{"id":78748,"date":"2019-08-18T22:26:13","date_gmt":"2019-08-18T22:26:13","guid":{"rendered":"https:\/\/\/la-memoire-nornand-de-winbond-supporte-le-processeur-layerscape-ls1012a-de-nxp\/"},"modified":"2019-08-18T22:26:13","modified_gmt":"2019-08-18T22:26:13","slug":"la-memoire-nornand-de-winbond-supporte-le-processeur-layerscape-ls1012a-de-nxp","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/la-memoire-nornand-de-winbond-supporte-le-processeur-layerscape-ls1012a-de-nxp\/","title":{"rendered":"La m\u00e9moire NOR+NAND de Winbond supporte le processeur Layerscape LS1012A de NXP"},"content":{"rendered":"<p>La structure \u00e0 empilage de puces des produits SpiStack et la fonctionnalit\u00e9 de Chip Select par logiciel d\u00e9velopp\u00e9es par Winbond permettent d&rsquo;encapsuler une puce Flash NOR s\u00e9rie pour le d\u00e9marrage rapide et une puce NAND s\u00e9rie pour la haute densit\u00e9 dans un bo\u00eetier WSON \u00e0 8 contacts de dimensions 8 mm x 6 mm et brochage standard. \u00ab\u00a0La m\u00e9moire W25M161AW SpiStack constitue le compl\u00e9ment id\u00e9al de notre SoC Layerscape LS1012A,\u00a0\u00bb a d\u00e9clar\u00e9 Jeff Steinheider, Directeur Marketing, NXP Industrial Applications Processors. \u00ab\u00a0Il \u00e9conomise de la place sur la carte pour les designs compacts \u00e0 base de LS1012A, tout en fournissant 1 Gbits pour le stockage d&rsquo;un OS Linux complet.\u00a0\u00bb<\/p>\n<p>La nouvelle technologie&nbsp;High Performance Serial NAND&nbsp;de Winbond supporte \u00e9galement une interface double-QSPI \u00e0 deux composants pour un taux de transfert atteignant 166 Moct\/s. Gr\u00e2ce \u00e0 cette lecture \u00e0 haute vitesse, quelque quatre fois plus rapide que les NAND s\u00e9rie existantes, le composant W25N01JW peut remplacer la m\u00e9moire Flash NOR SPI dans des applications automobiles comme le stockage de donn\u00e9es pour l&rsquo;instrumentation tableau de bord ou pour le CID (Center Information Display).&nbsp;C&rsquo;est une caract\u00e9ristique importante pour les \u00e9quipementiers automobiles car avec l&rsquo;adoption d&rsquo;affichages graphiques plus sophistiqu\u00e9s pour le tableau de bord et de tailles d&rsquo;\u00e9cran de 7 pouces et plus pour le CID les besoins m\u00e9moire atteignent 1 Gbits et plus. A cette capacit\u00e9 la m\u00e9moire Flash NAND s\u00e9rie a un co\u00fbt unitaire nettement plus faible que la Flash NOR SPI, et occupe moins de surface au Mbit.<\/p>\n<p><a href=\"http:\/\/www.winbond.com\/%20\/h\">www.winbond.com<\/a><\/p>\n<p><strong><u>A propos de Winbond<\/u><\/strong><br \/>\nWinbond Electronics Corporation est un fournisseur de solutions m\u00e9moire totales. La soci\u00e9t\u00e9 propose des solutions m\u00e9moire orient\u00e9es clients, s&rsquo;appuyant sur une expertise \u00e9prouv\u00e9e dans le design produit, la R&amp;D, la fabrication et la commercialisation. Le portefeuille produits de Winbond, constitu\u00e9 de DRAM sp\u00e9cialis\u00e9es, de DRAM pour mobiles et de Flash de stockage de code, est largement utilis\u00e9 par les clients majeurs des domaines de la communication, de l&rsquo;\u00e9lectronique grand public, de l&rsquo;automobile et de l&rsquo;industrie, et des p\u00e9riph\u00e9riques informatiques. Winbond a son si\u00e8ge social au Central Taiwan Science Park (CTSP), et poss\u00e8de des filiales aux Etats-Unis, au Japon, en Isra\u00ebl, en Chine et \u00e0 Hong Kong.&nbsp;Avec son usine de Taichung et les nouvelles unit\u00e9s 12 pouces de Kaohsiung \u00e0 Taiwan, Winbond poursuit le d\u00e9veloppement de technologies maison pour produire des composants m\u00e9moires de haute qualit\u00e9.