{"id":483575,"date":"2025-07-24T15:00:30","date_gmt":"2025-07-24T13:00:30","guid":{"rendered":"https:\/\/www.ecinews.fr\/?p=483575"},"modified":"2025-07-24T15:22:25","modified_gmt":"2025-07-24T13:22:25","slug":"tria-technologies-devoile-le-premier-module-com-hpc-mini-hmm-rlp","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/tria-technologies-devoile-le-premier-module-com-hpc-mini-hmm-rlp\/","title":{"rendered":"Tria Technologies d\u00e9voile le premier module COM-HPC Mini HMM-RLP"},"content":{"rendered":"<h3>Tria Technologies, filiale d\u2019Avnet sp\u00e9cialis\u00e9e dans les cartes de calcul embarqu\u00e9es, a pr\u00e9sent\u00e9 au salon Embedded World 2025 son tout nouveau module HMM-RLP, le premier de sa gamme \u00e0 adopter le facteur de forme COM-HPC Mini. Ce module ultra-compact embarque les processeurs Intel Core de 13\u1d49 g\u00e9n\u00e9ration, offrant jusqu\u2019\u00e0 14 c\u0153urs et 20 threads, avec une enveloppe thermique comprise entre 15 et 35 W.<\/h3>\n<p>Pens\u00e9 pour les syst\u00e8mes embarqu\u00e9s \u00e0 forte contrainte d\u2019espace et de dissipation thermique, le HMM-RLP int\u00e8gre \u00e9galement le GPU Intel Iris Xe, jusqu\u2019\u00e0 64 Go de m\u00e9moire soud\u00e9e ECC, un stockage NVMe en option, et une connectivit\u00e9 riche : PCIe Gen 4, USB4, Ethernet GbE, MIPI-CSI, SATA, etc. Il peut g\u00e9rer jusqu\u2019\u00e0 quatre \u00e9crans externes via DDI, eDP et USB4.<\/p>\n<p>Con\u00e7u et fabriqu\u00e9 en Allemagne, ce module est 100 % conforme \u00e0 la norme COM-HPC, garantissant une p\u00e9rennit\u00e9 et une \u00e9volutivit\u00e9 pour les march\u00e9s exigeants comme l\u2019automatisation, la robotique, le m\u00e9dical et le transport.<br \/>\n\u00a0<a href=\"https:\/\/www.tria-technologies.com\/\">Tria<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Tria Technologies, filiale d\u2019Avnet sp\u00e9cialis\u00e9e dans les cartes de calcul embarqu\u00e9es, a pr\u00e9sent\u00e9 au salon Embedded World 2025 son tout nouveau module HMM-RLP, le premier de sa gamme \u00e0 adopter le facteur de forme COM-HPC Mini. Ce module ultra-compact embarque les processeurs Intel Core de 13\u1d49 g\u00e9n\u00e9ration, offrant jusqu\u2019\u00e0 14 c\u0153urs et 20 threads, avec [&hellip;]<\/p>\n","protected":false},"author":39,"featured_media":483589,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[881],"tags":[7980,9016,9015,6951,8972,4523],"domains":[47],"ppma_author":[6113],"class_list":["post-483575","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-nouveaux-produits","tag-automatisme","tag-embedded-world-fr","tag-embedded-world-2025","tag-equipement-medical","tag-module-com-hpc","tag-robotique-fr","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Tria Technologies d\u00e9voile le premier module COM-HPC Mini HMM-RLP ...<\/title>\n<meta name=\"description\" content=\"Tria Technologies a pr\u00e9sent\u00e9 au salon Embedded World 2025 son tout 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