{"id":478355,"date":"2025-04-28T01:00:33","date_gmt":"2025-04-27T23:00:33","guid":{"rendered":"https:\/\/www.ecinews.fr\/?p=478355"},"modified":"2025-04-23T17:31:16","modified_gmt":"2025-04-23T15:31:16","slug":"avicena-et-tsmc-optimisent-les-reseaux-de-photodetecteurs-pour-les-interconnexions-e-s","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/avicena-et-tsmc-optimisent-les-reseaux-de-photodetecteurs-pour-les-interconnexions-e-s\/","title":{"rendered":"Avicena et TSMC optimisent les r\u00e9seaux de photod\u00e9tecteurs pour les interconnexions E\/S"},"content":{"rendered":"<h3><span style=\"font-size: 16px;\">La soci\u00e9t\u00e9 Californienne Avicena va travailler avec TSMC pour optimiser les r\u00e9seaux de photod\u00e9tecteurs (PD) pour les interconnexions d&rsquo;avant garde LightBundle d&rsquo;Avicena bas\u00e9es sur les microLED.<\/span><\/h3>\n<p>Les interconnexions LightBundle prennent en charge une densit\u00e9 en ligne de plus de 1 Tbps\/mm et \u00e9tendent les connexions D2D (die-to-die) \u00e0 tr\u00e8s haute densit\u00e9 jusqu&rsquo;\u00e0 plus de 10 m\u00e8tres, avec une efficacit\u00e9 \u00e9nerg\u00e9tique inf\u00e9rieure \u00e0 PJ\/bit, la meilleure de sa cat\u00e9gorie. Cela permettra aux r\u00e9seaux de mise \u00e0 l&rsquo;\u00e9chelle de l&rsquo;IA de prendre en charge de grandes grappes de GPU sur plusieurs racks, en \u00e9liminant les limites de port\u00e9e des interconnexions en cuivre actuelles tout en r\u00e9duisant radicalement la consommation d&rsquo;\u00e9nergie.<\/p>\n<p>Des mod\u00e8les d&rsquo;IA de plus en plus sophistiqu\u00e9s entra\u00eenent une augmentation sans pr\u00e9c\u00e9dent de la demande de performances de calcul et de m\u00e9moire, ce qui n\u00e9cessite des interconnexions plus denses, moins gourmandes en \u00e9nergie et de plus grande port\u00e9e pour la connectivit\u00e9 processeur \u00e0 processeur (P2P) et processeur \u00e0 m\u00e9moire (P2M).<\/p>\n<p><strong>R\u00e9pondre aux exigences extr\u00eames en mati\u00e8re d&rsquo;E\/S<\/strong><\/p>\n<p>LightBundle a \u00e9t\u00e9 d\u00e9velopp\u00e9 sp\u00e9cifiquement pour r\u00e9pondre aux exigences extr\u00eames en mati\u00e8re d&rsquo;E\/S des clusters d&rsquo;IA, avec des densit\u00e9s de rive extr\u00eamement \u00e9lev\u00e9es et une consommation d&rsquo;\u00e9nergie ultra-faible. Ses \u00e9metteurs utilisent des matrices microLED optimis\u00e9es pour les interconnexions denses et \u00e0 grande vitesse, avec une efficacit\u00e9 \u00e9nerg\u00e9tique inf\u00e9rieure \u00e0 1 pJ\/bit. Les r\u00e9cepteurs optiques utilisent des r\u00e9seaux de diodes \u00e9lectroluminescentes en silicium optimis\u00e9s pour les longueurs d&rsquo;onde de la lumi\u00e8re visible transmises par les microLED. Les \u00e9metteurs-r\u00e9cepteurs chiplets LightBundle sont bien adapt\u00e9s \u00e0 diverses architectures d&#8217;emballage, y compris les optiques coemball\u00e9es (CPO), les optiques embarqu\u00e9es (OBO) et les modules optiques enfichables. Les matrices de DEL et de DP sont coll\u00e9es directement \u00e0 la surface des circuits int\u00e9gr\u00e9s CMOS pour une vari\u00e9t\u00e9 de n\u0153uds de processus. Ce travail exploite le leadership de TSMC dans les technologies d&rsquo;image et de capteurs optiques pour produire des matrices de diodes \u00e9lectroluminescentes de haute performance pour la lumi\u00e8re visible, tout en b\u00e9n\u00e9ficiant de l&rsquo;excellence de fabrication de TSMC.<\/p>\n<p>\u00ab\u00a0Avicena travaille avec TSMC depuis le tout d\u00e9but. Les capacit\u00e9s de fabrication de classe mondiale de TSMC et son exp\u00e9rience approfondie dans le domaine des capteurs optiques en silicium sont essentielles pour le d\u00e9veloppement et la production des composants cl\u00e9s de nos interconnexions LightBundle\u00a0\u00bb, d\u00e9clare Bardia Pezeshki, cofondateur et PDG d&rsquo;Avicena.<\/p>\n<p>\u00a0\u00bb Collaborer avec des innovateurs comme Avicena pour faire progresser l&rsquo;infrastructure de l&rsquo;IA r\u00e9pond \u00e0 la demande croissante d&rsquo;\u00e9volutivit\u00e9 du calcul gr\u00e2ce \u00e0 une connectivit\u00e9 efficace \u00ab\u00a0, a d\u00e9clar\u00e9 Lucas Tsai, vice-pr\u00e9sident de la gestion commerciale chez TSMC Am\u00e9rique du Nord. \u00ab\u00a0TSMC propose le portefeuille technologique de capteurs d&rsquo;images CMOS (CIS) de fonderie le plus complet.\u00a0\u00bb<\/p>\n<p><a href=\"https:\/\/avicena.tech\">https:\/\/avicena.tech<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Les interconnexions bas\u00e9es sur les microLED destin\u00e9es aux r\u00e9seaux de mise \u00e0 l&rsquo;\u00e9chelle de l&rsquo;IA offrent une densit\u00e9 d&rsquo;E\/S de plus d&rsquo;un Tbps\/mm et une efficacit\u00e9 de moins d&rsquo;un pJ\/bit.<\/p>\n","protected":false},"author":11,"featured_media":478333,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[883],"tags":[3679,9607,5004,8458,5557,2541],"domains":[47],"ppma_author":[3682,1143],"class_list":["post-478355","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-technologies","tag-ai-fr","tag-avicena-fr","tag-capteur-dimage","tag-interconnexion-optique","tag-reseaux-fr","tag-tsmc","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Avicena et TSMC optimisent les r\u00e9seaux de photod\u00e9tecteurs pou...<\/title>\n<meta name=\"description\" content=\"Les interconnexions 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