<\/p>\n<p>&nbsp;<\/p>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Winbond Electronics Corporation, fournisseur majeur de solutions m\u00e9moires \u00e0 semiconducteurs, annonce que son composant m\u00e9moire SpiStack \u00e0 double puces NOR+NAND pour stockage de code a \u00e9t\u00e9 s\u00e9lectionn\u00e9 par NXP Semiconductors pour la carte FRWY-LS1012A de mise en \u0153uvre de son processeur de communication Layerscape LS1012A. NXP a choisi la solution SpiStack  W25M161AW de Winbond pour sa nouvelle carte de d\u00e9veloppement FRWY-LS1012A d\u00e9di\u00e9e au processeur LS1012A, qui b\u00e9n\u00e9ficie ainsi de 16 Mbits de Flash NOR s\u00e9rie pour le code de d\u00e9marrage, et de 1Gbits de Flash NAND s\u00e9rie pour son syst\u00e8me d&rsquo;exploitation Linux.<\/p>\n","protected":false},"author":9,"featured_media":78749,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[881],"tags":[],"domains":[47],"ppma_author":[1141],"class_list":["post-78748","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-nouveaux-produits","domains-electronique-eci"],"acf":[],"yoast_head":"<title>La m\u00e9moire NOR+NAND de Winbond supporte le processeur Layersca...<\/title>\n<meta name=\"description\" content=\"Winbond Electronics Corporation, fournisseur majeur de solutions m\u00e9moires \u00e0 semiconducteurs, annonce que son composant m\u00e9moire SpiStack \u00e0 double puces...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/78748\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"La m\u00e9moire NOR+NAND de Winbond supporte le processeur Layerscape LS1012A de NXP\" \/>\n<meta property=\"og:description\" content=\"Winbond Electronics Corporation, fournisseur majeur de solutions m\u00e9moires \u00e0 semiconducteurs, annonce que son composant m\u00e9moire SpiStack \u00e0 double puces NOR+NAND pour stockage de code a \u00e9t\u00e9 s\u00e9lectionn\u00e9 par NXP Semiconductors pour la carte FRWY-LS1012A de mise en \u0153uvre de son processeur de communication Layerscape LS1012A. NXP a choisi la solution SpiStack W25M161AW de Winbond pour sa nouvelle carte de d\u00e9veloppement FRWY-LS1012A d\u00e9di\u00e9e au processeur LS1012A, qui b\u00e9n\u00e9ficie ainsi de 16 Mbits de Flash NOR s\u00e9rie pour le code de d\u00e9marrage, et de 1Gbits de Flash NAND s\u00e9rie pour son syst\u00e8me d&#039;exploitation Linux.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/78748\/\" \/>\n<meta property=\"og:site_name\" content=\"EENewsEurope\" \/>\n<meta property=\"article:published_time\" content=\"2019-08-18T22:26:13+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/cdn.eenewseurope.com\/wp-content\/uploads\/import\/default\/files\/sites\/default\/files\/images\/eci8109_winbond.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"2054\" \/>\n\t<meta property=\"og:image:height\" content=\"2100\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"Alain Dieul\" 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NXP\",\"datePublished\":\"2019-08-18T22:26:13+00:00\",\"dateModified\":\"2019-08-18T22:26:13+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/cdn.eenewseurope.com\/fr\/la-memoire-nornand-de-winbond-supporte-le-processeur-layerscape-ls1012a-de-nxp\/\"},\"wordCount\":451,\"publisher\":{\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#organization\"},\"articleSection\":[\"Nouveaux produits\"],\"inLanguage\":\"fr-FR\"},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/cdn.eenewseurope.com\/fr\/la-memoire-nornand-de-winbond-supporte-le-processeur-layerscape-ls1012a-de-nxp\/\",\"url\":\"https:\/\/cdn.eenewseurope.com\/fr\/la-memoire-nornand-de-winbond-supporte-le-processeur-layerscape-ls1012a-de-nxp\/\",\"name\":\"La m\u00e9moire NOR+NAND de Winbond supporte le processeur Layerscape LS1012A de NXP -\",\"isPartOf\":{\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#website\"},\"datePublished\":\"2019-08-18T22:26:13+00:00\",\"dateModified\":\"2019-08-18T22:26:13+00:00\",\"breadcrumb\":{\"@id\":\"https:\/\/cdn.eenewseurope.com\/fr\/la-memoire-nornand-de-winbond-supporte-le-processeur-layerscape-ls1012a-de-nxp\/#breadcrumb\"},\"inLanguage\":\"fr-FR\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/cdn.eenewseurope.com\/fr\/la-memoire-nornand-de-winbond-supporte-le-processeur-layerscape-ls1012a-de-nxp\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/cdn.eenewseurope.com\/fr\/la-memoire-nornand-de-winbond-supporte-le-processeur-layerscape-ls1012a-de-nxp\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/www.ecinews.fr\/fr\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"La