{"id":487196,"date":"2025-10-23T15:06:08","date_gmt":"2025-10-23T13:06:08","guid":{"rendered":"https:\/\/www.ecinews.fr\/?p=487196"},"modified":"2025-10-23T15:42:35","modified_gmt":"2025-10-23T13:42:35","slug":"umc-lance-so-plate-forme-bcd-55-nm-low-energy","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/umc-lance-so-plate-forme-bcd-55-nm-low-energy\/","title":{"rendered":"UMC lance sa plate-forme BCD 55 nm low energy"},"content":{"rendered":"<p data-start=\"66\" data-end=\"474\">United Microelectronics Corporation (UMC) a <a href=\"https:\/\/www.umc.com\/en\/News\/press_release\/Content\/technology_related\/20251022\">pr\u00e9sent\u00e9<\/a> une nouvelle plate-forme BCD 55 nm &#8211; \u00e9galement connue sous le nom de technologie BCD 55 nm &#8211; con\u00e7ue pour offrir des performances et une efficacit\u00e9 <a href=\"https:\/\/www.eenewseurope.com\/en\/tags\/power\/\">\u00e9nerg\u00e9tique<\/a> accrues pour les composants pour mobiles, grand public, automobiles et industriels de la prochaine g\u00e9n\u00e9ration. Le dernier n\u0153ud de processus de la fonderie aide les concepteurs \u00e0 g\u00e9rer la complexit\u00e9 croissante de la gestion de l&rsquo;\u00e9nergie tout en r\u00e9duisant la surface de la puce et en am\u00e9liorant les performances en mati\u00e8re de bruit.<\/p>\n<p data-start=\"476\" data-end=\"715\">Ce lancement souligne la volont\u00e9 d&rsquo;UMC de se lancer dans les technologies sp\u00e9cialis\u00e9es avanc\u00e9es qui pourraient avoir un impact direct sur la conception des <a href=\"https:\/\/www.eenewseurope.com\/en\/?s=IC\">circuits int\u00e9gr\u00e9s de<\/a> puissance, l&rsquo;int\u00e9gration des signaux mixtes et l&rsquo;efficacit\u00e9 des syst\u00e8mes sur un large \u00e9ventail de march\u00e9s \u00e9lectroniques.<\/p>\n<h2 data-start=\"717\" data-end=\"761\">\u00c9largir la bo\u00eete \u00e0 outils de gestion de l&rsquo;\u00e9nergie<\/h2>\n<p data-start=\"763\" data-end=\"1039\">La technologie BCD permet aux circuits analogiques, num\u00e9riques et de puissance de coexister sur une seule puce, ce qui constitue une exigence essentielle en mati\u00e8re de gestion de la puissance et de circuits int\u00e9gr\u00e9s \u00e0 signaux mixtes. La nouvelle plate-forme BCD 55 nm d&rsquo;UMC \u00e9tend cette flexibilit\u00e9 gr\u00e2ce \u00e0 trois variantes de processus principales adapt\u00e9es aux diff\u00e9rents besoins des applications.<\/p>\n<p data-start=\"1041\" data-end=\"1618\">Le proc\u00e9d\u00e9 sans \u00e9pitaxie (Non-EPI) offre une approche \u00e9conomique ax\u00e9e sur l&rsquo;efficacit\u00e9 \u00e9nerg\u00e9tique et les performances analogiques pour les composants grand public et mobiles. Pour les applications automobiles, le proc\u00e9d\u00e9 d&rsquo;\u00e9pitaxie (EPI) d&rsquo;UMC prend en charge des tensions de fonctionnement allant jusqu&rsquo;\u00e0 150 V et r\u00e9pond \u00e0 la norme automobile rigoureuse AEC-Q100 Grade 0, garantissant la fiabilit\u00e9 dans des environnements de fonctionnement extr\u00eames. Le processus de silicium sur isolant (SOI), quant \u00e0 lui, vise les syst\u00e8mes automobiles et industriels haut de gamme, offrant une conformit\u00e9 \u00e0 la norme AEC-Q100 Grade 1, une suppression du bruit sup\u00e9rieure et des courants de fuite r\u00e9duits.<\/p>\n<div id=\"attachment_487182\" style=\"width: 1034px\" class=\"wp-caption alignnone\"><img decoding=\"async\" aria-describedby=\"caption-attachment-487182\" class=\"wp-image-487182 size-large lazyload\" data-src=\"https:\/\/www.eenewseurope.com\/wp-content\/uploads\/2025\/10\/2025_1022_E-1024x556.jpg\" alt=\"UMC lance une plate-forme BCD en 55 nm pour des conceptions \u00e0 faible consommation d'\u00e9nergie\" width=\"1024\" height=\"556\" data-srcset=\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2025\/10\/2025_1022_E-1024x556.jpg 1024w, https:\/\/www.ecinews.fr\/wp-content\/uploads\/2025\/10\/2025_1022_E-300x163.jpg 300w, https:\/\/www.ecinews.fr\/wp-content\/uploads\/2025\/10\/2025_1022_E-768x417.jpg 768w, https:\/\/www.ecinews.fr\/wp-content\/uploads\/2025\/10\/2025_1022_E-1536x834.jpg 1536w, https:\/\/www.ecinews.fr\/wp-content\/uploads\/2025\/10\/2025_1022_E-2048x1112.jpg 2048w, https:\/\/www.ecinews.fr\/wp-content\/uploads\/2025\/10\/2025_1022_E-scaled.jpg 1080w\" data-sizes=\"(max-width: 1024px) 100vw, 1024px\" src=\"data:image\/svg+xml;base64,PHN2ZyB3aWR0aD0iMSIgaGVpZ2h0PSIxIiB4bWxucz0iaHR0cDovL3d3dy53My5vcmcvMjAwMC9zdmciPjwvc3ZnPg==\" style=\"--smush-placeholder-width: 1024px; --smush-placeholder-aspect-ratio: 1024\/556;\" \/><p id=\"caption-attachment-487182\" class=\"wp-caption-text\"><em>UMC lance une plate-forme BCD 55 nm pour des conceptions \u00e0 faible consommation d&rsquo;\u00e9nergie (source : <a href=\"https:\/\/www.umc.com\/\">UMC<\/a>).