{"id":8147,"date":"2021-07-15T06:44:52","date_gmt":"2021-07-15T06:44:52","guid":{"rendered":"https:\/\/\/solutions-dinterconnexion-com-hpc-pour-applications-ia-industrielles-et-iot\/"},"modified":"2021-07-15T06:44:52","modified_gmt":"2021-07-15T06:44:52","slug":"solutions-dinterconnexion-com-hpc-pour-applications-ia-industrielles-et-iot","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/solutions-dinterconnexion-com-hpc-pour-applications-ia-industrielles-et-iot\/","title":{"rendered":"Solutions d\u2019interconnexion COM-HPC pour applications IA, industrielles et IoT"},"content":{"rendered":"<p>Disponibles chez Mouser, les solutions d\u2019interconnexion COM-HPC de Samtec sont bas\u00e9es sur des barrettes \u00e0 hautes performances HP AcceleRate de Samtec, offrant aux ing\u00e9nieurs concepteurs \u00e9volutivit\u00e9 et gain de performance pour la conception de syst\u00e8mes int\u00e9gr\u00e9s nouvelle g\u00e9n\u00e9ration et la flexibilit\u00e9 des interfaces. Dot\u00e9s de connecteurs \u00e0 deux paires de 400&nbsp;broches (800&nbsp;broches au total), les syst\u00e8mes COM-HPC offrent 32&nbsp;Gb\/s par canal, 2088&nbsp;Gb\/s par 6,5&nbsp;cm\u00b2 et 4096&nbsp;Gb\/s max., allant jusqu\u2019\u00e0 300&nbsp;W (11,4&nbsp;V \u2013 12,6&nbsp;V), tout en prenant en charge les interfaces existantes et futures telles que PCIe 5.0 (32&nbsp;GT\/s) et Ethernet 100&nbsp;Gbits\/s.<\/p>\n<p>Id\u00e9ales pour les modules de serveur et de client, les applications m\u00e9dicales, datacom, de t\u00e9l\u00e9communications, IoT ou toute autre application \u00e0 haut d\u00e9bit et \u00e0 cycle \u00e9lev\u00e9, les solutions d\u2019interconnexion COM-HPC sont disponibles avec une hauteur d\u2019empilage de 5&nbsp;mm ou 10&nbsp;mm et un pas de 0,635&nbsp;mm.<\/p>\n<p><a href=\"https:\/\/eu.mouser.com\/new\/samtec\/samtec-com-hpc-interconnect-solutions\/\">eu.mouser.com\/new\/samtec\/samtec-com-hpc-interconnect-solutions\/<\/a><\/p>\n<p>&nbsp;<a href=\"https:\/\/www.mouser.fr\/?utm_source=publitek-media-for-pr&amp;utm_medium=pr&amp;utm_campaign=EMEA_PR&amp;utm_content=2021\">www.mouser.fr.<\/a><\/p>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Mouser Electronics propose d\u00e9sormais des solutions d\u2019interconnexion COM-HPC de Samtec. Con\u00e7us en conformit\u00e9 avec la norme COM-HPC r\u00e9cemment introduite par le PCI Industrial Computer Manufacturers Group (PICMG), les produits COM-HPC de Samtec sont des syst\u00e8mes \u00e0 haute densit\u00e9 et aux performances \u00e9lev\u00e9es destin\u00e9s aux technologies \u00e9mergentes telles que l\u2019intelligence artificielle (IA), la vision industrielle, l\u2019edge computing int\u00e9gr\u00e9, la cybers\u00e9curit\u00e9, l\u2019infrastructure 5G  et les v\u00e9hicules connect\u00e9s, l\u2019automatisation industrielle, l\u2019Internet des objets (IoT), et bien plus encore. <\/p>\n","protected":false},"author":9,"featured_media":8148,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[881],"tags":[],"domains":[47],"ppma_author":[1141],"class_list":["post-8147","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-nouveaux-produits","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Solutions d\u2019interconnexion COM-HPC pour applications IA, indu...<\/title>\n<meta name=\"description\" content=\"Mouser Electronics propose d\u00e9sormais des solutions d\u2019interconnexion COM-HPC de Samtec. 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