m\u00e9moire NOR+NAND de Winbond supporte le processeur Layerscape LS1012A de NXP\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#website\",\"url\":\"https:\/\/www.eenewseurope.com\/en\/\",\"name\":\"EENewsEurope\",\"description\":\"Just another WordPress site\",\"publisher\":{\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/www.eenewseurope.com\/en\/?s={search_term_string}\"},\"query-input\":\"required name=search_term_string\"}],\"inLanguage\":\"fr-FR\"},{\"@type\":\"Organization\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#organization\",\"name\":\"EENewsEurope\",\"url\":\"https:\/\/www.eenewseurope.com\/en\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"fr-FR\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/logo\/image\/\",\"url\":\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg\",\"contentUrl\":\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg\",\"width\":283,\"height\":113,\"caption\":\"EENewsEurope\"},\"image\":{\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/logo\/image\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/568c789a4794bd460460501ba91f5daf\",\"name\":\"Alain Dieul\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"fr-FR\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/image\/6d32dc651fbcef3b338066625b118364\",\"url\":\"https:\/\/secure.gravatar.com\/avatar\/93708ec89b35deb10f4cfbfe144b4e07?s=96&d=mm&r=g\",\"contentUrl\":\"https:\/\/secure.gravatar.com\/avatar\/93708ec89b35deb10f4cfbfe144b4e07?s=96&d=mm&r=g\",\"caption\":\"Alain Dieul\"}}]}<\/script>","yoast_head_json":{"title":"La m\u00e9moire NOR+NAND de Winbond supporte le processeur Layersca...","description":"Winbond Electronics Corporation, fournisseur majeur de solutions m\u00e9moires \u00e0 semiconducteurs, annonce que son composant m\u00e9moire SpiStack \u00e0 double puces...","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/78748\/","og_locale":"fr_FR","og_type":"article","og_title":"La m\u00e9moire NOR+NAND de Winbond supporte le processeur Layerscape LS1012A de NXP","og_description":"Winbond Electronics Corporation, fournisseur majeur de solutions m\u00e9moires \u00e0 semiconducteurs, annonce que son composant m\u00e9moire SpiStack \u00e0 double puces NOR+NAND pour stockage de code a \u00e9t\u00e9 s\u00e9lectionn\u00e9 par NXP Semiconductors pour la carte FRWY-LS1012A de mise en \u0153uvre de son processeur de communication Layerscape LS1012A. NXP a choisi la solution SpiStack W25M161AW de Winbond pour sa nouvelle carte de d\u00e9veloppement FRWY-LS1012A d\u00e9di\u00e9e au processeur LS1012A, qui b\u00e9n\u00e9ficie ainsi de 16 Mbits de Flash NOR s\u00e9rie pour le code de d\u00e9marrage, et de 1Gbits de Flash NAND s\u00e9rie pour son syst\u00e8me d'exploitation Linux.","og_url":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/78748\/","og_site_name":"EENewsEurope","article_published_time":"2019-08-18T22:26:13+00:00","og_image":[{"width":2054,"height":2100,"url":"https:\/\/cdn.eenewseurope.com\/wp-content\/uploads\/import\/default\/files\/sites\/default\/files\/images\/eci8109_winbond.jpg","type":"image\/jpeg"}],"author":"Alain Dieul","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Alain Dieul","Est. reading time":"2 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/cdn.eenewseurope.com\/fr\/la-memoire-nornand-de-winbond-supporte-le-processeur-layerscape-ls1012a-de-nxp\/#article","isPartOf":{"@id":"https:\/\/cdn.eenewseurope.com\/fr\/la-memoire-nornand-de-winbond-supporte-le-processeur-layerscape-ls1012a-de-nxp\/"},"author":{"name":"Alain Dieul","@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/568c789a4794bd460460501ba91f5daf"},"headline":"La m\u00e9moire NOR+NAND de Winbond supporte le processeur Layerscape LS1012A de