{"id":5721,"date":"2021-08-19T14:50:51","date_gmt":"2021-08-19T14:50:51","guid":{"rendered":"https:\/\/\/electronique-imprimee-par-rotative-sur-supports-flexibles\/"},"modified":"2021-08-19T14:50:51","modified_gmt":"2021-08-19T14:50:51","slug":"electronique-imprimee-par-rotative-sur-supports-flexibles","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/electronique-imprimee-par-rotative-sur-supports-flexibles\/","title":{"rendered":"Electronique imprim\u00e9e par rotative sur supports flexibles"},"content":{"rendered":"<p>Des chercheurs de Glasgow ont mis au point une m\u00e9thode de fabrication de circuits qui imprime des transistors en nanoruban de silicium haute performance sur des mat\u00e9riaux flexibles.<\/p>\n<p>Des ing\u00e9nieurs du groupe Bendable Electronics and Sensing Technologies (BEST) de l&rsquo;Universit\u00e9 de Glasgow expliquent comment ils ont rationalis\u00e9 et am\u00e9lior\u00e9 le processus d&rsquo;impression par transfert conventionnel en trois \u00e9tapes pour cr\u00e9er des composants \u00e9lectroniques flexibles de grande surface. Au lieu de transf\u00e9rer des transistors FET nanoruban sur un tampon polym\u00e8re souple avant qu&rsquo;il ne soit transf\u00e9r\u00e9 sur le substrat final, le transfert direct par rouleau imprime le silicium directement sur une surface flexible.<\/p>\n<p>Le processus commence par la fabrication de composants nanoruban (NR) de silicium mince de moins de 100 nanom\u00e8tres sur une plaquette de silicium. Un substrat en polyimide est recouvert d&rsquo;une couche de produits chimiques pour am\u00e9liorer l&rsquo;adh\u00e9rence et enroul\u00e9 autour d&rsquo;un tube m\u00e9tallique, et une machine contr\u00f4l\u00e9e par ordinateur d\u00e9velopp\u00e9e par l&rsquo;\u00e9quipe fait ensuite rouler le tube sur la plaquette de silicium, la transf\u00e9rant ainsi sur le substrat flexible en polyimide.<\/p>\n<ul>\n<li>\n<p><a href=\"https:\/\/www.ecinews.fr\/news\/arm-produit-des-chips-plastique-neural-networks\">ARM produit des chips plastique Neural Networks<\/a><\/p>\n<\/li>\n<li><a href=\"https:\/\/www.eenewseurope.com\/news\/arm-shows-first-plastic-m0-microcontroller\">ARM shows first plastic M0+ microcontroller<\/a><\/li>\n<li><a href=\"https:\/\/www.eenewseurope.com\/news\/flexible-colour-display-uses-plastic-transistors\">Flexible colour display uses plastic transistors<\/a><\/li>\n<li><a href=\"https:\/\/www.eenewseurope.com\/news\/see-through-flexible-e-skin-powered-underlying-photovoltaics\">See-through flexible e-skin<\/a><\/li>\n<\/ul>\n<p>L&rsquo;\u00e9quipe a r\u00e9ussi \u00e0 cr\u00e9er des impressions hautement uniformes sur une surface d&rsquo;environ 10 centim\u00e8tres carr\u00e9s, avec un rendement de transfert d&rsquo;environ 95 %. C&rsquo;est nettement plus \u00e9lev\u00e9 que la plupart des proc\u00e9d\u00e9s d&rsquo;impression par transfert conventionnels \u00e0 l&rsquo;\u00e9chelle nanom\u00e9trique.<\/p>\n<p>Les transistors NR imprim\u00e9s \u00e0 l&rsquo;aide du transfert direct par rouleau pr\u00e9sentent syst\u00e9matiquement des performances \u00e9lev\u00e9es avec un courant \u00e0 l&rsquo;\u00e9tat passant (Ion) au dessus de 1 mA, une mobilit\u00e9 \u00e9lev\u00e9e (\u03bceff) sur 600 cm\u00b2 \/Vs et un rapport marche\/arr\u00eat \u00e9lev\u00e9 (Ion\/off) d&rsquo;environ 10 6 avec une faible hyst\u00e9r\u00e9sis de 0,4V.<\/p>\n<p>\u00ab Bien que nous ayons utilis\u00e9 un \u00e9chantillon de plaquette de silicium carr\u00e9 de 3 cm de chaque c\u00f4t\u00e9 dans le process dont nous parlons dans cet article, la taille du substrat donneur flexible est la seule limite \u00e0 la taille des plaquettes de silicium que nous pouvons imprimer. Il est tr\u00e8s probable que nous puissions \u00e9tendre le process et cr\u00e9er une \u00e9lectronique flexible haute performance tr\u00e8s complexe, ce qui ouvre la porte \u00e0 de nombreuses applications potentielles \u00bb, a d\u00e9clar\u00e9 le professeur Ravinder Dahiya, chef du groupe BEST \u00e0 la James Watt School of Engineering de l&rsquo;Universit\u00e9 de Glasgow. .