<\/em><\/p><\/div>\n<p data-start=\"1620\" data-end=\"1838\">La plate-forme prend \u00e9galement en charge le m\u00e9tal ultra-\u00e9pais (UTM), la m\u00e9moire flash int\u00e9gr\u00e9e et les options de m\u00e9moire vive r\u00e9sistive (RRAM), ce qui offre aux concepteurs une plus grande souplesse dans l&rsquo;int\u00e9gration de la m\u00e9moire et des circuits \u00e0 courant \u00e9lev\u00e9 pour les applications d&rsquo;alimentation.<\/p>\n<h2 data-start=\"1840\" data-end=\"1885\">Renforcer le portefeuille de sp\u00e9cialit\u00e9s de l&rsquo;UMC<\/h2>\n<p data-start=\"1887\" data-end=\"2459\">\u00ab\u00a0La disponibilit\u00e9 de notre plateforme BCD 55 nm marque une \u00e9tape importante pour UMC, compl\u00e9tant notre portefeuille de technologies BCD sp\u00e9cialis\u00e9es et renfor\u00e7ant notre comp\u00e9titivit\u00e9 sur le march\u00e9 de la gestion de l&rsquo;\u00e9nergie\u00a0\u00bb, a d\u00e9clar\u00e9 Steven Hsu, vice-pr\u00e9sident du d\u00e9veloppement technologique chez UMC. \u00ab\u00a0Alors que la technologie BCD 55nm est en production depuis plusieurs ann\u00e9es sur le march\u00e9, UMC propose de toutes nouvelles solutions BCD 55nm compl\u00e8tes avec des performances comp\u00e9titives, permettant \u00e0 nos clients de construire des solutions d&rsquo;alimentation innovantes pour tout ce qui concerne les smartphones et les wearables, l&rsquo;automobile, les maisons intelligentes et les usines.\u00a0\u00bb<\/p>\n<p data-start=\"2461\" data-end=\"2881\">Avec ce lancement, UMC propose d\u00e9sormais l&rsquo;un des plus vastes portefeuilles de proc\u00e9d\u00e9s BCD de l&rsquo;industrie, allant de 0,35\u00b5m \u00e0 55nm, couvrant des gammes de tension adapt\u00e9es \u00e0 divers march\u00e9s. La combinaison de la vaste propri\u00e9t\u00e9 intellectuelle de la fonderie, de l&rsquo;activation de la conception et de la maturit\u00e9 du processus la positionne pour r\u00e9pondre aux demandes \u00e9volutives des fabricants de circuits int\u00e9gr\u00e9s d&rsquo;\u00e9lectronique de puissance et de signaux mixtes qui cherchent \u00e0 pousser plus loin l&rsquo;efficacit\u00e9 et l&rsquo;int\u00e9gration.<\/p>\n<p data-start=\"2883\" data-end=\"3113\" data-is-last-node=\"\" data-is-only-node=\"\">Pour la communaut\u00e9 des concepteurs europ\u00e9ens, o\u00f9 l&rsquo;efficacit\u00e9, la fiabilit\u00e9 et l&rsquo;int\u00e9gration restent au c\u0153ur de l&rsquo;innovation, la plate-forme BCD 55 nm d&rsquo;UMC offre une voie de mise \u00e0 niveau opportune pour la prochaine g\u00e9n\u00e9ration de solutions d&rsquo;alimentation automobile et industrielle.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>United Microelectronics Corporation (UMC) a pr\u00e9sent\u00e9 une nouvelle plate-forme BCD 55 nm &#8211; \u00e9galement connue sous le nom de technologie BCD 55 nm &#8211; con\u00e7ue pour offrir des performances et une efficacit\u00e9 \u00e9nerg\u00e9tique accrues pour les composants pour mobiles, grand public, automobiles et industriels de la prochaine g\u00e9n\u00e9ration. Le dernier n\u0153ud de processus de la [&hellip;]<\/p>\n","protected":false},"author":34,"featured_media":487183,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[3669],"tags":[10656,3668,10655],"domains":[47],"ppma_author":[10490,1153],"class_list":["post-487196","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-nouvelles","tag-55-nm","tag-bcd-fr","tag-ic-fr","domains-electronique-eci"],"acf":[],"yoast_head":"<title>UMC lance sa plate-forme BCD 55 nm low energy ...<\/title>\n<meta name=\"description\" content=\"UMC lance une plate-forme BCD 55 nm pour circuits int\u00e9gr\u00e9s \u00e0 faible consommation d&#039;\u00e9nergie pour mobiles, automobiles et industriels\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" 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