{"id":478250,"date":"2025-04-23T07:44:32","date_gmt":"2025-04-23T05:44:32","guid":{"rendered":"https:\/\/www.ecinews.fr\/?p=478250"},"modified":"2025-04-22T18:01:28","modified_gmt":"2025-04-22T16:01:28","slug":"sandisk-propose-la-memoire-hbf-pour-remplacer-la-hbm","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/sandisk-propose-la-memoire-hbf-pour-remplacer-la-hbm\/","title":{"rendered":"Sandisk propose la m\u00e9moire HBF pour remplacer la HBM"},"content":{"rendered":"<h2>Sandisk Corp. poursuit une innovation dans le domaine de la m\u00e9moire flash 3D-NAND qui, selon l&rsquo;entreprise, pourrait remplacer la m\u00e9moire HBM (m\u00e9moire \u00e0 large bande passante) bas\u00e9e sur la DRAM pour les applications d&rsquo;inf\u00e9rence de l&rsquo;IA.<\/h2>\n<p>Lorsque Sandisk a \u00e9t\u00e9 s\u00e9par\u00e9e de la soci\u00e9t\u00e9 de stockage de donn\u00e9es Western Digital en f\u00e9vrier 2025, l&rsquo;entreprise a d\u00e9clar\u00e9 qu&rsquo;elle avait l&rsquo;intention de fournir des produits de m\u00e9moire flash tout en poursuivant le d\u00e9veloppement de technologies de m\u00e9moire \u00e9mergentes et perturbatrices.<\/p>\n<p>Lors de la journ\u00e9e des investisseurs de Sandisk qui s&rsquo;est tenue le 11 f\u00e9vrier, peu avant la scission, Alper Ilkbahar, le nouveau vice-pr\u00e9sident principal de la technologie des m\u00e9moires, a d\u00e9crit la m\u00e9moire flash \u00e0 grande largeur de bande ainsi que ce qu&rsquo;il a appel\u00e9 la m\u00e9moire matricielle 3D.<\/p>\n<blockquote class=\"wp-embedded-content\" data-secret=\"uN9BJBSRcI\"><p><a href=\"https:\/\/www.eenewseurope.com\/en\/does-phase-change-memory-ride-again-with-sandisk\/\">Does phase-change memory ride again with Sandisk?<\/a><\/p><\/blockquote>\n<p><iframe class=\"wp-embedded-content lazyload\" sandbox=\"allow-scripts\" security=\"restricted\" style=\"position: absolute; visibility: hidden;\" title=\"&#8220;Does phase-change memory ride again with Sandisk?&#8221; &#8212; eeNews Europe\" data-src=\"https:\/\/www.eenewseurope.com\/en\/does-phase-change-memory-ride-again-with-sandisk\/embed\/#?secret=6f0VXrKEu8#?secret=uN9BJBSRcI\" data-secret=\"uN9BJBSRcI\" width=\"500\" height=\"282\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" src=\"data:image\/svg+xml;base64,PHN2ZyB3aWR0aD0iMSIgaGVpZ2h0PSIxIiB4bWxucz0iaHR0cDovL3d3dy53My5vcmcvMjAwMC9zdmciPjwvc3ZnPg==\" data-load-mode=\"1\"><\/iframe><\/p>\n<p>Lors de la m\u00eame pr\u00e9sentation, Ilkbahar a d\u00e9clar\u00e9 qu&rsquo;en optimisant la flash NAND pour la bande passante &#8211; plut\u00f4t que pour la surface de la puce et le co\u00fbt &#8211; l&rsquo;entreprise avait mis au point une architecture qu&rsquo;elle appelle flash \u00e0 large bande passante (HBF).<\/p>\n<p>L&rsquo;approche consiste \u00e0 diviser le r\u00e9seau de m\u00e9moire NAND en plusieurs mini-r\u00e9seaux et \u00e0 acc\u00e9der \u00e0 chacun de ces r\u00e9seaux en parall\u00e8le. Ces multiples mini-r\u00e9seaux peuvent \u00eatre empil\u00e9s dans la dimension verticale \u00e0 l&rsquo;aide de la technologie 3D-NAND de Kioxia BICS. Cette technologie a \u00e9t\u00e9 utilis\u00e9e pour produire des m\u00e9moires R&amp;D \u00e0 16 couches dont la capacit\u00e9 est 8 \u00e0 16 fois sup\u00e9rieure \u00e0 celle de la m\u00e9moire HBM \u00e0 un prix similaire, a d\u00e9clar\u00e9 M. Ilkbahar.<\/p>\n<p>\u00ab\u00a0Nous d\u00e9veloppons cette technologie en collaboration avec les principaux acteurs de l&rsquo;IA\u00a0\u00bb, a d\u00e9clar\u00e9 M. Ilkbahar devant un parterre d&rsquo;analystes financiers. Le HBF a le potentiel de remplacer le HBM dans les GPU des centres de donn\u00e9es et d&rsquo;\u00e9tendre leur utilisation aux smartphones compatibles avec l&rsquo;IA et \u00e0 d&rsquo;autres \u00e9quipements p\u00e9riph\u00e9riques, a-t-il ajout\u00e9.<\/p>\n<p>Actuellement, une AI-GPU typique comprend deux puces logiques de GPU et huit puces HBM. Une prochaine AI-GPU utilise ces huit HBM pour fournir 192 gigaoctets de DRAM. Ilkbahar a d\u00e9clar\u00e9 que l&rsquo;utilisation de la m\u00e9moire HBF pourrait permettre \u00e0 un composant de disposer de 4 To de m\u00e9moire non volatile.