{"id":484605,"date":"2025-08-16T14:23:11","date_gmt":"2025-08-16T12:23:11","guid":{"rendered":"https:\/\/www.ecinews.fr\/?p=484605"},"modified":"2025-08-16T14:23:11","modified_gmt":"2025-08-16T12:23:11","slug":"le-tiling-permet-de-monter-des-optiques-inp-sur-substrat-de-300-mm","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/le-tiling-permet-de-monter-des-optiques-inp-sur-substrat-de-300-mm\/","title":{"rendered":"Le tiling permet de monter des optiques InP sur substrat de 300 mm"},"content":{"rendered":"<p>Oki Electric Industry, au Japon, a utilis\u00e9 sa technologie de collage de films cristallins (CFB) pour monter des composants optiques \u00e0 partir de plaquettes de 50 mm sur des plaquettes de silicium plus grandes de 300 mm.<\/p>\n<p>L&rsquo;approche Tiling CFB permet l&rsquo;int\u00e9gration h\u00e9t\u00e9rog\u00e8ne de plaquettes de semi-conducteurs optiques de petit diam\u00e8tre sur des plaquettes de silicium de 300 mm pour la production en grande quantit\u00e9 de puces dot\u00e9es d&rsquo;interfaces photoniques \u00e0 grande vitesse. Cela n&rsquo;\u00e9tait pas possible auparavant sur des plaquettes de grande taille, explique Oki, qui travaille avec des partenaires et le laboratoire Nishiyama de l&rsquo;Institut des sciences de Tokyo sur la commercialisation.<\/p>\n<p>L&rsquo;intelligence artificielle, en particulier, stimule la demande de liaisons puce \u00e0 puce \u00e0 grande vitesse et \u00e0 faible consommation d&rsquo;\u00e9nergie, ce qui constitue un objectif cl\u00e9 pour la photonique. Les plaquettes de semi-conducteurs optiques telles que les plaquettes de phosphure d&rsquo;indium sont g\u00e9n\u00e9ralement plus petites que les plaquettes de semi-conducteurs compos\u00e9s de 50 mm \u00e0 100 mm, en raison de la difficult\u00e9 \u00e0 r\u00e9aliser une croissance \u00e9pitaxiale. En outre, les guides d&rsquo;ondes optiques en silicium n\u00e9cessitent un contr\u00f4le de la rugosit\u00e9 \u00e0 l&rsquo;\u00e9chelle nanom\u00e9trique, ce qui requiert des processus d&rsquo;int\u00e9gration h\u00e9t\u00e9rog\u00e8nes qui \u00e9vitent de causer des dommages.<\/p>\n<ul>\n<li><a href=\"https:\/\/www.eenewseurope.com\/en\/cornerstone-aims-for-a-github-for-silicon-photonics\/\">Cornerstone vise \u00e0 cr\u00e9er un Github de la photonique<\/a><\/li>\n<li><a href=\"https:\/\/www.eenewseurope.com\/en\/worlds-first-ai-photonic-processor-fires-up\/\">Le premier processeur photonique au monde d\u00e9marre<\/a><\/li>\n<li><a href=\"https:\/\/www.eenewseurope.com\/en\/nvidia-looks-to-silicon-photonics-to-cut-datacentre-ai-power\/\">Nvidia mise sur la photonique du silicium pour r\u00e9duire la consommation d&rsquo;\u00e9nergie des centres de donn\u00e9es d&rsquo;IA<\/a><\/li>\n<\/ul>\n<p>La technologie CFB a \u00e9t\u00e9 d\u00e9velopp\u00e9e \u00e0 l&rsquo;origine par OKI pour ses imprimantes, et l&rsquo;approche de \u00ab\u00a0tiling\u00a0\u00bb permet de surmonter la disparit\u00e9 des tailles de plaquettes avec 52 op\u00e9rations de tiling r\u00e9p\u00e9t\u00e9es sur toute la surface d&rsquo;une plaquette de silicium de 300 mm \u00e0 l&rsquo;aide d&rsquo;une seule plaquette d&rsquo;InP de 50 mm, ce qui permet une utilisation efficace des mat\u00e9riaux \u00e0 base d&rsquo;InP en seulement 10 minutes.<\/p>\n<p>La plaquette InP peut \u00eatre r\u00e9utilis\u00e9e telle quelle apr\u00e8s le transfert pour permettre le recyclage et la r\u00e9utilisation des mat\u00e9riaux, ce qui contribue \u00e0 r\u00e9duire la charge environnementale. La pr\u00e9cision de placement est d&rsquo;environ \u00b11 \u03bcm, avec une pr\u00e9cision angulaire de \u00b10,005\u00b0. Cette grande pr\u00e9cision, associ\u00e9e \u00e0 la technologie photonique silicium \u00e0 guides d&rsquo;ondes s\u00e9cants 3D exclusive d&rsquo;OKI, permet un couplage optique haute efficacit\u00e9 entre les semi-conducteurs optiques et les guides d&rsquo;ondes silicium, m\u00eame avec un d\u00e9faut d&rsquo;alignement d&rsquo;environ \u00b13 \u03bcm.<\/p>\n<div id=\"attachment_484593\" style=\"width: 1010px\" class=\"wp-caption alignnone\"><img decoding=\"async\" aria-describedby=\"caption-attachment-484593\" class=\"size-full wp-image-484593 lazyload\" data-src=\"https:\/\/www.eenewseurope.com\/wp-content\/uploads\/2025\/08\/Oki-photonics02.jpg\" alt=\"La soci\u00e9t\u00e9 japonaise Oki a utilis\u00e9 avec succ\u00e8s sa technologie de collage de films cristallins (CFB) pour monter des composants optiques \u00e0 partir de plaquettes de 50 mm sur des plaquettes de silicium plus grandes de 300 mm.