{"id":8239,"date":"2021-07-08T16:01:43","date_gmt":"2021-07-08T16:01:43","guid":{"rendered":"https:\/\/\/camera-numerique-plus-petite-quun-grain-de-riz\/"},"modified":"2021-07-08T16:01:43","modified_gmt":"2021-07-08T16:01:43","slug":"camera-numerique-plus-petite-quun-grain-de-riz","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/camera-numerique-plus-petite-quun-grain-de-riz\/","title":{"rendered":"Cam\u00e9ra num\u00e9rique plus petite qu’un grain de riz"},"content":{"rendered":"

Ce capteur d’image, appel\u00e9 NanEye, est plus petit qu’un grain de riz, plus l\u00e9ger qu’un timbre-poste mais plus puissant que tout autre d\u00e9veloppement du genre a \u00e9t\u00e9 d\u00e9velopp\u00e9 par ams OSRAM. AT&S a d\u00e9velopp\u00e9 la carte de circuit imprim\u00e9 pour le capteur, tandis que le capteur lui-m\u00eame a \u00e9t\u00e9 construit par le fournisseur de capteurs hautes performances, ams OSRAM.<\/p>\n

Avec une taille de 1 mm\u00b2 et un poids d’environ 1 gramme, le capteur d’image est si petit qu’il peut non seulement \u00eatre install\u00e9 dans des smartphones, des cam\u00e9ras VR et d’autres appareils portables, mais peut \u00e9galement \u00eatre int\u00e9gr\u00e9 dans des applications m\u00e9dicales telles que des endoscopes.<\/p>\n

La miniaturisation devient de plus en plus importante en micro\u00e9lectronique. Les applications haut de gamme doivent devenir de plus en plus petites, et en m\u00eame temps, il s’agit d’avoir de plus en plus d’espace disponible pour des composants suppl\u00e9mentaires ou plus puissants et de nouvelles fonctionnalit\u00e9s pour augmenter les performances des diverses applications. Surtout dans le domaine de la technologie m\u00e9dicale, la miniaturisation prend un autre \u00e9l\u00e9ment important : plus les appareils utilis\u00e9s pour le diagnostic ou le traitement sont petits, plus ils sont confortables pour le patient.<\/p>\n

\u00ab Le capteur d’image cr\u00e9e non seulement des images nettes gr\u00e2ce \u00e0 sa r\u00e9solution de 100 000 pixels, mais il a \u00e9galement une faible consommation d’\u00e9nergie gr\u00e2ce \u00e0 notre architecture de connexion intelligente \u00bb, d\u00e9clare Markus Maier, Global Account Manager chez AT&S.<\/p>\n

Le capteur d’appareil photo num\u00e9rique, qui fournit une sortie vid\u00e9o num\u00e9rique, permet toutes sortes de d\u00e9tection visuelle pour les applications mobiles. L’un des premiers produits \u00e0 int\u00e9grer la technologie AT&S est NanEye, l’un des plus petits appareils photo num\u00e9riques du march\u00e9. NanEye a un large \u00e9ventail d’applications, telles que le suivi oculaire dans les lunettes VR, mais peut \u00e9galement \u00eatre utilis\u00e9 dans le domaine m\u00e9dical. La technologie AT&S est int\u00e9gr\u00e9e, par exemple, dans une t\u00eate de cam\u00e9ra utilis\u00e9e pour les examens endoscopiques.<\/p>\n

 <\/p>\n

\n

Pour AT&S, ce produit est tr\u00e8s sp\u00e9cial. Tout d’abord, l’\u00e9quipe de conception mat\u00e9rielle AT&S d’AISS (Advanced Interconnect Solution Services) a cr\u00e9\u00e9 la configuration. Deuxi\u00e8mement, la conception de l’interconnexion a \u00e9t\u00e9 r\u00e9alis\u00e9e \u00e0 l’aide de la technologie ECP (Embedded Component Packaging). L’ECP permet d’int\u00e9grer \u00e0 la fois des composants actifs et passifs dans des substrats \u00e0 base de stratifi\u00e9, c’est-\u00e0-dire des cartes de circuits imprim\u00e9s de haute technologie, dans un minimum d’espace.<\/p>\n

\u00ab\u00a0Au lieu de placer les composants sur le PCB, ils sont int\u00e9gr\u00e9s dans le PCB. Ils ‘disparaissent’ \u00e0 l’int\u00e9rieur du PCB\u00a0\u00bb, explique Maier.<\/p>\n

L’Embedded Component Packaging (ECP\u00ae) est rendu possible par un proc\u00e9d\u00e9 de fabrication sp\u00e9cial. Une fois que les composants respectifs ont \u00e9t\u00e9 int\u00e9gr\u00e9s dans une couche de r\u00e9sine lors d’\u00e9tapes de fabrication sp\u00e9ciales, ils sont reli\u00e9s par des microvias remplis de cuivre et perc\u00e9s au laser. Cela \u00e9limine le besoin de joints de soudure pour le composant int\u00e9gr\u00e9, tout en permettant des conceptions plus fines sur la couche externe et en fournissant aux composants la meilleure protection possible contre les influences ext\u00e9rieures.<\/p>\n

Gr\u00e2ce \u00e0 la technologie innovante \u00ab\u00a0Embedded Component Packaging\u00a0\u00bb (ECP\u00ae), davantage de composants peuvent \u00eatre int\u00e9gr\u00e9s dans le PCB tout en conservant la m\u00eame taille de l’appareil final. D’une part, cela augmente la fonctionnalit\u00e9 et, d’autre part, la carte de circuit imprim\u00e9 peut \u00eatre r\u00e9tr\u00e9cie tout en conservant la m\u00eame gamme de fonctions, ce qui permet \u00e0 son tour des terminaux plus compacts.<\/p>\n

Lire aussi:<\/strong><\/p>\n

Le Leti d\u00e9voile un capteur d’image de reconnaissance faciale<\/strong><\/a><\/p>\n

Cam\u00e9ra ultra-basse consommation : une nouvelle g\u00e9n\u00e9ration de capteurs IoT<\/strong><\/a><\/p>\n

www.ats.net<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"

AT&S Technology permet au plus petit appareil photo num\u00e9rique au monde de r\u00e9aliser toutes sortes de d\u00e9tection visuelle pour les applications mobiles telles que le m\u00e9dical, les smartphones, les cam\u00e9ras VR et d’autres appareils \u00ab\u00a0wearable\u00a0\u00bb. <\/p>\n","protected":false},"author":7,"featured_media":8240,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[883],"tags":[910],"domains":[47],"ppma_author":[1139],"class_list":["post-8239","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-technologies","tag-sensing-conditioning-fr","domains-electronique-eci"],"acf":[],"yoast_head":"Cam\u00e9ra num\u00e9rique plus petite qu'un grain de riz ...<\/title>\n<meta name=\"description\" content=\"AT&S Technology permet au plus petit appareil photo num\u00e9rique au monde de r\u00e9aliser toutes sortes de 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