<\/p>\n<p>Un LLM contemporain exigeant tel que GPT4 comporte 1,8 trillion de param\u00e8tres et utilise des poids de 16 bits, ce qui n\u00e9cessite 3,6 To d&rsquo;octets, a d\u00e9clar\u00e9 Ilkbahar. \u00ab\u00a0Cela signifie que l&rsquo;ensemble du mod\u00e8le peut \u00eatre plac\u00e9 sur un seul GPU avec m\u00e9moire HBF et permet d&rsquo;\u00e9viter de nombreux d\u00e9placements de donn\u00e9es\u00a0\u00bb, a-t-il observ\u00e9. Cette efficacit\u00e9 sera importante pour les mod\u00e8les multimodaux \u00e0 venir qui combinent le texte avec l&rsquo;audio et la vid\u00e9o.<\/p>\n<p>Pour l&rsquo;IA sur les smartphones, l&rsquo;accent a \u00e9t\u00e9 mis sur la r\u00e9duction de la taille des LLM en raison des limites de m\u00e9moire, de performance et d&rsquo;\u00e9nergie, mais les r\u00e9sultats ont \u00e9t\u00e9 d\u00e9cevants. Cela a retard\u00e9 le d\u00e9veloppement de l&rsquo;IA edge, a d\u00e9clar\u00e9 M. Ilkbahar. Mais un LLM plus avanc\u00e9, ou bas\u00e9 sur des mod\u00e8les de m\u00e9lange d&rsquo;experts, pourrait avoir 64 milliards de param\u00e8tres avec des poids de 8 bits n\u00e9cessitant 64 gigaoctets de m\u00e9moire. \u00ab\u00a0Une seule puce HBF pourrait contenir le mod\u00e8le\u00a0\u00bb, a d\u00e9clar\u00e9 M. Ilkbahar.<\/p>\n<p>Ilkbahar a admis que le HBF ne pouvait pas remplacer le HBM, mais il a d\u00e9clar\u00e9 que Sandisk avait d\u00e9cid\u00e9 de mettre en place une interface standard ouverte bas\u00e9e sur la m\u00eame interface \u00e9lectrique avec un minimum de changements de protocole. \u00c0 cette fin, Sandisk est en train de former un comit\u00e9 consultatif technique compos\u00e9 de personnalit\u00e9s de l&rsquo;industrie et de repr\u00e9sentants d&rsquo;entreprises partenaires.<\/p>\n<p>Ilkbahar n&rsquo;a pas r\u00e9v\u00e9l\u00e9 les noms des partenaires ni fourni de calendrier pour l&rsquo;introduction du HBF. Il a toutefois pr\u00e9sent\u00e9 une feuille de route montrant un doublement de la capacit\u00e9 et de la largeur de bande de lecture, ainsi qu&rsquo;une am\u00e9lioration de l&rsquo;efficacit\u00e9 \u00e9nerg\u00e9tique de 36 % par rapport \u00e0 la premi\u00e8re g\u00e9n\u00e9ration de HBF.<\/p>\n<h4>Liens et articles connexes :<\/h4>\n<p><a href=\"https:\/\/www.sandisk.com\">www.sandisk.com<\/a><\/p>\n<h4>Articles de presse :<\/h4>\n<p><a href=\"https:\/\/www.eenewseurope.com\/en\/sandisk-to-pursue-emerging-memory-technology-after-split\/\">Sandisk poursuivra ses activit\u00e9s dans le domaine des technologies de m\u00e9moire \u00e9mergentes apr\u00e8s sa scission<\/a><\/p>\n<p><a href=\"https:\/\/www.eenewseurope.com\/en\/intels-optane-memory-business-lost-more-than-500-million-in-2020\/\">Les activit\u00e9s d&rsquo;Intel dans le domaine des m\u00e9moires Optane ont perdu plus de 500 millions de dollars en 2020 <\/a><\/p>\n<p><a href=\"https:\/\/www.eenewseurope.com\/en\/3d-flash-memory-hits-4-8-gb-s-nand-interface-speed\/\">La m\u00e9moire flash 3D atteint une vitesse d&rsquo;interface NAND de 4,8 Gbit\/s<\/a><\/p>\n<p><a href=\"https:\/\/www.eenewseurope.com\/en\/startup-neo-says-its-3d-dram-offers-8x-capacity\/\">La startup Neo affirme que sa DRAM 3D offre une capacit\u00e9 2D multipli\u00e9e par 8<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Sandisk Corp. poursuit une innovation dans le domaine de la m\u00e9moire flash 3D-NAND qui, selon l&rsquo;entreprise, pourrait remplacer la m\u00e9moire HBM (m\u00e9moire \u00e0 large bande passante) bas\u00e9e sur la DRAM pour les applications d&rsquo;inf\u00e9rence de l&rsquo;IA. Lorsque Sandisk a \u00e9t\u00e9 s\u00e9par\u00e9e de la soci\u00e9t\u00e9 de stockage de donn\u00e9es Western Digital en f\u00e9vrier 2025, l&rsquo;entreprise a [&hellip;]<\/p>\n","protected":false},"author":40,"featured_media":478216,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[883],"tags":[3679,9593,9595,5945],"domains":[47],"ppma_author":[3631,6199],"class_list":["post-478250","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-technologies","tag-ai-fr","tag-bics-flash-3d-fr","tag-hbf","tag-hbm-fr","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Sandisk propose la m\u00e9moire HBF pour remplacer la HBM ...<\/title>\n<meta name=\"description\" content=\"Sandisk Corp. poursuit une innovation dans le domaine de la m\u00e9moire flash 3D-NAND qui pourrait remplacer la m\u00e9moire HBM l&#039;IA.\" \/>\n<meta name=\"robots\" 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