{"id":491892,"date":"2026-03-05T10:00:41","date_gmt":"2026-03-05T09:00:41","guid":{"rendered":"https:\/\/www.ecinews.fr\/?p=491892"},"modified":"2026-03-04T19:03:56","modified_gmt":"2026-03-04T18:03:56","slug":"keysight-lance-3d-interconnect-designer-pour-automatiser-la-conception-des-boitiers-avances-chiplets-et-3dic","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/keysight-lance-3d-interconnect-designer-pour-automatiser-la-conception-des-boitiers-avances-chiplets-et-3dic\/","title":{"rendered":"Keysight lance 3D Interconnect Designer pour automatiser la conception des bo\u00eetiers avanc\u00e9s chiplets et 3DIC"},"content":{"rendered":"<h3>Une solution EDA d\u00e9di\u00e9e aux architectures multi\u2011puces et 3DIC<\/h3>\n<h3>Keysight Technologies d\u00e9voile 3D Interconnect Designer, une nouvelle solution EDA con\u00e7ue pour r\u00e9soudre les d\u00e9fis croissants de la conception d\u2019interconnexions 3D dans les bo\u00eetiers avanc\u00e9s multi\u2011puces (chiplets) et syst\u00e8mes 3DIC.<\/h3>\n<p>Ces technologies sont essentielles pour soutenir les infrastructures d\u2019IA, les acc\u00e9l\u00e9rateurs avanc\u00e9s et les datacenters haute performance.<\/p>\n<p>Les architectures 3DIC et multi\u2011puces empil\u00e9es g\u00e9n\u00e8rent une complexit\u00e9 que les flux de conception traditionnels ne peuvent plus g\u00e9rer efficacement :<br \/>\nvias, billes de soudure, imp\u00e9dances critiques, int\u00e9grit\u00e9 de l\u2019alimentation (PI) et du signal (SI)\u2026<br \/>\nLes \u00e9quipes d\u2019ing\u00e9nierie passent un temps consid\u00e9rable en ajustements manuels r\u00e9p\u00e9titifs.<\/p>\n<h3>3D Interconnect Designer : automatisation compl\u00e8te du workflow 3D<\/h3>\n<h4>Mod\u00e9lisation avanc\u00e9e et optimisation intelligente<\/h4>\n<p>La solution automatise la conception, la mod\u00e9lisation et l\u2019optimisation des interconnexions 3D.<br \/>\nElle prend en charge notamment :<\/p>\n<ul>\n<li>plans de masse gaufr\u00e9s ou hachur\u00e9s,<\/li>\n<li>structures conformes aux proc\u00e9d\u00e9s de fabrication silicium avanc\u00e9s,<\/li>\n<li>optimisations topologiques pour bo\u00eetiers haute densit\u00e9.<\/li>\n<\/ul>\n<p>Cette automatisation r\u00e9duit radicalement le besoin d\u2019it\u00e9rations manuelles fastidieuses et acc\u00e9l\u00e8re la validation des chiplets.<\/p>\n<h4>Avantages cl\u00e9s<\/h4>\n<ol>\n<li>Acc\u00e9l\u00e9ration des cycles de conception<\/li>\n<\/ol>\n<ul>\n<li>Suppression des \u00e9tapes manuelles sujettes \u00e0 erreur.<\/li>\n<li>Simplification du routage interposer\u2013chiplet\u2013stack.<\/li>\n<li>Am\u00e9lioration significative du first\u2011time\u2011right.<\/li>\n<\/ul>\n<ol start=\"2\">\n<li>R\u00e9duction des risques de non\u2011conformit\u00e9<\/li>\n<\/ol>\n<p>La solution valide automatiquement les conceptions selon les standards \u00e9mergents :<\/p>\n<ul>\n<li>UCIe,<\/li>\n<li>BoW,<\/li>\n<li>VTF (Voltage Transfer Function).<\/li>\n<\/ul>\n<p>\u2192 Moins de risques de d\u00e9couvertes tardives et co\u00fbteuses.<\/p>\n<h4>Int\u00e9gration dans l\u2019\u00e9cosyst\u00e8me Keysight EDA<\/h4>\n<p>3D Interconnect Designer s\u2019int\u00e8gre :<\/p>\n<ul>\n<li>aux environnements Keysight existants,<\/li>\n<li>mais peut aussi fonctionner de mani\u00e8re autonome.<\/li>\n<\/ul>\n<p>Associ\u00e9 \u00e0 Chiplet PHY Designer, il permet :<\/p>\n<ul>\n<li>la conception compl\u00e8te d\u2019interconnexions pour chiplets,<\/li>\n<li>la mod\u00e9lisation de PHY multi\u2011puces de haute pr\u00e9cision,<\/li>\n<li>la r\u00e9duction des it\u00e9rations co\u00fbteuses dans les architectures 3DIC.<\/li>\n<\/ul>\n<p><strong>Nilesh Kamdar, General Manager EDA Design &amp; Verification chez Keysight<\/strong> : \u00ab La complexit\u00e9 actuelle rend la conception manuelle des interconnexions 3D impraticable. En offrant une automatisation avanc\u00e9e et des analyses pr\u00e9coces, nous aidons les ing\u00e9nieurs \u00e0 concevoir plus vite et \u00e0 livrer des architectures conformes d\u00e8s les premi\u00e8res \u00e9tapes. \u00bb<\/p>\n<p><em>La transition vers les chiplets, l\u2019empilement 3DIC et les architectures multi\u2011puces exige des outils modernes capables d&rsquo;automatiser les d\u00e9cisions complexes.<\/em><br \/>\n<em>3D Interconnect Designer r\u00e9duit le temps de mise sur le march\u00e9, fiabilise les conceptions et donne aux ing\u00e9nieurs un environnement pr\u00eat \u00e0 supporter la prochaine vague d\u2019architectures IA et HPC.<\/em><\/p>\n<p>Vid\u00e9o de pr\u00e9sentation : <a href=\"https:\/\/www.keysight.com\/content\/dam\/keysight\/en\/vid\/ungate\/product-tours\/Introduction-to-Chiplet-3D-Interconnect-Designer.mp4\">Chiplet 3D Interconnect Designer<\/a><\/p>\n<p><a href=\"https:\/\/www.keysight.com\/\">Keysight Technologies<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Une solution EDA d\u00e9di\u00e9e aux architectures multi\u2011puces et 3DIC Keysight Technologies d\u00e9voile 3D Interconnect Designer, une nouvelle solution EDA con\u00e7ue pour r\u00e9soudre les d\u00e9fis croissants de la conception d\u2019interconnexions 3D dans les bo\u00eetiers avanc\u00e9s multi\u2011puces (chiplets) et syst\u00e8mes 3DIC. Ces technologies sont essentielles pour soutenir les infrastructures d\u2019IA, les acc\u00e9l\u00e9rateurs avanc\u00e9s et les datacenters haute [&hellip;]<\/p>\n","protected":false},"author":39,"featured_media":491899,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[881],"tags":[3119,3301,5775,11036,11037,11035],"domains":[47],"ppma_author":[6113],"class_list":["post-491892","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-nouveaux-produits","tag-automatisation","tag-chiplets-fr","tag-conception-fr-2","tag-conception-multi-puces","tag-interconnexions-3d","tag-routage-3d-automatique","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Keysight lance 3D Interconnect Designer pour automatiser la con...<\/title>\n<meta name=\"description\" content=\"Keysight Technologies d\u00e9voile 3D Interconnect Designer, une nouvelle solution 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