NXP","datePublished":"2019-08-18T22:26:13+00:00","dateModified":"2019-08-18T22:26:13+00:00","mainEntityOfPage":{"@id":"https:\/\/cdn.eenewseurope.com\/fr\/la-memoire-nornand-de-winbond-supporte-le-processeur-layerscape-ls1012a-de-nxp\/"},"wordCount":451,"publisher":{"@id":"https:\/\/www.eenewseurope.com\/en\/#organization"},"articleSection":["Nouveaux produits"],"inLanguage":"fr-FR"},{"@type":"WebPage","@id":"https:\/\/cdn.eenewseurope.com\/fr\/la-memoire-nornand-de-winbond-supporte-le-processeur-layerscape-ls1012a-de-nxp\/","url":"https:\/\/cdn.eenewseurope.com\/fr\/la-memoire-nornand-de-winbond-supporte-le-processeur-layerscape-ls1012a-de-nxp\/","name":"La m\u00e9moire NOR+NAND de Winbond supporte le processeur Layerscape LS1012A de NXP -","isPartOf":{"@id":"https:\/\/www.eenewseurope.com\/en\/#website"},"datePublished":"2019-08-18T22:26:13+00:00","dateModified":"2019-08-18T22:26:13+00:00","breadcrumb":{"@id":"https:\/\/cdn.eenewseurope.com\/fr\/la-memoire-nornand-de-winbond-supporte-le-processeur-layerscape-ls1012a-de-nxp\/#breadcrumb"},"inLanguage":"fr-FR","potentialAction":[{"@type":"ReadAction","target":["https:\/\/cdn.eenewseurope.com\/fr\/la-memoire-nornand-de-winbond-supporte-le-processeur-layerscape-ls1012a-de-nxp\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/cdn.eenewseurope.com\/fr\/la-memoire-nornand-de-winbond-supporte-le-processeur-layerscape-ls1012a-de-nxp\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.ecinews.fr\/fr\/"},{"@type":"ListItem","position":2,"name":"La m\u00e9moire NOR+NAND de Winbond supporte le processeur Layerscape LS1012A de NXP"}]},{"@type":"WebSite","@id":"https:\/\/www.eenewseurope.com\/en\/#website","url":"https:\/\/www.eenewseurope.com\/en\/","name":"EENewsEurope","description":"Just another WordPress site","publisher":{"@id":"https:\/\/www.eenewseurope.com\/en\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.eenewseurope.com\/en\/?s={search_term_string}"},"query-input":"required name=search_term_string"}],"inLanguage":"fr-FR"},{"@type":"Organization","@id":"https:\/\/www.eenewseurope.com\/en\/#organization","name":"EENewsEurope","url":"https:\/\/www.eenewseurope.com\/en\/","logo":{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/logo\/image\/","url":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg","contentUrl":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg","width":283,"height":113,"caption":"EENewsEurope"},"image":{"@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/568c789a4794bd460460501ba91f5daf","name":"Alain Dieul","image":{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/image\/6d32dc651fbcef3b338066625b118364","url":"https:\/\/secure.gravatar.com\/avatar\/93708ec89b35deb10f4cfbfe144b4e07?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/93708ec89b35deb10f4cfbfe144b4e07?s=96&d=mm&r=g","caption":"Alain Dieul"}}]}},"authors":[{"term_id":1141,"user_id":9,"is_guest":0,"slug":"alaindieul","display_name":"Alain Dieul","avatar_url":"https:\/\/secure.gravatar.com\/avatar\/93708ec89b35deb10f4cfbfe144b4e07?s=96&d=mm&r=g","0":null,"1":"","2":"","3":"","4":"","5":"","6":"","7":"","8":""}],"_links":{"self":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/78748"}],"collection":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/users\/9"}],"replies":[{"embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/comments?post=78748"}],"version-history":[{"count":0,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/78748\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/media\/78749"}],"wp:attachment":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/media?parent=78748"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/categories?post=78748"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/tags?post=78748"},{"taxonomy":"domains","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/domains?post=78748"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/ppma_author?post=78748"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}