{"id":479489,"date":"2025-05-12T14:24:03","date_gmt":"2025-05-12T12:24:03","guid":{"rendered":"https:\/\/www.ecinews.fr\/?p=479489"},"modified":"2025-05-12T14:24:03","modified_gmt":"2025-05-12T12:24:03","slug":"a-quoi-ressemblera-la-puce-de-demain","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/a-quoi-ressemblera-la-puce-de-demain\/","title":{"rendered":"A quoi ressemblera la puce de demain ?"},"content":{"rendered":"<h3><span style=\"font-size: 16px;\">Le CEA a ouvert \u00e0 ses partenaires industriels et acad\u00e9miques\u00a0la <a href=\"https:\/\/www.cea.fr\/presse\/Pages\/actualites-communiques\/ntic\/fames-ligne-pilote-au-service-industrie-microelectronique-europeenne.aspx\">ligne pilote FAMES<\/a>, d\u00e9di\u00e9e \u00e0 la maturation de cinq technologies-clefs de la micro\u00e9lectronique, afin de\u00a0<strong>favoriser l&rsquo;\u00e9mergence de puces plus performantes, plus sobres en \u00e9nergie et moins gourmandes en ressources plan\u00e9taires<\/strong>.<\/span><\/h3>\n<p>R\u00e9sultat d\u2019un investissement de pr\u00e8s d\u2019un milliard d\u2019euros, co-financ\u00e9 dans le cadre du Chips Act par la Commission europ\u00e9enne et les Etats membres dont l\u2019\u00c9tat fran\u00e7ais \u00e0 travers France 2030, l&rsquo;objectif est de\u00a0 mettre au point et transf\u00e9rer aux industriels les technologies qui contribueront aux produits de demain.<\/p>\n<p>\u00ab\u00a0<em>Les puces interviennent presque partout, rappelle <strong>Thomas Ernst<\/strong>, directeur scientifique au CEA. Ce n\u2019est pas qu\u2019une question d\u2019ordinateur ou de smartphone !\u00a0<\/em>\u00bb M\u00eame chez les industriels dont ce n\u2019est pas le c\u0153ur de m\u00e9tier, les composants s\u2019imposent, dans les moyens de production ou le produit final.Principal moteur du secteur : la miniaturisation,\u00a0qui engendre une baisse des co\u00fbts, et g\u00e9n\u00e9rant une d\u00e9mocratisation des puces \u00e9lectroniques. C\u00f4t\u00e9 calcul, pour les transistors, les n\u0153uds les plus avanc\u00e9s chez les fabricants asiatiques atteignent 2 nm.<\/p>\n<p><strong>Les diff\u00e9rentes architectures<\/strong><\/p>\n<p><strong>GAA<\/strong> , pour l\u2019avenir, l\u2019industrie du semiconducteur mise sur le GAA\u00a0et son architecture de grille \u00ab enrobante \u00bb sur laquelle le CEA travaille depuis les ann\u00e9es 2000&#8230;..<\/p>\n<p><strong>Chiplets et int\u00e9gration 3D<\/strong>\u00a0C\u00f4t\u00e9 m\u00e9moire et interconnexions, on touche \u00e9galement aux limites. Or, la quantit\u00e9 de donn\u00e9es augmente sans cesse&#8230;&#8230;<\/p>\n<p><strong>La spintronique\u00a0M\u00e9lange d\u2019\u00e9lectronique et de quantique<\/strong>,\u00a0la spintronique, qui utilise le spin des \u00e9lectrons en plus de leur charge \u00e9lectrique, contribue \u00e9galement aux puces du futur\u2026 mais aussi des puces d\u2019aujourd\u2019hui\u00a0!&#8230;..<\/p>\n<p><strong>L&rsquo;avenir du FD-SOI, <\/strong>\u00a0le CEA continue d\u2019am\u00e9liorer <a class=\"ms-rteElement-cea-link ms-rteElement-cea-download\" title=\"Comment marche un transistor FD-SOI\" href=\"https:\/\/www.cea.fr\/multimedia\/documents\/infographies\/le-transistor-fdsoi.pdf\" target=\"_blank\" rel=\"noopener\">le FD-SOI<\/a>,\u00a0technologie phare d\u00e9velopp\u00e9e \u00e0 Grenoble et adopt\u00e9e par de grands noms comme STMicroelectronics, Qualcomm, Sony, Google, NXP, Nordic ou Samsung&#8230;.<\/p>\n<p><strong>R\u00e9emploi et recyclage des composants.