u00e9vision de ses m\u00e9thodes de test existantes pour le stress thermique (IPC-TM-650 , M\u00e9thode 2.6.27) et choc thermique (IPC-TM-650, m\u00e9thode 2.6.7.2).<\/span><\/p>\n<p><span class=\"tlid-translation translation\">Ces m\u00e9thodologies utilisent des coupons de test de r\u00e9ception bas\u00e9s sur les performances et utilisant des mesures de r\u00e9sistance \u00e9lectrique, tels que le coupon IPC-2221B Annexe \u00abD\u00bb, qui, lorsqu&rsquo;ils ont \u00e9t\u00e9 con\u00e7us correctement en conformit\u00e9 avec l&rsquo;outil G\u00e9n\u00e9rateur de coupons Gerber IPC-2221B, ont permis aux fabricants de d\u00e9tecter les d\u00e9fectuosit\u00e9s microvia latentes et de se mettre \u00e0 l&rsquo;abri d&rsquo;\u00e9ventuels d\u00e9fauts.<\/span><\/p>\n<p>&nbsp;<\/p>\n<p>IPC &#8211; <a href=\"http:\/\/www.IPC.org\">www.IPC.org<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>L&rsquo;augmentation de la densit\u00e9 de microvias et des exigences d&rsquo;int\u00e9grit\u00e9 du signal dans les circuits imprim\u00e9s de l&rsquo;industrie \u00e9lectronique a r\u00e9v\u00e9l\u00e9 des probl\u00e8mes de fiabilit\u00e9 des structures de microvias dans les produits hautes performances.<\/p>\n","protected":false},"author":22,"featured_media":92741,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[883],"tags":[894,911],"domains":[47],"ppma_author":[1149],"class_list":["post-92740","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-technologies","tag-boards-embedded-cards-fr","tag-testandmeasurement-fr","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Les microvias des PCBs ne seraient pas fiables 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