{"id":60491,"date":"2020-03-24T08:15:44","date_gmt":"2020-03-24T08:15:44","guid":{"rendered":"https:\/\/\/microchip-etend-sa-famille-sic-de-composants-de-puissance\/"},"modified":"2020-03-24T08:15:44","modified_gmt":"2020-03-24T08:15:44","slug":"microchip-etend-sa-famille-sic-de-composants-de-puissance","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/microchip-etend-sa-famille-sic-de-composants-de-puissance\/","title":{"rendered":"Microchip \u00e9tend sa famille SiC de composants de puissance"},"content":{"rendered":"<p>Microchip Technology Inc.annonce son portefeuille \u00e9tendu de&nbsp;<a href=\"https:\/\/www.microchip.com\/design-centers\/power-management\/silicon-carbide-sic-devices-and-power-modules\">modules d\u2019alimentation SiC<\/a>&nbsp;plus compacts, plus l\u00e9gers et plus efficaces.Parall\u00e8lement \u00e0 son vaste portefeuille de micro-contr\u00f4leurs et de produits analogiques, Microchip r\u00e9pond aux besoins en syst\u00e8mes de commande haute puissance, entra\u00eenements et \u00e9tages de puissance, offrant aux clients des solutions pour l\u2019ensemble de leurs syst\u00e8mes.<\/p>\n<p>La famille SiC de Microchip comprend des modules d\u2019alimentation bas\u00e9s sur une diode Schottky (SDB,&nbsp;Schottky Barrier Diode), d\u00e9clin\u00e9s en 700, 1200 et 1700&nbsp;V. Cette nouvelle famille de modules d\u2019alimentation comprend plusieurs topologies, y compris&nbsp;double diode, en pont complet, \u00e0 branche de phase, \u00e0 cathode commune double et en ponts triphas\u00e9s,&nbsp;en plus d\u2019offrir plusieurs options de courant et de bo\u00eetier. L\u2019ajout des modules SiC \u00e0 diode Schottky simplifie les syst\u00e8mes en int\u00e9grant plusieurs puces \u00e0 diode SiC avec la possibilit\u00e9 de m\u00e9langer et associer les mat\u00e9riaux utilis\u00e9s pour le substrat et la plaque support dans un seul et m\u00eame module, ce qui maximise l\u2019efficacit\u00e9 de la commutation, att\u00e9nue l\u2019\u00e9l\u00e9vation de la temp\u00e9rature&nbsp;et permet une empreinte syst\u00e8me plus r\u00e9duite.<\/p>\n<p>\u00ab&nbsp;L\u2019adoption et l\u2019essor de la technologie SiC est un vecteur essentiel de l\u2019innovation syst\u00e8me actuelle&nbsp;; Microchip est pionnier dans ce domaine, collaborant avec ses clients issus de tous les segments de march\u00e9 et de toutes les r\u00e9gions du globe&nbsp;\u00bb, explique Leon Gross, vice-pr\u00e9sident de la branche d\u00e9di\u00e9e aux composants discrets de Microchip. \u00ab&nbsp;Notre but est toujours d\u2019offrir des solutions fiables et innovantes. Depuis la d\u00e9finition du produit jusqu\u2019\u00e0 sa mise sur le march\u00e9, notre technologie SiC offre une fiabilit\u00e9 et une robustesse sup\u00e9rieures, permettant aux d\u00e9veloppeurs de syst\u00e8mes d\u2019alimentation de garantir une longue dur\u00e9e de vie \u00e0 l\u2019application, sans aucune alt\u00e9ration des performances dans le temps.&nbsp;\u00bb<\/p>\n<p>Le portefeuille flexible de modules SiC SBD 700, 1200 et 1700&nbsp;V utilise la derni\u00e8re g\u00e9n\u00e9ration de puces SiC de Microchip, qui maximise la fiabilit\u00e9 et la robustesse des syst\u00e8mes et permet une dur\u00e9e de vie longue et stable aux applications. Les excellentes performances des composants permettent aux d\u00e9veloppeurs de syst\u00e8mes de r\u00e9duire les besoins en circuits d\u2019amortissement, et la stabilit\u00e9 de la diode du substrat permet aux syst\u00e8mes d\u2019utiliser la diode interne du substrat sans aucune d\u00e9gradation sur le long terme.