\u00a0<\/strong>En aval, le CEA participe au\u00a0<a class=\"ms-rteElement-cea-link ms-rteElement-cea-external\" title=\"Projet europ\u00e9en EECONE\" href=\"https:\/\/www.eecone.com\/eecone\/home\/\" target=\"_blank\" rel=\"noopener\">projet europ\u00e9en EECONE<\/a>, qui vise \u00e0 d\u00e9velopper d\u00e8s le d\u00e9part des composants facilement r\u00e9parables et recyclables en fin de vie&#8230;.<\/p>\n<p><strong>Retrouvez le texte int\u00e9gral sur le site du <a href=\"https:\/\/www.cea.fr\/presse\/Pages\/actualites-communiques\/ntic\/a-quoi-ressemblera-puce-demain.aspx\">CEA<\/a> <\/strong>\u00a0<\/p>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Le CEA a ouvert \u00e0 ses partenaires industriels et acad\u00e9miques\u00a0la ligne pilote FAMES, d\u00e9di\u00e9e \u00e0 la maturation de cinq technologies-clefs de la micro\u00e9lectronique, afin de\u00a0favoriser l&rsquo;\u00e9mergence de puces plus performantes, plus sobres en \u00e9nergie et moins gourmandes en ressources plan\u00e9taires. R\u00e9sultat d\u2019un investissement de pr\u00e8s d\u2019un milliard d\u2019euros, co-financ\u00e9 dans le cadre du Chips Act [&hellip;]<\/p>\n","protected":false},"author":11,"featured_media":479492,"comment_status":"closed","ping_status":"closed","sticky":true,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":"","_ppma_block_editor_authors":""},"categories":[886],"tags":[8957],"domains":[47],"ppma_author":[5731,1143],"class_list":["post-479489","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news-fr","tag-cea","domains-electronique-eci"],"acf":[],"yoast_head":"<title>A quoi ressemblera la puce de demain ? ...<\/title>\n<meta name=\"description\" content=\"A quoi ressemblera la puce de demain ?\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/479489\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"A quoi ressemblera la puce de demain ?\" \/>\n<meta property=\"og:description\" content=\"A quoi ressemblera la puce de demain ?\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/479489\/\" \/>\n<meta property=\"og:site_name\" content=\"EENewsEurope\" \/>\n<meta property=\"article:published_time\" content=\"2025-05-12T12:24:03+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2025\/05\/CEA-Technos.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"600\" \/>\n\t<meta property=\"og:image:height\" content=\"414\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"CEA, Daniel Cardon\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Daniel Cardon\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.ecinews.fr\\\/fr\\\/a-quoi-ressemblera-la-puce-de-demain\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.ecinews.fr\\\/fr\\\/a-quoi-ressemblera-la-puce-de-demain\\\/\"},\"author\":{\"name\":\"Daniel Cardon\",\"@id\":\"https:\\\/\\\/www.ecinews.fr\\\/fr\\\/#\\\/schema\\\/person\\\/f5625a80c44cf21631dac7603eff5f75\"},\"headline\":\"A quoi ressemblera la puce de demain ?\",\"datePublished\":\"2025-05-12T12:24:03+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.ecinews.fr\\\/fr\\\/a-quoi-ressemblera-la-puce-de-demain\\\/\"},\"wordCount\":377,\"publisher\":{\"@id\":\"https:\\\/\\\/www.ecinews.fr\\\/fr\\\/#organization\"},\"image\":{\"@id\":\"https:\\\/\\\/www.ecinews.fr\\\/fr\\\/a-quoi-ressemblera-la-puce-de-demain\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.ecinews.fr\\\/wp-content\\\/uploads\\\/2025\\\/05\\\/CEA-Technos.jpg\",\"keywords\":[\"CEA\"],\"articleSection\":[\"Actualit\u00e9 g\u00e9n\u00e9rale\"],\"inLanguage\":\"fr-FR\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.ecinews.fr\\\/fr\\\/a-quoi-ressemblera-la-puce-de-demain\\\/\",\"url\":\"https:\\\/\\\/www.ecinews.fr\\\/fr\\\/a-quoi-ressemblera-la-puce-de-demain\\\/\",\"name\":\"A quoi ressemblera la puce de demain ? 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