HPLF5060<\/a>, mesurant 4,9 mm \u00d7 6,0 mm, dans le cadre de son portefeuille basse tension. Ces composants 40V et 60V ciblent des applications telles que les circuits principaux de commande d\u2019onduleur, les pompes \u00e9lectriques et les phares LED.<\/p>\nAlors que les bo\u00eetiers de taille 5060 et inf\u00e9rieure deviennent plus courants dans les conceptions automobiles, l\u2019espacement plus r\u00e9duit des bornes et les formats sans broches peuvent compliquer le montage et l\u2019inspection. ROHM positionne le HPLF5060 comme une alternative au bo\u00eetier largement utilis\u00e9 TO-252, qui mesure 6,6 mm \u00d7 10,0 mm. En adoptant des broches gull-wing, ce bo\u00eetier vise \u00e0 am\u00e9liorer la visibilit\u00e9 des joints de soudure et la fiabilit\u00e9 du montage sur carte tout en r\u00e9duisant l\u2019encombrement.<\/p>\n
Les dispositifs utilisent \u00e9galement une technologie de connexion par clip en cuivre (copper clip junction) afin de supporter des courants \u00e9lev\u00e9s dans des formats compacts. En pratique, cela peut aider les concepteurs \u00e0 \u00e9quilibrer la capacit\u00e9 en courant et les performances thermiques face aux contraintes de surface de PCB dans les sous-syst\u00e8mes 12V et 48V.<\/p>\n
La production en s\u00e9rie de produits utilisant le bo\u00eetier HPLF5060 a d\u00e9but\u00e9 en novembre 2025, avec une distribution via des canaux incluant DigiKey et Farnell.<\/p>\n
Feuille de route \u00e9largie des bo\u00eetiers pour MOSFET automobiles<\/h2>\n
Au-del\u00e0 du HPLF5060, ROHM pr\u00e9pare d\u2019autres options de bo\u00eetiers pour sa gamme de MOSFET automobiles. La production en s\u00e9rie d\u2019un bo\u00eetier plus compact DFN3333, mesurant 3,3 mm \u00d7 3,3 mm et int\u00e9grant la technologie wettable flank, devrait commencer vers f\u00e9vrier 2026. Les flancs mouillables (wettable flanks) facilitent l\u2019inspection optique automatis\u00e9e, qui demeure une exigence cl\u00e9 sur les lignes d\u2019assemblage automobiles.<\/p>\n
\u00c0 l\u2019extr\u00e9mit\u00e9 haute puissance, le d\u00e9veloppement a commenc\u00e9 pour un bo\u00eetier TOLG (TO-Leaded with Gull-wing) de 9,9 mm \u00d7 11,7 mm. Cela indique un effort parall\u00e8le pour r\u00e9pondre aux applications o\u00f9 un courant plus \u00e9lev\u00e9 et une robustesse m\u00e9canique accrue priment sur la miniaturisation.<\/p>\n
Ces ajouts s\u2019inscrivent dans la marque EcoMOS de MOSFET de puissance au silicium de ROHM, qui couvre des dispositifs pour les syst\u00e8mes automobiles<\/a>, industriels et d\u2019\u00e9lectrom\u00e9nager. \u00c0 mesure que les architectures des v\u00e9hicules \u00e9voluent, la strat\u00e9gie de bo\u00eetier devrait rester un facteur diff\u00e9renciant, en particulier lorsque fiabilit\u00e9, inspectabilit\u00e9 et comportement thermique se rejoignent.<\/p>\n","protected":false},"excerpt":{"rendered":"ROHM a \u00e9largi son portefeuille de MOSFET automobiles avec des dispositifs de puissance 40V et 60V destin\u00e9s aux syst\u00e8mes embarqu\u00e9s, dans un bo\u00eetier CMS compact visant \u00e0 am\u00e9liorer la robustesse au niveau de la carte. Cette \u00e9volution refl\u00e8te la pression continue exerc\u00e9e sur les concepteurs pour r\u00e9duire la taille des \u00e9tages de puissance sans compromettre […]<\/p>\n","protected":false},"author":2,"featured_media":491410,"comment_status":"closed","ping_status":"closed","sticky":true,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[881],"tags":[891,2468,10992,5072],"domains":[47],"ppma_author":[4635],"class_list":["post-491450","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-nouveaux-produits","tag-automotive-fr","tag-mosfet-fr","tag-power-fr","tag-rohm","domains-electronique-eci"],"acf":[],"yoast_head":"
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