<\/p>\n<p>\u00ab Les performances des transistors que nous avons imprim\u00e9s sur des surfaces flexibles en laboratoire sont similaires aux performances de composants CMOS comparables \u2013 les puces standart qui contr\u00f4lent de nombreux appareils \u00e9lectroniques de tous les jours \u00bb, a-t-il d\u00e9clar\u00e9.&nbsp;<\/p>\n<p>\u00ab Cela signifie que ce type d&rsquo;\u00e9lectronique flexible pourrait \u00eatre suffisamment sophistiqu\u00e9 pour int\u00e9grer des contr\u00f4leurs flexibles dans des matrices de LED, par exemple, permettant potentiellement la cr\u00e9ation d&rsquo;affichages num\u00e9riques autonomes qui pourraient \u00eatre enroul\u00e9s lorsqu&rsquo;ils ne sont pas utilis\u00e9s. Des couches de mat\u00e9riau flexible tendues sur des membres proth\u00e9tiques pourraient offrir aux amput\u00e9s un meilleur contr\u00f4le sur leurs proth\u00e8ses, ou m\u00eame int\u00e9grer des capteurs pour donner aux utilisateurs une sensation de \u00ab&nbsp;toucher&nbsp;\u00bb.<\/p>\n<p>\u00ab&nbsp;C&rsquo;est un processus plus simple capable de produire une \u00e9lectronique flexible haute performance avec des r\u00e9sultats aussi bons, sinon meilleurs, que l&rsquo;\u00e9lectronique conventionnelle \u00e0 base de silicium. C&rsquo;est aussi potentiellement moins cher et plus \u00e9conome en ressources, car il utilise moins de mati\u00e8re, et meilleur pour l&rsquo;environnement, car il produit moins de d\u00e9chets sous forme de transferts inutilisables.<\/p>\n<p>L&rsquo;article de l&rsquo;\u00e9quipe, intitul\u00e9 \u00ab&nbsp;Direct Roll Transfer Printed Silicon Nanoribbon Arrays based High-Performance Flexible Electronics&nbsp;\u00bb, est publi\u00e9 dans NPJ Flexible Electronics.<\/p>\n<p><strong>Lire aussi:<\/strong><\/p>\n<p><a href=\"https:\/\/www.ecinews.fr\/news\/une-nouvelle-technique-dimpression-directe-proposee-par-binder\"><strong>Une nouvelle technique d&rsquo;impression directe propos\u00e9e par Binder<\/strong><\/a><\/p>\n<p><a href=\"https:\/\/www.ecinews.fr\/news\/heidelberger-lance-la-production-delectronique-organique-imprimee\"><strong>Heidelberger lance la production d&rsquo;\u00e9lectronique organique imprim\u00e9e<\/strong><\/a><\/p>\n<p>&nbsp;<\/p>\n<p><a href=\"http:\/\/www.glasgow.ac.uk\">www.glasgow.ac.uk<\/a><\/p>\n<p><strong>Other roll to roll articles <\/strong><\/p>\n<ul>\n<li><a href=\"https:\/\/www.eenewseurope.com\/news\/record-roll-roll-printed-perovskite-solar-cells\">Record for roll-to-roll printed perovskite solar cells<\/a><\/li>\n<li><a href=\"https:\/\/www.eenewseurope.com\/news\/taking-plastic-chips-healthcare\">Taking plastic chips into healthcare<\/a><\/li>\n<li><a href=\"https:\/\/www.eenewseurope.com\/news\/patent-filing-marks-start-roll-roll-flexible-solid-state-battery-roll-out\">Patent filing marks start of roll to roll flexible solid state battery<\/a><\/li>\n<li><a href=\"https:\/\/www.eenewseurope.com\/news\/first-roll-roll-graphene-process\">First roll-to-roll graphene process<\/a><\/li>\n<li><a href=\"https:\/\/www.eenewseurope.com\/news\/flexible-bicmos-substrate-simplified-process-roll-roll-production-0\">Flexible BiCMOS substrate with simplified roll-to-roll process<\/a><\/li>\n<\/ul>\n<p>&nbsp;<\/p>\n<hr \/>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Le proc\u00e9d\u00e9 Roll-to-wafer d\u00e9velopp\u00e9 par l&rsquo;Universit\u00e9 de Glasgow acc\u00e9l\u00e8re la production d&rsquo;\u00e9lectronique flexible <\/p>\n","protected":false},"author":7,"featured_media":5722,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[883],"tags":[902,913],"domains":[47],"ppma_author":[1139],"class_list":["post-5721","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-technologies","tag-flexibleelectronics-fr","tag-materials-processes-fr","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Electronique imprim\u00e9e par rotative sur supports flexibles ...<\/title>\n<meta name=\"description\" content=\"Le proc\u00e9d\u00e9 Roll-to-wafer d\u00e9velopp\u00e9 par l&#039;Universit\u00e9 de 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