\" width=\"1000\" height=\"442\" data-srcset=\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2025\/08\/Oki-photonics02.jpg 1000w, https:\/\/www.ecinews.fr\/wp-content\/uploads\/2025\/08\/Oki-photonics02-300x133.jpg 300w, https:\/\/www.ecinews.fr\/wp-content\/uploads\/2025\/08\/Oki-photonics02-768x339.jpg 768w\" data-sizes=\"(max-width: 1000px) 100vw, 1000px\" src=\"data:image\/svg+xml;base64,PHN2ZyB3aWR0aD0iMSIgaGVpZ2h0PSIxIiB4bWxucz0iaHR0cDovL3d3dy53My5vcmcvMjAwMC9zdmciPjwvc3ZnPg==\" style=\"--smush-placeholder-width: 1000px; --smush-placeholder-aspect-ratio: 1000\/442;\" \/><p id=\"caption-attachment-484593\" class=\"wp-caption-text\">Source : Oki<\/p><\/div>\n<p>&nbsp;<\/p>\n<p>Lors d&rsquo;une d\u00e9monstration, une couche sacrificielle et des films cristallins \u00e0 base d&rsquo;InP fonctionnant comme semi-conducteurs optiques ont \u00e9t\u00e9 \u00e9pitaxi\u00e9s sur une plaquette d&rsquo;InP de 50 mm, puis s\u00e9par\u00e9s en \u00e9l\u00e9ments individuels.<\/p>\n<p>Une structure protectrice destin\u00e9e \u00e0 emp\u00eacher les attaques chimiques lors de la gravure de la couche sacrificielle et une structure de support pour le transfert par lots ont \u00e9t\u00e9 form\u00e9es sur chaque \u00e9l\u00e9ment. Les films cristallins \u00e0 base d&rsquo;InP ont ainsi pu \u00eatre transf\u00e9r\u00e9s par lots sur un substrat de transfert interm\u00e9diaire sans \u00e9rosion.<\/p>\n<p>Le transfert par lots sur un substrat de transfert interm\u00e9diaire est effectu\u00e9 pour prot\u00e9ger la plaquette de silicium contre les dommages au cours du processus d&rsquo;enl\u00e8vement ult\u00e9rieur, car l&rsquo;enl\u00e8vement de la structure de protection et de la structure de support sur le substrat de transfert interm\u00e9diaire \u00e9vite d&rsquo;endommager la plaquette de silicium au cours du processus d&rsquo;enl\u00e8vement.<\/p>\n<p>La conception du substrat de transfert interm\u00e9diaire garantit que les films cristallins \u00e0 base d&rsquo;InP ne se d\u00e9collent pas, qu&rsquo;ils conservent leur adh\u00e9rence pendant le processus de retrait de la structure protectrice et de la structure de support, et qu&rsquo;ils sont facilement transf\u00e9r\u00e9s pendant le processus de transfert.<\/p>\n<p>Le tampon CFB de 30 x 30 mm a une structure capable de transf\u00e9rer s\u00e9lectivement uniquement les films de cristal n\u00e9cessaires, et le transfert r\u00e9p\u00e9t\u00e9 permet un tiling efficace. La capacit\u00e9 de transf\u00e9rer de mani\u00e8re r\u00e9p\u00e9t\u00e9e des r\u00e9seaux de couches de cristal de faible densit\u00e9 n\u00e9cessaires au dispositif \u00e0 partir d&rsquo;un r\u00e9seau de couches de cristal de haute densit\u00e9 dispos\u00e9 sur le substrat de transfert interm\u00e9diaire permet une utilisation efficace des mat\u00e9riaux sans gaspillage.<\/p>\n<p>La technologie peut \u00e9galement \u00eatre adapt\u00e9e si n\u00e9cessaire pour permettre l&rsquo;utilisation de plaquettes InP de 75 mm et 100 mm et de plaquettes de silicium de 200 mm. Elle peut \u00e9galement \u00eatre appliqu\u00e9e aux produits semi-conducteurs optiques existants pour les substrats \u00e0 dissipation thermique \u00e9lev\u00e9e et la productivit\u00e9 en permettant l&rsquo;utilisation de plaquettes de plus grande taille.<\/p>\n<p><a href=\"http:\/\/www.oki.com\">www.oki.com<\/a><\/p>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Oki Electric Industry, au Japon, a utilis\u00e9 sa technologie de collage de films cristallins (CFB) pour monter des composants optiques \u00e0 partir de plaquettes de 50 mm sur des plaquettes de silicium plus grandes de 300 mm. L&rsquo;approche Tiling CFB permet l&rsquo;int\u00e9gration h\u00e9t\u00e9rog\u00e8ne de plaquettes de semi-conducteurs optiques de petit diam\u00e8tre sur des plaquettes de [&hellip;]<\/p>\n","protected":false},"author":40,"featured_media":484596,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[883],"tags":[9289],"domains":[47],"ppma_author":[3640,6199],"class_list":["post-484605","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-technologies","tag-ci-photonique","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Le tiling permet de monter des optiques InP sur substrat de 300...<\/title>\n<meta name=\"description\" content=\"Oki a utilis\u00e9 sa technologie de collage de films cristallins (CFB) pour monter des composants optiques sur des plaquettes Si de 300 mm.\" \/>\n<meta name=\"robots\" content=\"index, follow, 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