{"id":485974,"date":"2025-09-22T17:59:20","date_gmt":"2025-09-22T15:59:20","guid":{"rendered":"https:\/\/www.ecinews.fr\/?p=485974"},"modified":"2025-09-22T17:59:20","modified_gmt":"2025-09-22T15:59:20","slug":"le-verre-futur-pilier-de-lemballage-des-semi-conducteurs-a-lere-de-lia-et-du-calcul-haute-performance","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/le-verre-futur-pilier-de-lemballage-des-semi-conducteurs-a-lere-de-lia-et-du-calcul-haute-performance\/","title":{"rendered":"Le verre, futur pilier de l\u2019emballage des semi-conducteurs \u00e0 l\u2019\u00e8re de l\u2019IA et du calcul haute performance"},"content":{"rendered":"<h3>Longtemps rel\u00e9gu\u00e9 au r\u00f4le discret de consommable dans les salles blanches, le verre s\u2019impose d\u00e9sormais comme un mat\u00e9riau strat\u00e9gique dans l\u2019\u00e9volution des semi-conducteurs. Selon le nouveau rapport d\u2019IDTechEx, \u00ab Glass in Semiconductors 2026\u20132036 \u00bb, le verre est en passe de devenir un \u00e9l\u00e9ment central des architectures avanc\u00e9es, notamment dans les domaines de l\u2019IA, du HPC (High-Performance Computing) et de la photonique int\u00e9gr\u00e9e.<\/h3>\n<p>D\u00e9j\u00e0 utilis\u00e9 comme support ultra-plat pour le mincissement des wafers, comme capot herm\u00e9tique pour les MEMS, ou encore comme base pour les proc\u00e9d\u00e9s fan-out, le verre \u00e9volue vers des fonctions plus critiques : substrat principal, interposeur pour chiplets, ou encore di\u00e9lectrique pour signaux sub-THz.<\/p>\n<p>Pourquoi ce basculement ? Parce que les limites du substrat organique et les co\u00fbts du silicium deviennent des freins \u00e0 l\u2019\u00e9chelle du syst\u00e8me. Le verre, avec sa faible perte di\u00e9lectrique, son CTE ajustable et sa compatibilit\u00e9 avec les proc\u00e9d\u00e9s grands panneaux issus du LCD, offre une alternative prometteuse. Il permet de r\u00e9duire les pertes \u00e0 haute fr\u00e9quence, de supporter des densit\u00e9s de vias \u00e9lev\u00e9es, et de r\u00e9duire les co\u00fbts \u00e0 mesure que les rendements augmentent.<\/p>\n<p>Des acteurs majeurs comme Intel, Samsung, SKC ou AGC investissent d\u00e9j\u00e0 dans des lignes pilotes ou des d\u00e9monstrateurs. Aucun lancement commercial n\u2019est encore annonc\u00e9, mais la dynamique est claire : le verre est d\u00e9sormais sur la short-list des substrats de nouvelle g\u00e9n\u00e9ration.<\/p>\n<p><strong>Pour en savoir plus<\/strong>\u00a0: <a href=\"https:\/\/www.idtechex.com\/en\/research-report\/glass-in-semiconductors\/1117\">https:\/\/www.idtechex.com\/en\/research-report\/glass-in-semiconductors\/1117<\/a><\/p>\n<p><a href=\"https:\/\/www.idtechex.com\/\">IDTechEx<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Longtemps rel\u00e9gu\u00e9 au r\u00f4le discret de consommable dans les salles blanches, le verre s\u2019impose d\u00e9sormais comme un mat\u00e9riau strat\u00e9gique dans l\u2019\u00e9volution des semi-conducteurs. Selon le nouveau rapport d\u2019IDTechEx, \u00ab Glass in Semiconductors 2026\u20132036 \u00bb, le verre est en passe de devenir un \u00e9l\u00e9ment central des architectures avanc\u00e9es, notamment dans les domaines de l\u2019IA, du HPC [&hellip;]<\/p>\n","protected":false},"author":39,"featured_media":485975,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[886,883],"tags":[10378,7598,1558],"domains":[47],"ppma_author":[6113],"class_list":["post-485974","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news-fr","category-technologies","tag-rapport","tag-semiconducteur","tag-semiconducteurs","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Le verre, futur pilier de l\u2019emballage des semi-conducteurs \u00e0...<\/title>\n<meta name=\"description\" content=\"Longtemps rel\u00e9gu\u00e9 au r\u00f4le discret de consommable dans 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