&nbsp;<\/p>\n<p>Gr\u00e2ce aux tests effectu\u00e9s en interne par Microchip ou par des tierces parties, des indicateurs de fiabilit\u00e9 critique ont d\u00e9montr\u00e9 que les composants de Microchip ont des performances sup\u00e9rieures par rapport aux composants SiC des autres fabricants. &nbsp;<\/p>\n<p><strong>Outils de d\u00e9veloppement<\/strong><\/p>\n<p><u><a href=\"https:\/\/www.microchip.com\/design-centers\/power-management\/silicon-carbide-sic-devices-and-power-modules\/reference-designs\/vienna-power-corrections-reference-design\">Le&nbsp;design de r\u00e9f\u00e9rence&nbsp;de correction&nbsp;de&nbsp;facteur de puissance&nbsp;(PFC)&nbsp;dit de Vienne triphas\u00e9s&nbsp;\u00e0&nbsp;30&nbsp;kW<\/a><\/u>,&nbsp;ainsi que les&nbsp;modules discrets SiC et&nbsp;les&nbsp;modules SP3\/SP6LI constituent des outils de d\u00e9veloppement aidant&nbsp;les ing\u00e9nieurs&nbsp;\u00e0 r\u00e9duire la dur\u00e9e des cycles de d\u00e9veloppement. &nbsp;<\/p>\n<p><a href=\"http:\/\/www.microchip.com\/\">www.microchip.com<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>La demande en composants SiC (carbure de silicium) continue \u00e0 cro\u00eetre rapidement, car ils maximisent l\u2019efficacit\u00e9 et r\u00e9duisent les dimensions et le poids des syst\u00e8mes qu\u2019ils int\u00e8grent et permettent aux ing\u00e9nieurs de cr\u00e9er des solutions d\u2019alimentation innovantes. Les applications b\u00e9n\u00e9ficiant de la technologie SiC vont des v\u00e9hicules \u00e9lectriques et leurs points de chargement, aux r\u00e9seaux de distribution d\u2019\u00e9lectricit\u00e9 intelligents, jusqu\u2019aux syst\u00e8mes d\u2019alimentation destin\u00e9s \u00e0 l\u2019industrie et \u00e0 l\u2019a\u00e9ronautique.<\/p>\n","protected":false},"author":9,"featured_media":60492,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[881],"tags":[],"domains":[47],"ppma_author":[1141],"class_list":["post-60491","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-nouveaux-produits","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Microchip \u00e9tend sa famille SiC de composants de puissance ...<\/title>\n<meta name=\"description\" content=\"La demande en composants SiC (carbure de silicium) continue \u00e0 cro\u00eetre rapidement, car ils maximisent l\u2019efficacit\u00e9 et r\u00e9duisent les dimensions et le...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/60491\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Microchip \u00e9tend sa famille SiC de composants de puissance\" \/>\n<meta property=\"og:description\" content=\"La demande en composants SiC (carbure de silicium) continue \u00e0 cro\u00eetre rapidement, car ils maximisent l\u2019efficacit\u00e9 et r\u00e9duisent les dimensions et le poids des syst\u00e8mes qu\u2019ils int\u00e8grent et permettent aux ing\u00e9nieurs de cr\u00e9er des solutions d\u2019alimentation innovantes. Les applications b\u00e9n\u00e9ficiant de la technologie SiC vont des v\u00e9hicules \u00e9lectriques et leurs points de chargement, aux r\u00e9seaux de distribution d\u2019\u00e9lectricit\u00e9 intelligents, jusqu\u2019aux syst\u00e8mes d\u2019alimentation destin\u00e9s \u00e0 l\u2019industrie et \u00e0 l\u2019a\u00e9ronautique.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/60491\/\" \/>\n<meta property=\"og:site_name\" content=\"EENewsEurope\" \/>\n<meta property=\"article:published_time\" content=\"2020-03-24T08:15:44+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/import\/default\/files\/sites\/default\/files\/images\/eci8525_microchip-1024x731.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"1024\" \/>\n\t<meta property=\"og:image:height\" content=\"731\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"Alain Dieul\" 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